Characterization of the Pb1 Interface Defect in Thermal (100)Si/SiO2 by Electron Spin Resonance: 29Si Hyperfine Structure and Electrical Relevance

1999 ◽  
Vol 592 ◽  
Author(s):  
A. L. Stesmans

ABSTRACTOptimized electron spin resonance investigation resulted in the observation of the fuill angular dependence of the hyperfine (hi) spectra of the Pb1 interface defect in thermal (100)Si/SiO2, showing that the dominant hf interaction of the associated unpaired electron arises from a single Si site. The defect is identified as a prototype Si dangling bond defect with, much remarkably, the unpaired sp3-orbital pointing closely along a <211> direction at 35.26° with the [100] interface normal. If O is excluded as an immediate part of the defect, the key part of the Pb1 defect is uncovered as a tilted Si3≡Si unit. The incorporation of this defect kernel into a larger defect structure is analyzed within the framework of theoretical insight, suggesting the moiety to be part of a strained interfacial Si-Si dimer. ESR has been combined with electrical measurements to monitor the defect's behavior under thermal treatment, including postoxidation annealing in various ambients. No electrical activity of Pb1 as a detrimental interface trap could be traced, suggesting the defect to be of little relevance for device performance. The results are reviewed and discussed in the light of the defect's characteristic appearance at the (100)Si/SiO2 interface.

2003 ◽  
Vol 786 ◽  
Author(s):  
A. L. Stesmans ◽  
V.V. Afanas'ev

ABSTRACTElectron spin resonance (ESR) analysis of (100)Si/SiOx/ZrO2, (100)Si/Al2O3 and Si/HfO2 structures with nm-thin dielectric layers deposited by different chemical vapor deposition procedures reveals, after hydrogen detachment, the presence of the trivalent Si dangling-bond-type centers Pb0, Pb1 as prominent defects in all entities. This Pb0, Pb1 fingerprint, generally unique for the thermal (100)Si/SiO2 interface, indicates that the as-deposited (100)Si/metal oxides interface is basically Si/SiO2-like. Though sensitive to the deposition process, the Pb0 density is found to be substantially larger than in standard (100)Si/SiO2. As probed by the Pb- type center properties, the Si/dielectric interfaces of all structures are under enhanced (unrelaxed) stress, typical for low temperature Si/SiO2 growth. Standard quality thermal Si/SiO2 properties in terms of Pb signature may be approached by appropriate annealing (≥ 650°C) in vacuum in the case of (100)Si/SiOx/ZrO2. Yet, O2 ambient appears required for Si/Al2O3 and Si/HfO2. It appears that Si/high-κ metal oxide structures with device grade quality interfaces can be realized with sub-nm thin SiOx interlayers. The density of fast interface states closely matches the Pb0 density variations, suggesting the center as the dominant fast interface trap. They may be efficiently passivated in H2 at 400 °C.


1985 ◽  
Vol 34 (5) ◽  
pp. 243-247 ◽  
Author(s):  
Junichi SHIDA ◽  
Mamoru ITOH ◽  
Tateaki OGATA ◽  
Hitoshi KAMADA

FEBS Letters ◽  
2009 ◽  
Vol 583 (21) ◽  
pp. 3467-3472 ◽  
Author(s):  
Toshio Iwasaki ◽  
Rimma I. Samoilova ◽  
Asako Kounosu ◽  
Sergei A. Dikanov

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