Synthesis and Characterization of α-Alumina Films Via Combustion Chemical Vapor Deposition

2000 ◽  
Vol 616 ◽  
Author(s):  
G. Grandinetti ◽  
S. Shanmugham ◽  
M.R. Hendrick ◽  
J.M. Hampikian

Abstractα-Alumina films are useful for high-temperature, wear, and semiconductor device applications because of their good oxidation resistance, high hardness values, and electrical properties. α-Alumina films have been previously synthesized using techniques such as chemical vapor deposition, sol-gel, physical vapor deposition, and plasma spraying. This paper presents an alternative approach for producing high quality dense α-alumina coatings using a flame-assisted process called combustion chemical vapor deposition (CCVD). This process is an open atmosphere technique that does not require the use of a reaction chamber. In this work alumina films were grown on YSZ at temperatures ranging from 900 to 1500°C. At lower temperatures only amorphous alumina was grown, but as the deposition temperature increased different alumina phases were formed. At 1100°C, a thin highly crystalline θ-Al2O3 coating was formed. At temperatures higher than 1100°C thick θ-Al2O3 coatings were deposited on the YSZ. Coatings were characterized by scanning electron microscopy (SEM) and x-ray diffraction (XRD).

Materials ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2640
Author(s):  
Michael Zinigrad ◽  
Konstantin Borodianskiy

Welding, joining, and coating of metallic materials are among the most applicable fabrication processes in modern metallurgy. Welding or joining is the manufacture of a metal one-body workpiece from several pieces. Coating is the process of production of metallic substrate with required properties of the surface. A long list of specific techniques is studied during schooling and applied in industry; several include resistant spot, laser or friction welding, micro arc oxidation (MAO), chemical vapor deposition (CVD), and physical vapor deposition (PVD), among others. This Special Issue presents 21 recent developments in the field of welding, joining, and coating of various metallic materials namely, Ti and Mg alloys, different types of steel, intermetallics, and shape memory alloys.


1993 ◽  
Vol 324 ◽  
Author(s):  
Bin Ni ◽  
Gene P. Reck ◽  
James W. Proscia

AbstractThe premixability of reagents used in chemical vapor deposition reactors is important to insure that gas feed lines and nozzles do not become clogged with particulates during operation. Even if reactants are to be kept separate until introduced into a reaction chamber, it is desirable to limit the number of particles formed. A reactor which utilizes laser light scattering to monitor particulate formation when gaseous reagents are mixed is described. The reaction of tin (IV) chloride with water is commonly used to produce tin oxide films by chemical vapor deposition. It was found by the light scattering experiment that at temperatures above about 110°C the number of particulates formed is greatly reduced. Therefore, it would be most desirable that these reagents be mixed above this temperature when depositing tin oxide from this reaction. The reaction of titanium tetrachloride with various amine was also investigated by this method. This reaction has been demonstrated to produce titanium nitride above 450°C. For each case, it was observed that there was a temperature above which the number of particulates was significantly reduced. This temperature was always below the optimal temperature for producing titanium nitride films.


2000 ◽  
Vol 648 ◽  
Author(s):  
M.P. Singh ◽  
S. Mukhopadhayay ◽  
Anjana Devi ◽  
S.A. Shivashankar

AbstractWe have studied the nucleation and growth of alumina by metalorganic chemical vapor deposition (MOCVD). The deposition of alumina films was carried out on Si(100) in a horizontal, hot-wall, low pressure chemical vapor deposition (CVD) reactor, using aluminum acetylacetonate{Al(acac)3}as the CVD precursor. We have investigated growth of alumina films as a function of different CVD parameters such as substrate temperature and total reactor pressure during film growth. Films were characterized by optical microscopy, X-ray diffractometry (XRD), scanning electron microscopy (SEM), cross-sectional SEM, and secondary ion mass spectrometry (SIMS) compositional depth profiling. The chemical analysis reveals that the carbon is present throughout the depth of the films.


2001 ◽  
Vol 206-213 ◽  
pp. 559-562
Author(s):  
Jean Desmaison ◽  
H. Hidalgo ◽  
P. Tristant ◽  
F. Naudin ◽  
D. Merle

2014 ◽  
Vol 1704 ◽  
Author(s):  
Hayley R. Osman ◽  
Saibal Mitra

ABSTRACTInitiated Chemical Vapor Deposition (iCVD) is a well-known method for depositing polymers that are used in chemical, biological, and electrical applications. It is a variation of hot filament deposition and can used to produce conformal coatings of polymer films at relatively low reaction temperatures. It is also a solventless technique in which thin polymeric films are deposited by introducing controlled ratios of monomer and initiator gasses into the reaction chamber. Low temperatures in the reaction chamber allow the deposition of polymer films on a wide variety of substrates that include biological substrates.We have simulated the growth of a monolayer of polymer films on two-dimensional surfaces using Monte Carlo simulation. We saw the formation of polymer chains over a time scale on the order of microseconds. We have assumed the substrate to be at room temperature while the reactor pressure close of 800 mTorr.The grid on which we have simulated this polymer growth is represented by a 100x100 matrix, on which a series of specialized functions are executed in each time-step, or iteration. These functions can be divided into three categories: population, translation, and polymerization.The goal of this simulation is to observe the initial growth of the iCVD surface reaction. We have obtained favorable results with the simulation and we are now looking to compare these results with experimental results for initiation growth.


2014 ◽  
Vol 782 ◽  
pp. 619-622 ◽  
Author(s):  
Pavol Beraxa ◽  
Lucia Domovcová ◽  
Ľudovít Parilák

Along with technologies development rise demands on the technical level of new machinery and equipment and also the reliability and efficiency of tools used in the production processes. One of the options for increasing tool life and wear resistance is the use of tools surface treatment technology called as CVD (chemical vapor deposition) and PVD (Physical Vapor Deposition) process. Chemical vapor deposition is a widely used materials-processing. CVD is an atomistic surface modification process, where a thin solid coating is deposited on an underlying heated substrate via a chemical reaction from the vapor or gas phase, PVD process is atomistic deposition process in which material is vaporized from a solid or liquid source in the form of atoms or molecules, transported in the form of a vapor through a vacuum or low pressure gaseous (or plasma) environment to the substrate where it condenses. The paper introduces the possibilities of application of these processes for cold forming tools used at operating conditions of Železiarne Podbrezová, a.s. Tools (formers and straightening rolls) are evaluated in terms of CVD and PVD coating thickness, microstructure and microhardness of tool material and coating.


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