Influence of Environment on Excimer Laser Irradiation of Metals

1986 ◽  
Vol 74 ◽  
Author(s):  
Julian P. Partridge ◽  
Joseph Pellegrino ◽  
Craig Murphy ◽  
Peter R. Strutt
Keyword(s):  
Excimer Laser ◽  
Dense Plasma ◽  
Laser Pulses ◽  
Plasma Pressure ◽  
Pressure Fields ◽  
Wave Patterns ◽  
Excimer Laser Irradiation ◽  
Krf Excimer Laser ◽  
Rapidly Solidified ◽  
Good Agreement

AbstractIrradiation of metals in gaseous and liquid nitrogen by KrF excimer laser pulses shows the way in which vapor or plasma pressure fields determine the nature of the rapidly solidified surface topography. Wave patterns formed on aluminum by irradiation in N2 gas arise from recoil pressure differences produced by highly localised differential surface evaporation. The solidification time, calculated from the observed ripple wavelength, is in good agreement with that deduced from a heat flow calculation. For irradiation in liquid N2, the homogeneous pressure within the center of the dense plasma zone results in a smooth surface. Beyond this region the progressively diminishing pressure induces surface ripples, fragmentation and droplet formation. Intriguingly, immersion of Ni, Ti, Zn, and Al in liquid N2 (to a depth of 2 to 4 mm) considerably increases the area and depth of irradiation-modified regions.

scholarly journals Orderly Perforation of Polyester Films by Excimer Laser

2015 ◽  
Author(s):  
Wenqi Li ◽  
Erol Sancaktar
Keyword(s):  
Excimer Laser ◽  
Laser Energy ◽  
Laser Pulses ◽  
High Laser Fluence ◽  
High Laser ◽  
Area Increase ◽  
Excimer Laser Irradiation ◽  
Krf Excimer Laser ◽  
Different Thickness ◽  
Pet Films

The effects of 248 nm KrF excimer laser irradiation on combinations of different thickness PET films and different stainless steel mask mesh opening sizes were considered as a possible method to achieve different size perforations on different thickness PET films, in order to provide an effective and controllable perforation technology. Therefore, ablation behavior of PET films has been investigated for different laser energy fluence and number of laser pulses. Morphology of irradiated samples was observed by optical microscopy, and atomic forced microscopy to study topography and microstructures after laser ablation. An attempt has been made of correlate these findings with the orientation, strength and mechanical properties of the polymer. The experimental results reveal that the percentage of perforation and the average perforated area increase with increasing number of pulses for all film thicknesses. The affected area, defined as the perforated area plus the heat affected zone (a black-char-region around the perforated area) decrease with increasing number of pulses. Due to the heat conducted from the steel mash wire, especially at cell corners, the perforation process seems to start initially at the cell corners. High laser fluence seems to lead to surface depressions due to thermal shock and surface stress waves along the process directions confirmed by tensile testing and x-ray analyses. The presence and the geometry of surface depressions were confirmed by atomic forced microscopy.

Surface hardening of SUS304 by irradiation with a KrF excimer laser in SiH4 gas ambient

1990 ◽  
Vol 5 (2) ◽  
pp. 265-270 ◽  
Author(s):  
Koji Sugioka ◽  
Hideo Tashiro ◽  
Koichi Toyoda ◽  
Eiichi Tamura ◽  
Keigo Nagasaka
Keyword(s):  
Excimer Laser ◽  
Surface Hardening ◽  
Continuous Distribution ◽  
Surface Hardness ◽  
Laser Pulses ◽  
High Concentration ◽  
Laser Fluences ◽  
High Adhesion ◽  
Krf Excimer Laser ◽  
Si Films

Surface hardening of SUS304 resulting from the process of doping and deposition of Si by irradiation of a KrF excimer laser beam in a SiH4 gas ambient is investigated, and variations of the surface hardness are examined for different numbers of laser pulses and the laser fluences. The hardening is due to Si incorporation in high concentration. The continuous distribution of Si atoms across the surface layer suggests that a very high adhesion strength of the deposited Si films can be formed. The specific process for surface modification is referred to as laser implant-deposition (LID).

Etch Performance of KRF Excimer Laser Micromachining Characterization on Silicon Material

2015 ◽  
Vol 780 ◽  
pp. 29-32 ◽  
Author(s):  
M.Z. Zainol ◽  
Yufridin Wahab ◽  
H. Fazmir ◽  
A.F.M. Anuar ◽  
S. Johari ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Etch Rate ◽  
Three Dimensional ◽  
Laser Pulses ◽  
Laser Micromachining ◽  
Rate Change ◽  
Performance Parameters ◽  
Laser Parameters ◽  
Characterization Study ◽  
Krf Excimer Laser

Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures.The objective of this study is to investigate the relation between the number of laser pulses, number of laser passes through the channel of ablation site and their etch performance. Parameters such as frequency, fluence and velocity were retained as constants. In this paper, we present a parametric characterization study on silicon using KrF excimer laser micromachining. From the result, the etch rate change were recorded as the two major laser parameters (Number of laser pulses and number of laser passes) were varied. Both parameters were showing declination profile however from comparing both graphs, it showed that etch rate dropped more steeply when varied number of laser passes rather than number of pulses.

scholarly journals Formation of Varistor Layer at the Surface of SrTiO3-Based Ceramics by KrF Excimer Laser Irradiation.

1999 ◽  
Vol 107 (1252) ◽  
pp. 1229-1231 ◽  
Author(s):  
Jong-Won YOON ◽  
Katsuki HIGAKI ◽  
Masaru MIYAYAMA ◽  
Tetsuichi KUDO
Keyword(s):  
Laser Irradiation ◽  
Excimer Laser ◽  
Excimer Laser Irradiation ◽  
Krf Excimer Laser

Efficient keV x‐ray emission from plasmas generated with 4 ps KrF excimer laser pulses

1993 ◽  
Vol 63 (22) ◽  
pp. 3046-3048 ◽  
Author(s):  
I. C. E. Turcu ◽  
I. N. Ross ◽  
G. J. Tallents
Keyword(s):  
Excimer Laser ◽  
Laser Pulses ◽  
X Ray ◽  
Krf Excimer Laser

Improvement of resistance to corrosion of stainless steel 304 in acid solutions by simultaneous deposition with doping of Si using KrF excimer laser

1990 ◽  
Vol 5 (12) ◽  
pp. 2835-2840 ◽  
Author(s):  
Koji Sugioka ◽  
Hideo Tashiro ◽  
Koichi Toyoda ◽  
Hideyuki Murakami ◽  
Hiroshi Takai
Keyword(s):  
Stainless Steel ◽  
Laser Irradiation ◽  
Excimer Laser ◽  
Polarization Resistance ◽  
Cathodic Polarization ◽  
Acid Solutions ◽  
Stainless Steel 304 ◽  
Quantitative Verification ◽  
Excimer Laser Irradiation ◽  
Krf Excimer Laser

The chemical stability of the surface of stainless steel (SUS) 304 in acid immersion tests is greatly improved by the laser implant-deposition (LID) process, i.e., the simultaneous deposition and incorporation of silicon by KrF excimer laser irradiation. The etching depths of the treated samples in 1.32 N HCl solution are substantially zero at the laser irradiation conditions of more than 40 pulses and of more than 400 mJ/cm2 at the surface. By the quantitative verification of cathodic polarization in 1 N H2SO4, the highest polarization resistance is estimated to be 26.7 times that of the nontreated sample.

Poly-Resistor Thin Film Formation by Excimer Laser Micromachine

2015 ◽  
Vol 780 ◽  
pp. 17-21
Author(s):  
A.F.M. Anuar ◽  
Yufridin Wahab ◽  
M.Z. Zainol ◽  
H. Fazmir ◽  
M. Najmi ◽  
...  
Keyword(s):  
Thin Film ◽  
Excimer Laser ◽  
Laser Energy ◽  
Film Formation ◽  
Chemical Vapor ◽  
Laser Pulses ◽  
Beam Size ◽  
Silicon Thin Film ◽  
Pressure Chemical ◽  
Krf Excimer Laser

A simple theoretical model and resistor fabrication for calculating the resistance of a polycrystalline silicon thin film is presented. The resistance value for poly-resistor is perfomed in terms of polysilicon thickness and its total area. The KrF excimer laser micromachine is used in assisting the resistor formation for a low pressure chemical vapor deposition (LPCVD) based polysilicon. Laser micromachine with three main parameters is used to aid the fabrication of the poly-resistor; namely as the pulse rate (i.e. number of laser pulses per second), laser beam size and laser energy. These parameters have been investigated to create the isolation between materials and also to achieve the desired poly-resistor shape. Preliminary results show that the 35 um beam size and 15 mJ of energy level is the most effective parameter to produce the pattern. Poly-resistor formation with 12 and 21 number of squares shows the total average resistance of 303.52 Ω and 210.14 Ω respectively. The laser micromachine process also significantly reduce the total time and number of process steps that are required for resistor fabrication.

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