Fast Deposition of a-Si:H Layers and Solar Cells in a Large-Area (40×40 cm2) VHF-GD Reactor

1999 ◽  
Vol 557 ◽  
Author(s):  
U. Kroll ◽  
D. Fischer ◽  
J. Meier ◽  
L. Sansonnens ◽  
A. Howling ◽  
...  

AbstractLarge-area deposition of hydrogenated amorphous silicon has been investigated in a single-chamber industrial reactor with electrode dimensions of 40×40 cm2 in the plasma excitation frequency range of 60 to 120 MHz. The film thickness uniformity, analyzed by a light interferometry technique and a step profiler, has been compared with 2-dimensional interelectrode voltage measurements and calculations. The frequency of 80 MHz has been found to be a good compromise between the gain in deposition rate and the homogeneity requirements necessary for a-Si:H solar cells. Under these conditions and while using hydrogen dilution high deposition rates of 6-7 Å/s with a film uniformity of ±5% over a usable substrate size of 30×30 cm2 have been obtained.In the same single-chamber deposition system at 80 MHz, 0.4 gtm thick single-junction a-Si:H solar cells with high performance were fabricated in a total process time of 16 minutes applying a continuous deposition process. Spectral response measurements indicate a minor boron contamination of the i-layer. Initial cell efficiencies of 7.1 % could be achieved for such a fast-grown a-Si:H solar cell.

2003 ◽  
Vol 762 ◽  
Author(s):  
Bernd Rech ◽  
Joachim Müller ◽  
Tobias Repmann ◽  
Oliver Kluth ◽  
Tobias Roschek ◽  
...  

AbstractThis paper addresses scientific and technological efforts to develop highly efficient silicon thin film solar modules on glass substrates. We present a comprehensive study of μc-Si:H p-i-n single junction and a-Si:H/μc-Si:H stacked solar cells prepared by plasma-enhanced chemical vapour deposition (PECVD) at 13.56 MHz excitation frequency. In the first step cell development was performed in a small area PECVD reactor showing the relationship between deposition process and resulting solar cell performance. Subsequent up-scaling to a substrate area of 30×30 cm2 confirmed the scalability to large area reactors. Moreover, we developed textured ZnO:Al films by sputtering and post deposition wet chemical etching as front contact TCO-material with excellent light scattering properties. A-Si:H/μc-Si:H tandem cells developed on this textured ZnO yielded stable efficiencies up to 11.2 % for a cell area of 1 cm2. First solar modules were prepared in our recently installed process technology, which includes PECVD, sputtering, texture etching and laser scribing on substrate sizes up to 30x30 cm2. Initial module efficiencies of 10.8 % and 10.1 % were achieved for aperture areas of 64 cm2 and 676 cm2, respectively.


2003 ◽  
Vol 42 (Part 2, No. 11A) ◽  
pp. L1312-L1314 ◽  
Author(s):  
Akihiro Takano ◽  
Masayuki Tanda ◽  
Makoto Shimosawa ◽  
Takehito Wada ◽  
Tomoyoshi Kamoshita

2017 ◽  
Vol 50 (19) ◽  
pp. 7567-7576 ◽  
Author(s):  
Jae Hoon Yun ◽  
Hyungju Ahn ◽  
Phillip Lee ◽  
Min Jae Ko ◽  
Hae Jung Son

2018 ◽  
Vol 9 (1) ◽  
pp. 1802832 ◽  
Author(s):  
Sheng Dong ◽  
Kai Zhang ◽  
Boming Xie ◽  
Jingyang Xiao ◽  
Hin-Lap Yip ◽  
...  

2020 ◽  
Vol 63 (7) ◽  
pp. 957-965 ◽  
Author(s):  
Yiming Bai ◽  
Chunyan Zhao ◽  
Shuai Zhang ◽  
Shaoqing Zhang ◽  
Runnan Yu ◽  
...  

1999 ◽  
Vol 122 (2) ◽  
pp. 168-171 ◽  
Author(s):  
J. Z. Shi ◽  
X. M. Xie ◽  
F. Stubhan ◽  
J. Freytag

A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total process time is less than 15 seconds during which the actual assembly time is within one second. Most of the samples can pass the shear strength test specified by MIL STD 883D. All the samples could pass 1750 cycles between −55°C and 125°C with slight degradation in die shear strength after the test. The microstructures of the bonds are characterized with metallographical investigation. Comparisons are made between the present technique and the Au/Si eutectic bonding. [S1043-7398(00)01202-0]


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