Low Temperature Epitaxial Growth of ZnO Layer on Sapphire by Plasma-Assisted Epitaxy

2001 ◽  
Vol 680 ◽  
Author(s):  
Satoshi Yamauchi ◽  
Takashi Hariu
Keyword(s):  
Low Temperature ◽  
Growth Condition ◽  
Free Exciton ◽  
High Growth ◽  
High Growth Rate ◽  
Layer Growth ◽  
Crystal Nucleation ◽  
Initial Layer ◽  
Direct Growth ◽  
Zno Crystal

ABSTRACTZnO layer was epitaxially grown with a high growth rate around 800nm/hour on C-sapphire at relatively low temperature 400°C by plasma-assisted epitaxy in oxygen plasma which was excited by radio- frequency power at 13.56MHz. Photoluminescence spectra, which were dominated by strong donor-bound exciton emissions and free-exciton emissions at 10K, indicated deep levels native-defects were well prevented in the layers grown by the optimized growth condition including the power to discharge oxygen gas. Initial layers grown at very low temperature increased the probability of ZnO-crystal nucleation, compared with the direct growth on the sapphire, and were very effective in decreasing surface roughness and then improving the crystal quality of the successively grown ZnO layers. The full-width at half-maximum of donor-bound exciton emission was dependent on the initial layer growth condition and the narrowest value of the FWHM was obtained as 1.7meV on PAE-layers deposited at 400°C on the initial layer grown at 150°C.

scholarly journals High growth rate hydride vapor phase epitaxy at low temperature through use of uncracked hydrides

2018 ◽  
Vol 112 (4) ◽  
pp. 042101 ◽  
Author(s):  
Kevin L. Schulte ◽  
Anna Braun ◽  
John Simon ◽  
Aaron J. Ptak
Keyword(s):  
Growth Rate ◽  
Low Temperature ◽  
Vapor Phase ◽  
High Growth ◽  
High Growth Rate ◽  
Vapor Phase Epitaxy ◽  
Hydride Vapor Phase Epitaxy

Development of a High Rate 4H-SiC Epitaxial Growth Technique Achieving Large-Area Uniformity

2008 ◽  
Vol 600-603 ◽  
pp. 111-114 ◽  
Author(s):  
Masahiko Ito ◽  
L. Storasta ◽  
Hidekazu Tsuchida
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
Free Exciton ◽  
High Growth ◽  
Maximum Growth ◽  
High Growth Rate ◽  
Maximum Growth Rate ◽  
High Rate ◽  
Intrinsic Defect ◽  
Large Area

A vertical hot-wall type epi-reactor that makes it possible to simultaneously achieve both a high rate of epitaxial growth and large-area uniformity at the same time has been developed. A maximum growth rate of 250 µm/h is achieved at 1650 °C. Thickness uniformity of 1.1 % and doping uniformity of 6.7 % for a 65 mm radius area are achieved while maintaining a high growth rate of 79 µm/h. We also succeeded in growing a 280 µm-thick epilayer with excellent surface morphology and long carrier lifetime of ~1 µs on average. The LTPL spectrum shows free exciton peaks as dominant, and few impurity-related or intrinsic defect related peaks are observed. The DLTS measurement for an epilayer grown at 80 µm/h shows low trap concentrations of 1.2×1012 cm-3 for Z1/2 center and 6.3×1011 cm-3 for EH6/7 center, respectively.

SiC-4H Epitaxial Layer Growth by Trichlorosilane (TCS) as Silicon Precursor at Very High Growth Rate

2008 ◽  
Vol 600-603 ◽  
pp. 123-126 ◽  
Author(s):  
Francesco La Via ◽  
Gaetano Izzo ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Condorelli ◽  
...  
Keyword(s):  
Growth Rate ◽  
Epitaxial Layer ◽  
Structural Characterization ◽  
Defect Density ◽  
Schottky Diodes ◽  
High Growth ◽  
High Growth Rate ◽  
Layer Growth ◽  
Characterization Methods ◽  
Very High

The growth rate of 4H-SiC epi layers has been increased up to 100 µm/h with the use of trichlorosilane instead of silane as silicon precursor. The epitaxial layers grown with this process have been characterized by electrical, optical and structural characterization methods. Schottky diodes, manufactured on the epitaxial layer grown with trichlorosilane at 1600 °C, have higher yield and lower defect density in comparison to diodes realized on epilayers grown with the standard epitaxial process.

scholarly journals Effects of MOVPE Growth Conditions on GaN Layers Doped with Germanium

2020 ◽  
Author(s):  
Dario Schiavon ◽  
Elżbieta Litwin-Staszewska ◽  
Rafał Jakieła ◽  
Szymon Grzanka ◽  
Piotr Perlin
Keyword(s):  
Growth Rate ◽  
High Temperature ◽  
Low Temperature ◽  
Surface Morphology ◽  
Growth Temperature ◽  
High Growth ◽  
Growth Conditions ◽  
High Growth Rate ◽  
Pit Formation ◽  
Movpe Growth

The effect of growth temperature and precursor flows on the doping level and surface morphology of Ge-doped GaN layers was researched. The results show that germanium is more readily incorporated at low temperature, high growth rate and high V/III ratio, thus revealing a similar behavior to what was previously observed for indium. V-pit formation can be blocked at high temperature but also at low V/III ratio, the latter of which however causing step bunching.

Optimisation of Epitaxial Layer Growth with HCl Addition by Optical and Electrical Characterization

2007 ◽  
Vol 556-557 ◽  
pp. 137-140 ◽  
Author(s):  
Lucia Calcagno ◽  
Gaetano Izzo ◽  
Grazia Litrico ◽  
G. Galvagno ◽  
A. Firrincieli ◽  
...  
Keyword(s):  
Epitaxial Layer ◽  
Growth Process ◽  
Electrical Characterization ◽  
High Growth ◽  
High Growth Rate ◽  
Layer Growth ◽  
Epitaxial Layers ◽  
Electrical Measurements ◽  
Deposition Chamber ◽  
Order Of Magnitude

High growth rate of 4H-SiC epitaxial layers can be reached with the introduction of HCl in the deposition chamber. The effect of the Cl/Si ratio on this epitaxial growth process has been studied by optical and electrical measurements. Optical microscopy shows an improvement of the surface morphology and luminescence measurements reveal a decrease of epitaxial layer defects with increasing the Cl/Si ratio in the range 0.05–2.0. The leakage current measured on the diodes realized on these wafers is reduced of an order of magnitude and DLTS measurements show a decrease of the EH6,7 level concentration in the same range of Cl/Si ratio. The value Cl/Si=2.0 allows to grow epitaxial layers with the lowest defect concentration.

Low-temperature, high-growth-rate ALD of SiO2 using aminodisilane precursor

2019 ◽  
Vol 485 ◽  
pp. 381-390 ◽  
Author(s):  
Taewook Nam ◽  
Hyunho Lee ◽  
Taejin Choi ◽  
Seunggi Seo ◽  
Chang Mo Yoon ◽  
...  
Keyword(s):  
Growth Rate ◽  
Low Temperature ◽  
High Growth ◽  
High Growth Rate

Low Trap Concentration and Low Basal-Plane Dislocation Density in 4H-SiC Epilayers Grown at High Growth Rate

2007 ◽  
Vol 556-557 ◽  
pp. 129-132 ◽  
Author(s):  
T. Hori ◽  
Katsunori Danno ◽  
Tsunenobu Kimoto
Keyword(s):  
Growth Rate ◽  
Dislocation Density ◽  
Basal Plane ◽  
Free Exciton ◽  
High Growth ◽  
High Growth Rate ◽  
Photoluminescence Spectra ◽  
Homoepitaxial Growth ◽  
Basal Plane Dislocation ◽  
Ratio Range

Fast homoepitaxial growth of 4H-SiC has been carried out on off-axis (0001) substrates by horizontal hot-wall CVD at 1600οC. High growth rate up to 24 μm/h has been achieved with mirror-like surface in the C/Si ratio range of 1.0-2.0. The Z1/2 and EH6/7 concentrations can be kept as low as 7 × 1011 cm-3 and 3 × 1011 cm-3, although an unknown trap (UT1) is observed with the concentration in the 1011 cm-3 range. The photoluminescence spectra are dominated by strong free exciton peaks, and the L1 peak is not observed. The basal-plane dislocation (BPD) density has decreased with increase in growth rate, and it can be reduced to 22 cm-2 when epilayers are grown on Chemical Mechanically Polished (CMP) substrates at a growth rate of 24 μm/h.

Homoepitaxial Growth of Crystalline Ge Films through a Liquid Metal Medium at Low Temperature

1990 ◽  
Vol 204 ◽  
Author(s):  
Fulin Xiong ◽  
Jene A. Golovehenko ◽  
Frans Spaepen
Keyword(s):  
Electron Microscopy ◽  
Low Temperature ◽  
Liquid Metal ◽  
Eutectic Point ◽  
High Growth ◽  
High Energy ◽  
High Growth Rate ◽  
Semiconductor Interface ◽  
Cross Sectional ◽  
Crystalline Films

ABSTRACTCrystalline films of Ge have been homoepitaxially grown through a liquid Au medium by the so-called vapor-liquid-solid (VLS) mechanism at relatively low temperature (400-450 °C). During the process, the Ge vapor is delivered by a molecular beam evaporator and the liquid phase in the system is formed at the interface by heating a Au metal film above its eutectic point with the semiconductor. This process has a potential of a high growth rate at low temperature. The growth process and the crystallinity of the films were monitored in situ by high energy ion backscattering and channeling. The surface morphology and quality of the films were examined by scanning electron microscopy and cross-sectional transmission electron microscopy. The experimental results are presented, together with a discussion of the growth mechanism and the nature of the liquid metal-semiconductor interface.

Low Temperature Deposition of Polycrystalline Silicon Thin Films Prepared by Hot Wire Cell Method

1998 ◽  
Vol 536 ◽  
Author(s):  
M. Ichikawa ◽  
J. Takeshita ◽  
A. Yamada ◽  
M. Konagai
Keyword(s):  
Low Temperature ◽  
Polycrystalline Silicon ◽  
High Growth ◽  
Columnar Structure ◽  
High Growth Rate ◽  
Silicon Films ◽  
Hot Wire ◽  
Cross Sectional ◽  
Cell Method ◽  
Polycrystalline Silicon Films

AbstractHot wire (HW) cell method has been newly developed and successfully applied to grow polycrystalline silicon films at a low temperature with a relatively high growth rate. In the HWcell method, silane is decomposed by reaction with a heated tungsten wire placed near the substrate. It is found that polycrystalline silicon films can be obtained at substrate temperatures of 175-400°C without hydrogen dilution. The film crystallinity is changed from polycrystalline to amorphous with decreasing the total pressure. The X-ray analysis clearly showed that the films grown at the filament temperature of 1700°C have a very strong (220) preferential orientation. The films consist of large grains as well as small grains, and it was found from cross-sectional SEM that the films have columnar structure. These results suggested that the HW-cell method would be a promising candidate to grow device-grade polycrystalline silicon films for photovoltaic application.

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