Brittle to Ductile Transition in Intermetallic Alloys

2002 ◽  
Vol 753 ◽  
Author(s):  
Jeffrey W. Kysar

ABSTRACTTwo distinct approaches are commonly invoked to explain the brittle to ductile transition of a material in the presence of a crack. In one approach, dislocation mobility plays the key role. In the other approach, the competition between crack tip dislocation nucleation and cleavage failure plays the key role. The two approaches are reconciled in the present study.

1998 ◽  
Vol 539 ◽  
Author(s):  
R. H. Folk ◽  
M. Khantha ◽  
D. P. Pope ◽  
V. Vitek

AbstractAn investigation of the brittle-to-ductile transition (BDT) in silicon has been conducted on essentially dislocation-free silicon test specimens made by photolithography. No pre-cracks or additional dislocation sources were introduced into the samples. Three-point bending tests of the samples reveals a well defined transition from brittle fracture of the specimens to complete yielding near 732°C at a crosshead displacement rate of 0.1 mm/min. Limited plasticity is observed below 732°C but is insufficient to prevent crack propagation suggesting that yielding is not dislocation mobility limited. Instead the transition may be controlled by the nucleation of a sufficient density of dislocations. Further support comes from the results of experiments conducted at temperatures below 732°C in which samples were rapidly pre-loaded within the linearly elastic regime, then immediately retested. This rapid pre-loading results in a lower transition temperature. This would not be expected if dislocation mobility controlled the BDT. Instead, it is believed that the transition only occurs when a sufficient density of dislocations has nucleated within the sample. In these experiments, the pre-loading event may increase the dislocation nucleation rate. The source of the dislocations in these defect free samples is still under investigation.


Author(s):  
R. Haswell ◽  
U. Bangert ◽  
P. Charsley

A knowledge of the behaviour of dislocations in semiconducting materials is essential to the understanding of devices which use them . This work is concerned with dislocations in alloys related to the semiconductor GaAs . Previous work on GaAs has shown that microtwinning occurs on one of the <110> rosette arms after indentation in preference to the other . We have shown that the effect of replacing some of the Ga atoms by Al results in microtwinning in both of the rosette arms.In the work to be reported dislocations in specimens of different compositions of Gax Al(1-x) As and Gax In(1-x) As have been studied by using micro indentation on a (001) face at room temperature . A range of electron microscope techniques have been used to investigate the type of dislocations and stacking faults/microtwins in the rosette arms , which are parallel to the [110] and [10] , as a function of composition for both alloys . Under certain conditions microtwinning occurs in both directions . This will be discussed in terms of the dislocation mobility.


2008 ◽  
Vol 22 (31n32) ◽  
pp. 5477-5482 ◽  
Author(s):  
ATSUMICHI KUSHIBE ◽  
TSUTOMU TANAKA ◽  
YORINOBU TAKIGAWA ◽  
KENJI HIGASHI

The crack propagation properties for ultrafine-grained Zn -22 wt % Al alloy during low cycle fatigue (LCF) in the superplastic region and the non-superplastic region were investigated and compared with the corresponding results for several other materials. With the Zn - 22 wt % Al alloy, it was possible to conduct LCF tests even at high strain amplitudes of more than ±5%, and the alloy appeared to exhibit a longer LCF lifetime than the other materials examined. The fatigue life is higher in the superplastic region than in the non-superplastic region. The rate of fatigue crack propagation in the superplastic region is lower than that in the other materials in the high J-integral range. In addition, the formation of cavities and crack branching were observed around a crack tip in the supereplastic region. We therefore conclude that the formation of cavities and secondary cracks as a result of the relaxation of stress concentration around the crack tip results in a reduction in the rate of fatigue crack propagation and results in a longer fatigue lifetime.


2006 ◽  
Vol 21 (10) ◽  
pp. 2542-2549 ◽  
Author(s):  
Li-Xia Cao ◽  
Chong-Yu Wang

The molecular dynamics method has been used to simulate mode I cracking in body-centered-cubic iron. Close attention has been paid to the process of the atomic configuration evolution of the cracks. The simulation shows that at low temperatures, partial dislocations are emitted before the initiation of crack propagation, subsequently forming the stacking faults or multilayer twins on {112} planes, and then brittle cleavage and extended dislocation nucleation are observed at the crack tip accompanied by twin extension. These results are in agreement with the experimental observation that twinning and fracture processes cooperate at low temperatures. Furthermore, an energetics analysis has been made on the deformation behavior observed at the crack tip. The effect of temperature on the fracture process is discussed. At the higher temperature, plastic deformation becomes easier, and crack blunting occurs. With increasing temperature, the fracture resistance increases, and the effect of the lattice trapping can be weakened by thermal activation.


Materials ◽  
2020 ◽  
Vol 13 (10) ◽  
pp. 2238
Author(s):  
Jaber Rezaei Mianroodi ◽  
Bob Svendsen

The interplay of interface and bulk dislocation nucleation and glide in determining the motion of twin boundaries, slip-twin interaction, and the mechanical (i.e., stress-strain) behavior of fcc metals is investigated in the current work with the help of molecular dynamics simulations. To this end, simulation cells containing twin boundaries are subject to loading in different directions relative to the twin boundary orientation. In particular, shear loading of the twin boundary results in significantly different behavior than in the other loading cases, and in particular to jerky stress flow. For example, twin boundary shear loading along ⟨ 112 ⟩ results in translational normal twin boundary motion, twinning or detwinning, and net hardening. On the other hand, such loading along ⟨ 110 ⟩ results in oscillatory normal twin boundary motion and no hardening. As shown here, this difference results from the different effect each type of loading has on lattice stacking order perpendicular to the twin boundary, and so on interface partial dislocation nucleation. In both cases, however, the observed stress fluctuation and “jerky flow” is due to fast partial dislocation nucleation and glide on the twin boundary. This is supported by the determination of the velocity and energy barriers to glide for twin boundary partials. In particular, twin boundary partial edge dislocations are significantly faster than corresponding screws as well as their bulk counterparts. In the last part of the work, the effect of variable twin boundary orientation in relation to the loading direction is investigated. In particular, a change away from pure normal loading to the twin plane toward mixed shear-normal loading results in a transition of dominant deformation mechanism from bulk dislocation nucleation/slip, to twin boundary motion.


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