Oxygen Precipitation in N+ Silicon

1985 ◽  
Vol 59 ◽  
Author(s):  
W. Dyson ◽  
J. Makovsky
Keyword(s):  
Surface Defect ◽  
Nucleation Theory ◽  
Silicon Substrates ◽  
Precipitation Kinetics ◽  
Carrier Generation ◽  
Oxygen Precipitation ◽  
Homogeneous Nucleation Theory ◽  
P Type ◽  
Defect Densities ◽  
Sufficient Oxygen

The advantages of oxygen precipitation in terms of intrinsic gettering to reduce oxidation induced surface defect densities and improve minority carrier generation lifetimes (τ) are well documented in the literature (1–3). Various gettering cycles to establish oxygen precipitation in n type and p type nondegenerate substrates have been developed (4–6), based on homogeneous nucleation theory. For nondegenerate silicon no differences in oxygen precipitation kinetics related to the dopant type have been reported. However, with the increasing interest in both p/p+ and n/n+ epitaxial layers for CMOS devices (7), work on the precipitation of oxygen in both p+ and n+ degenerate silicon substrates has revealed a dependence of oxygen precipitation kinetics on dopant type (8–11). In the case of p+ silicon the differences in precipitation kinetics are small when compared to p- silicon (10,11). For n+ silicon it has been reported (8–11) that the dopant concentration plays a major role and that a significant retardation of oxygen precipitation is observed. There are currently two different explanations for the difficulty encountered in producing sufficient oxygen precipitation in n+ Si. These are the failure to incorporate sufficient oxygen into the crystal during crystal growth (12) and an interaction between intrinsic point defects and the n type dopant, which influences the oxygen precipitation kinetics (8,13).

Spectrum of Defect States in Porous Organic Low-k Dielectric Films, Annealed in Argon and Nitrogen

2003 ◽  
Vol 766 ◽  
Author(s):  
V. Ligatchev ◽  
T.K.S. Wong ◽  
T.K. Goh ◽  
Rusli Suzhu Yu
Keyword(s):  
Deep Level ◽  
Dielectric Films ◽  
Silicon Substrates ◽  
Reverse Bias Voltage ◽  
Defect States ◽  
Single Side ◽  
Sandwich Type ◽  
Transient Spectroscopy ◽  
P Type ◽  
Spectrum Deconvolution

AbstractDefect spectrum N(E) of porous organic dielectric (POD) films is studied with capacitance deep-level-transient-spectroscopy (C-DLTS) in the energy range up to 0.7 eV below conduction band bottom Ec. The POD films were prepared by spin coating onto 200mm p-type (1 – 10 Δcm) single-side polished silicon substrates followed by baking at 325°C on a hot plate and curing at 425°C in furnace. The film thickness is in the 5000 – 6000 Å range. The ‘sandwich’ -type NiCr/POD/p-Si/NiCr test structures showed both rectifying DC current-voltage characteristics and linear 1/C2 vs. DC reverse bias voltage. These confirm the applicability of the C-DLTS technique for defect spectrum deconvolution and the n-type conductivity of the studied films. Isochronal annealing (30 min in argon or 60 min in nitrogen) has been performed over the temperature range 300°C - 650°C. The N(E) distribution is only slightly affected by annealing in argon. However, the distribution depends strongly on the annealing temperature in nitrogen ambient. A strong N(E) peak at Ec – E = 0.55 – 0.60 eV is detected in all samples annealed in argon but this peak is practically absent in samples annealed in nitrogen at Ta < 480°C. On the other hand, two new peaks at Ec – E = 0.12 and 0.20 eV appear in the N(E) spectrum of the samples annealed in nitrogen at Ta = 650°C. The different features of the defect spectrum are attributed to different interactions of argon and nitrogen with dangling carbon bonds on the intra-pore surfaces.

ANNEALING TIME EFFECT ON NANOSTRUCTURED n-ZnO/p-Si HETEROJUNCTION PHOTODETECTOR PERFORMANCE

2015 ◽  
Vol 22 (02) ◽  
pp. 1550027 ◽  
Author(s):  
NADIR. F. HABUBI ◽  
RAID. A. ISMAIL ◽  
WALID K. HAMOUDI ◽  
HASSAM. R. ABID
Keyword(s):  
Annealing Time ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Zno Nps ◽  
Force Microscopy ◽  
Atomic Force ◽  
Junction Type ◽  
P Type ◽  
Quartz Substrates ◽  
Two Peaks

In this work, n- ZnO /p- Si heterojunction photodetectors were prepared by drop casting of ZnO nanoparticles (NPs) on single crystal p-type silicon substrates, followed by (15–60) min; step-annealing at 600∘C. Structural, electrical, and optical properties of the ZnO NPs films deposited on quartz substrates were studied as a function of annealing time. X-ray diffraction studies showed a polycrystalline, hexagonal wurtizte nanostructured ZnO with preferential orientation along the (100) plane. Atomic force microscopy measurements showed an average ZnO grain size within the range of 75.9 nm–99.9 nm with a corresponding root mean square (RMS) surface roughness between 0.51 nm–2.16 nm. Dark and under illumination current–voltage (I–V) characteristics of the n- ZnO /p- Si heterojunction photodetectors showed an improving rectification ratio and a decreasing saturation current at longer annealing time with an ideality factor of 3 obtained at 60 min annealing time. Capacitance–voltage (C–V) characteristics of heterojunctions were investigated in order to estimate the built-in-voltage and junction type. The photodetectors, fabricated at optimum annealing time, exhibited good linearity characteristics. Maximum sensitivity was obtained when ZnO / Si heterojunctions were annealed at 60 min. Two peaks of response, located at 650 nm and 850 nm, were observed with sensitivities of 0.12–0.19 A/W and 0.18–0.39 A/W, respectively. Detectivity of the photodetectors as function of annealing time was estimated.

High Volume Production Growth of GaAs on Silicon Substrates

1986 ◽  
Vol 67 ◽  
Author(s):  
Chris R. Ito ◽  
M. Feng ◽  
V. K. Eu ◽  
H. B. Kim
Keyword(s):  
Schottky Diodes ◽  
High Volume ◽  
Wafer Surface ◽  
Silicon Substrates ◽  
Growth Technique ◽  
Wafer Thickness ◽  
Production Growth ◽  
High Volume Production ◽  
Volume Production ◽  
P Type

ABSTRACTA high-volume epitaxial reactor has been used to investigate the feasibility for the production growth of GaAs on silicon substrates. The reactor is a customized system which has a maximum capacity of 39 three-inch diameter wafers and can accommodate substrates as large as eight inches in diameter. The MOCVD material growth technique was used to grow GaAs directly on p-type, (100) silicon substrates, three and five inches in diameter. The GaAs surfaces were textured with antiphase boundaries. Double-cyrstal rocking curve measurements showed single-cyrstal GaAs with an average FWHMof 520 arc seconds measured at four points over the wafer surface. Within-wafer thickness uniformity was ± 4% with a wafer-to-wafer uniformity of ± 2%. Photoluminescence spectra showed Tour peaks at 1.500, 1.483, 1.464, and 1.440 ev. Schottky diodes were fabricated on the GaAs on silicon material.

Carrier Generation in p-Type Wide-Gap Oxide: SnNb2O6 Foordite

2018 ◽  
Vol 30 (22) ◽  
pp. 8221-8225 ◽  
Author(s):  
Akane Samizo ◽  
Naoto Kikuchi ◽  
Yoshihiro Aiura ◽  
Keishi Nishio ◽  
Ko Mibu
Keyword(s):  
Carrier Generation ◽  
Wide Gap ◽  
P Type

Growth of Rutile TiO2 Nanorods by Chemical Bath Deposition Method on Silicon Substrate at Different Annealing Temperature

2014 ◽  
Vol 624 ◽  
pp. 129-133 ◽  
Author(s):  
Abbas M. Selman ◽  
Zainuriah Hassan
Keyword(s):  
Optical Properties ◽  
Chemical Bath Deposition ◽  
Visible Region ◽  
Annealing Treatment ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Rutile Structure ◽  
Uv Emission ◽  
Cbd Method ◽  
P Type

Effects of annealing treatment on growth of rutile TiO2nanorods on structural, morphological and optical properties of TiO2nanorods were investigated. The nanorods were fabricated on p-type (111)-oriented silicon substrates and, all substrates were seeded with a TiO2seed layer synthesized by radio-frequency reactive magnetron sputtering system. Chemical bath deposition (CBD) was carried out to grow rutile TiO2nanorods on Si substrate at different annealing temperatures (350, 550, 750, and 950 °C). Raman spectroscopy, X-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM) analyses showed the tetragonal rutile structure of the synthesized TiO2nanorods. Optical properties were examined by photoluminescence spectroscopy. The spectra exhibit one strong UV emission peak which can be seen at around 390 nm for all of the samples. In the visible region, TiO2demonstrated two dominant PL emissions centered at around 519 and 705 nm. The experimental results showed that the TiO2nanorods annealed at 550 °C exhibited the optimal structural properties. Moreover, the CBD method enabled the formation of photosensitive, high-quality rutile TiO2nanorods with few defects for future optoelectronic nanodevice applications.

scholarly journals Effect of Mg Treatment on the Nucleation and Ostwald Growth of Inclusions in Fe-O-Al-Mg Melt

Materials ◽  
2020 ◽  
Vol 13 (15) ◽  
pp. 3355
Author(s):  
Yutang Li ◽  
Linzhu Wang ◽  
Chaoyi Chen ◽  
Junqi Li ◽  
Xiang Li
Keyword(s):  
Nucleation Rate ◽  
Ostwald Ripening ◽  
Critical Size ◽  
Early Stage ◽  
Inclusion Size ◽  
Nucleation Theory ◽  
Mg Addition ◽  
Homogeneous Nucleation Theory ◽  
Mg Melt ◽  
Size Of Nuclei

This study aimed to investigate the effect of Mg treatment on the nucleation and ostwald growth of inclusions. Deoxidized experiments with Al (0.05%Al) and Al-Mg (0.05%Al + 0.03%Mg) were carried out at 1873 K, and the composition, number, and size of inclusions were studied as a function of holding time. Homogeneous nucleation theory and ostwald ripening were utilized to calculate the nucleation rate, the critical size of nuclei, and coarsening rate of inclusions. The results show that small inclusions were more easily found in the steels with Al-Mg complex deoxidation, and the number of inclusions with Al-Mg complex deoxidation is larger at an early stage of deoxidation. The critical size of nuclei increases in the order of MgAl2O4 (0.3–0.4 nm) < Al2O3 (0.4–0.6 nm), and the nucleation rate increases in the order of Al2O3 (1100 cm−3 s−1) < MgAl2O4 (1200 cm−3s−1), which is consistent with the experimental results. Moreover, the coarsening rate of MgAl2O4 inclusions was smaller than Al2O3 inclusions in both the value of kd(cal.) from ostwald growth and the value of kd(obs.) from inclusion size. The effect of Mg addition on coarsening of inclusion was analyzed and their mechanism was discussed based on ostwald ripening theory and Factsage calculation.

The Sensitivity of V2O5:Sm2O3 Thin Films against NO2 Toxic Gas

2021 ◽  
Vol 19 (3) ◽  
pp. 69-77
Author(s):  
A.J. Noori ◽  
R.A. Ahmed ◽  
I.M. Ibrahim
Keyword(s):  
Thin Films ◽  
Energy Gap ◽  
Homogeneous Distribution ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Laser Method ◽  
Operation Temperature ◽  
Best Response ◽  
Diffraction Peaks ◽  
P Type

Vanadium oxide V2O5 thin films with variation doping ratios of Sm2O5 (2, 4, 6, and 8 % wt.) on corn glass and p- type silicon substrates were prepared by pulsed laser method. The X-ray diffraction peaks for V2O5 decreases with doping ratio of Sm2O3. FESEM images for V2O5 and doped thin films illustrates clusters with a homogeneous distribution in nano scale. The energy gap varied upon the increment of doping concentration, starting from 2.610 eV to 2.7 eV. Gas sensor measurement of pure and doped V2O5 demonstrated a sensitivity to NO2 gas, and the sensitivity expanded upon the increment of operation temperature. The greatest sensitivity was found to be about 99%, while best response time of 10s and recovery time of 18s were recorded using the 4% Sm2O3 sample at 50 °C.

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