Energy-Loss Filtered Imaging of Segregation-Induced Interface Broadening in SiGe/Si p-Channel MOSFET Device Structures

1999 ◽  
Vol 589 ◽  
Author(s):  
D.J. Norris ◽  
A.G. Cullis ◽  
T.J. Grasby ◽  
E.H.C. Parker

AbstractSiGe/Si p-channel heteroepitaxial MOSFET test structures have been fabricated using solid-source molecular beam epitaxy. High-resolution transmission electron microscopy and energy-loss filtered imaging have been used to quantitatively determine the nanoscale Ge distributions across the SiGe alloy channel. The Ge profile at the edges of the alloy channel were found to be asymmetrical due to the effect of Ge segregation, with an exponential-like distribution directed toward the surface. The results agree well with the predictions of segregation theory and indicate that the concentration of Ge in the extended distribution lay in the range 10%-1% over a distance of several nanometers from the body of the channel. Secondary ion mass spectrometry measurements upon the same samples were insensitive to this short range extended Ge distribution.

2010 ◽  
Vol 434-435 ◽  
pp. 169-172 ◽  
Author(s):  
Wei Kong Pang ◽  
It Meng Low ◽  
J.V. Hanna

The use of secondary-ion mass spectrometry (SIMS), nuclear magnetic resonance (NMR) and transmission electron microscopy (TEM) to detect the existence of amorphous silica in Ti3SiC2 oxidised at 500–1000°C is described. The formation of an amorphous SiO2 layer and its growth in thickness with temperature was monitored using dynamic SIMS. Results of NMR and TEM verify for the first time the direct evidence of amorphous silica formation during the oxidation of Ti3SiC2 at 1000°C.


1989 ◽  
Vol 148 ◽  
Author(s):  
E.D. Marshall ◽  
S.S. Lau ◽  
C.J. Palmstrøm ◽  
T. Sands ◽  
C.L. Schwartz ◽  
...  

ABSTRACTAnnealed Ge/Pd/n-GaAs samples utilizing substrates with superlattice marker layers have been analyzed using high resolution backside secondary ion mass spectrometry and cross-sectional transmission electron microscopy. Interfacial compositional and microstructural changes have been correlated with changes in contact resistivity. The onset of good ohmic behavior is correlated with the decomposition of an intermediate epitaxial Pd4(GaAs,Ge2) phase and solid-phase regrowth of Ge-incorporated GaAs followed by growth of a thin Ge epitaxial layer.


1985 ◽  
Vol 63 (6) ◽  
pp. 863-869 ◽  
Author(s):  
W. Vandervorst ◽  
D. C. Houghton ◽  
F. R. Shepherd ◽  
M. L. Swanson ◽  
H. H. Plattner ◽  
...  

The residual damage left after furnace-annealing Si wafers implanted with 30-keV B+ or 120-keV [Formula: see text] ions has been investigated for doses of 3–5 × 1015 ions∙cm−2. Transmission electron microscopy, Rutherford backscattering, and channeling were used to study the morphology and distribution of the damage while the B and F content and their depth distributions were determined by nuclear reaction analysis and secondary-ion mass spectrometry. For B+-implanted samples the residual damage is concentrated in a band at a depth corresponding to the B projected range. For [Formula: see text]-implanted samples the residual damage is located mainly in the region of the as-implanted amorphous–crystalline interface.


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