3D System Integration Technologies

2003 ◽  
Vol 766 ◽  
Author(s):  
Peter Ramm ◽  
Armin Klumpp ◽  
Reinhard Merkel ◽  
Josef Weber ◽  
Robert Wieland ◽  
...  
Keyword(s):  
System Integration ◽  
Low Cost ◽  
Multichip Modules ◽  
Wafer Level ◽  
Chip Area ◽  
Flip Chips ◽  
Passive Devices ◽  
Increasing Demand ◽  
And Performance ◽  
Reduced Power Consumption

AbstractIn the last years strong efforts were made to miniaturize microelectronic systems. Chip scale packages, flip chips and multichip modules are now commonly used in a great variety of products (e. g. mobile phones, hand-held computers and chip cards). Future microelectronic applications require significantly more complex devices with increased functionality and performance. Due to added device content, chip area will also increase. Performance, multi-functionality and reliability of microelectronic systems will be limited mainly by the wiring between the subsystems (so called “wiring crisis”), causing a critical performance bottleneck for future IC generations. 3D System Integration provides a base to overcome these drawbacks. Furthermore, systems with minimum volume and weight as well as reduced power consumption can be realized for portable applications. 3D integrated systems show reduced chip areas and enable optimized partitioning, both which decrease the fabrication cost of the system. An additional benefit is the enabling of minimal interconnection lengths and the elimination of speed-limiting inter-chip interconnects. 3D concepts which take advantage of wafer level processing to avoid increasing package sizes and expensive single component assembling processes have the potential to integrate passive devices resistors, inductors and capacitors into the manufacturing system and provide full advantage for system performance.The ITRS roadmap predicts an increasing demand for systems-on-a-chip (SoC) [1]. Conventional fabrication is based on embedded technologies which are cost intensive. A new low cost fabrication approach for vertical system integration is introduced. The wafer-level 3D SoC technology, optimized to the capability for chip-to-wafer stacking has the potential to replace embedded technologies based on monolithic integration.

Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001378-001407
Author(s):  
Tim Mobley ◽  
Roupen Keusseyan ◽  
Tim LeClair ◽  
Konstantin Yamnitskiy ◽  
Regi Nocon
Keyword(s):  
Low Cost ◽  
Glass Wafer ◽  
Wafer Level ◽  
Packaging System ◽  
Thin Glass ◽  
Wafer Level Packaging ◽  
Recent Developments ◽  
And Performance ◽  
New Generation ◽  
Semiconductor Packaging

Recent developments in hole formations in glass, metalizations in the holes, and glass to glass sealing are enabling a new generation of designs to achieve higher performance while leveraging a wafer level packaging approach for low cost packaging solutions. The need for optical transparency, smoother surfaces, hermetic vias, and a reliable platform for multiple semiconductors is growing in the areas of MEMS, Biometric Sensors, Medical, Life Sciences, and Micro Display packaging. This paper will discuss the types of glass suitable for packaging needs, hole creation methods and key specifications required for through glass vias (TGV's). Creating redistribution layers (RDL) or circuit layers on both sides of large thin glass wafer poses several challenges, which this paper will discuss, as well as, performance and reliability of the circuit layers on TGV wafers or substrates. Additionally, there are glass-to-glass welding techniques that can be utilized in conjunction with TGV wafers with RDL, which provide ambient glass-to-glass attachments of lids and standoffs, which do not outgas during thermal cycle and allow the semiconductor devices to be attached first without having to reflow at lower temperatures. Fabrication challenges, reliability testing results, and performance of this semiconductor packaging system will be discussed in this paper.

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

A 3‐dB Quadrature WLP Coupler for 60 GHz Applications

2012 ◽  
Vol 1427 ◽  
Author(s):  
Hamid Kiumarsi ◽  
Hiroyuki Ito ◽  
Noboru Ishihara ◽  
Kenichi Okada ◽  
Yusuke Uemichi ◽  
...  
Keyword(s):  
Insertion Loss ◽  
High Performance ◽  
Low Cost ◽  
Phase Error ◽  
Superior Performance ◽  
60 Ghz ◽  
Wafer Level ◽  
Chip Area ◽  
Wafer Level Packaging ◽  
Coupled Lines

ABSTRACTA 60 GHz tandem coupler using offset broadside coupled lines is proposed in a WLP (Wafer Level Packaging) technology. The fabricated coupler has a core chip area of 750 μm × 385 μm (0.288 mm2). The measured results show an insertion loss of 0.44 dB, an amplitude imbalance of 0.03 dB and a phase difference of 87.6° at 60 GHz. Also the measurement shows an insertion loss of less than 0.67 dB, an amplitude imbalance of less than 0.31 dB, a phase error of less than 3.7°, an isolation of more than 29.7 dB and a return loss of more than 27.9 dB at the input ant coupled ports and more than 14.3 dB at the direct and isolated ports over the frequency band of 57-66 GHz, covering 60 GHz band both in Japan and US. To the best of our knowledge the proposed coupler achieves the lowest ever reported insertion loss and amplitude imbalance for a 3-dB coupler on a silicon substrate. With its superior performance and lower cost compared to the CMOS counterparts, the proposed coupler is a suitable candidate for low-cost high-performance millimeter-wave systems.

Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer

2016 ◽  
Vol 2016 (1) ◽  
pp. 000410-000414 ◽  
Author(s):  
Amit Kelkar ◽  
Vivek Sridharan ◽  
Khanh Tran ◽  
Kiyoko Ikeuchi ◽  
Anu Srivastava ◽  
...  
Keyword(s):  
Low Cost ◽  
Temperature Cycling ◽  
Wafer Level ◽  
Molding Process ◽  
Good Reliability ◽  
Molding Compound ◽  
Increasing Demand ◽  
Materials Used ◽  
Wafer Level Package ◽  
Levels Of Integration

Abstract The ever increasing demand for high levels of integration and miniaturization has created new transistor nodes, shrunk redistribution line width/space, and driven a reduction in solder bump pitch. This has created the need for Fan-out packaging. This paper presents a novel Fan-out Wafer level package which does not require use of molding process or materials used typically in such packages. In this technique, silicon is used as the carrier material instead of molding compound. Advantages of silicon include good reliability, high thermal stability, and low cost. This novel Mold-free Fan-out package passes standard reliability tests including temperature cycling (TCT), Drop test (DT), and Convection reflow.

Assessment of Optimized Process Quality and Reliability for Wafer Level Applications

2016 ◽  
Vol 2016 (S2) ◽  
pp. S1-S52 ◽  
Author(s):  
Ennis Ogawa ◽  
Aimin Xing ◽  
David F.-S. Liao ◽  
Ten V. Y. Ten ◽  
Chong Wei Neo ◽  
...  
Keyword(s):  
System Integration ◽  
Large Scale ◽  
Low Cost ◽  
Scale Production ◽  
Wafer Level ◽  
Single Defect ◽  
Large Scale Production ◽  
Quality And Reliability ◽  
Edge Delamination ◽  
The Cost

Fanout Wafer Level Packaging (FoWLP) is a very attractive solution for microelectronics applications requiring optimized performance, smaller form factor, and low cost. By utilizing such an approach where system integration is done to multiple chips on a single package frame, the need to ensure much higher levels of process integrity, quality, and reliability becomes absolutely critical, especially if the total product volume lies in the range of tens of millions of units. A single defect type may negate the benefits of such an approach because the cost of losing one FoWLP unit results in the loss of multiple devices. Thus, yield, quality, and reliability optimization using such a package solution is critical for successful large scale manufacturing. In this talk, the issue of defectivity and its impact on quality and reliability on Wafer-Level (WL) devices with regards to the issue of Die Edge Delamination (DED) and Chip Mechanical Integrity (CMI) is discussed. Through this discussion and the resulting solutions found to improve WL quality and reliability, better understanding on how to assess the quality and reliability of a given FoWLP solution for large scale production will be demonstrated.

A Middle-Ranking Cadre of Universities Evaluation Management Information System Based on SOA

2013 ◽  
Vol 462-463 ◽  
pp. 1068-1071
Author(s):  
Zhi Biao Li ◽  
Guo Lin Nie ◽  
Qun Zheng ◽  
Hong Liu ◽  
Chun Hua Liao
Keyword(s):  
Information System ◽  
Software Reuse ◽  
Management Information System ◽  
System Integration ◽  
Low Cost ◽  
Management Information ◽  
Loosely Coupled ◽  
Independent Information ◽  
And Performance ◽  
Set Up

In order to meet various needs and realize software reuse, a middle-ranking cadre of universities evaluation management information system (MCE-MIS) based on SOA is proposed. It is a loosely coupled, protocol independent information system integrating existing information systems such as Personnel and Performance MIS. After analyzing the requirement of the system, the cadre evaluation flowchart, use case and system integration solution are described in detail. SOA provides a solution to set up low-cost, open and flexible integration system in universities.

Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

2013 ◽  
Vol 5 (1) ◽  
pp. 25-34 ◽  
Author(s):  
J. Böck ◽  
M. Wojnowski ◽  
C. Wagner ◽  
H. Knapp ◽  
W. Hartner ◽  
...  
Keyword(s):  
System Integration ◽  
Low Cost ◽  
Wafer Level ◽  
Automotive Radar ◽  
Package Design ◽  
Radar Sensors ◽  
Radar Systems ◽  
Plastic Package ◽  
Rf Performance ◽  
Near Future

Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76–81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality targets. A 77 GHz radar chip set in eWLB package is developed, which can be applied on the system board using standard solder reflow assembly. These radar MMICs provide excellent radio frequency (RF) performance for the next generation automotive radar sensors. The potential for even higher system integration is shown by a radar transceiver with antennas integrated in the eWLB package. These results demonstrate that eWLB technology is an attractive candidate to realize low-cost radar systems and to enable radar safety affordable for everyone in the near future.

Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001507-001526 ◽  
Author(s):  
Seung Wook Yoon ◽  
Yaojian Lin ◽  
Yonggang Jin ◽  
Jerome Teysseyre ◽  
Xavier Baraton ◽  
...  
Keyword(s):  
Low Cost ◽  
Standard Test ◽  
Structural Defects ◽  
Special Focus ◽  
Next Generation ◽  
Wafer Level ◽  
Process Technology ◽  
Component Level ◽  
Chip Area ◽  
Board Level

Current and future demands of mobile/portable electronic systems in terms of performance, power consumption, reliable system at a reasonable price are met by developing advanced/appropriate silicon process technology, innovative packaging solutions with use of chip-package-system co-design, low cost materials, advanced assembly and reliable interconnect technologies. In this article packaging evolution for hand held application is discussed with special focus on next generation chip embedding technology called eWLB in detail. To meet the above said challenges eWLB was developed which offers additional space for routing higher I/O chips on top of Silicon chip area which is not possible in conventional WLP or WLB. It also offers comparatively better electrical, thermal and reliability performance at reduced cost with possibility to address more Moore [decreasing technology nodes with low-k dielectrics in SoC] and more than Moore [heterogeneous integration of chips with different wafer technology as SiP solution in multi die or 3D eWLB approaches]. Currently 1st generation eWLB technology is available in the industry with 200mm and 300mm carrier size. This paper will highlight some of the recent advancements in progress development and mechnical characterization in component level and board level reliaiblity of next generation eWLB technologies of double-side 3D eWLB. Standard JEDEC tests were carried out to investigate component level reliability and both destructive/non-destructive analysis was performed to investigate potential structural defects. Daisychain Test vehicles were prepared and also tested for drop and TcoB (Temperature on Board) reliaiblity in industry standard test conditions. There was significant improvement of characteristic lifetime with thined eWLB in TcoB performance because of its enhanced flexibility of package. And there was study of board level reliabiilty with underfill in SMT for large size eWLB packages. This paper will also present study of package warpage behavior with temperature profile as well as failure analysis with microsturctural observation for comprehensive understanding of mechanical behavior of next generation eWLBs.

Engine Cycle Selection and Propulsion System Integration for Future High Performance Fighter Aircraft

1977 ◽  
Author(s):  
G. W. Lind ◽  
J. Protopapas
Keyword(s):  
System Integration ◽  
High Performance ◽  
Low Cost ◽  
Propulsion System ◽  
Fighter Aircraft ◽  
Performance Constraints ◽  
Design Variables ◽  
And Performance ◽  
Time Required ◽  
Engine Cycle

The selection and optimization of propulsion systems can be a costly and time-consuming process, especially when there are diverse performance requirements placed on the overall weapon system. Computerized procedures have been developed within the Grumman Propulsion Department to mechanize this capability and yet maintain the man-m-the-loop for full visibility during the evaluation of a candidate design concept. The system permits low cost, rapid, multidiscipline. interactive engine cycle selection and propulsion system integration to be effectively performed early in the preliminary design process of a high performance fighter aircraft. For example, the computer running time required to select a point design within a matrix of design variables and performance constraints has been reduced by 85 percent over previous techniques. This paper describes these propulsion evaluation procedures and cites a specific example of their application to the analysis of an advanced interceptor requirement.

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