Thermoelectric Properties of Doped Rhenium Chalcogenides Re6MxTe15 (x = 0, 1, 2; M = Ga, In, Ag)

1998 ◽  
Vol 545 ◽  
Author(s):  
S. Kilibarda Dalafave ◽  
H. Barcena ◽  
D. Henningsen

AbstractTemperature dependencies of the electrical resistivity, ρ, and the thermoelectric power, α, are reported for Re6 MxTe15 (M = Ga, In, Ag; x = 0, 1, 2) between 90–380 K. Theoretical discussion of the results is presented. The materials, synthesized by filling large voids in the Re6Te15 cluster system, may have potential thermoelectric applications around and below room temperatures. The samples are prepared by reacting 99.99% pure elemental powders in evacuated and sealed quartz ampoules at 1070 K for 170 hours. The resistivity data indicate semiconducting behavior for all samples. Possible hopping conduction is present at lower temperatures. The energy gap is observed at higher temperatures in all the samples.Positive values of α in Re6(Ga,In)x Te15 (x = 0, 1, 2) indicate p-type semiconducting behavior in the studied temperature range. For these samples α increases initially with temperature, then levels off to a nearly constant value. The positions of the sharp peaks in a, observed at lower temperatures for x = 1, 2 only, depend on the Ga (In) concentration. High values of a (∼ 300 μV/K) are measured at room temperatures. In Re6AgTe15 α has small positive values (∼ 20–40 μV/K) between 185 K and 270 K. Outside this range α is negative. It reaches local maxima of -340 μV/K at 105 K and -350 μV/K at 370 K. In Re6Ag2Te15 α changes from positive to negative values above 295 K. A maximum positive value of +350 μV/K is reached at 250 K and maximum negative of -250 μV/K at 330 K. The power factor, α2/ρ, increases with temperature for all studied samples. Theoretical fits to α(T) for all samples are discussed. Also discussed is the effect of filling the voids in the rhenium-telluride system on the figure of merit.

1998 ◽  
Vol 545 ◽  
Author(s):  
S. Kilibarda Dalafave ◽  
J. Ziegler ◽  
H. Mcallister

AbstractReported are the temperature dependencies of the thermoelectric power and electrical resistivity of mixed rhenium chalcogenides Re6Te15-x,Sex (0 ≤ x ≤ 8) in the range 90–420 K. Influence of the partial chalcogen exchange on thermoelectric properties of these compounds is discussed. The samples are prepared by sintering elemental powders inside evacuated and sealed quartz ampoules at 1150 K for 170 hours. X-ray analysis reveals an orthorhombic lattice for samples with x < 8 and a tetragonal lattice for the Re6Te7Se8. sample. The lattice parameters and the unit cell volume decrease with increasing selenium concentration.The measurements indicate p-type semiconducting behavior for all samples. The presence of the energy gap is observed at higher temperatures (T ≥ 180–220 K) for all x. Data suggest hopping conduction at lower temperatures. Room temperature resistivities increase non-linearly from 6.9 to 20.4 Ω m with the increasing selenium content. Initially, the thermoelectric power a increases with temperature for all samples, with the fastest increase in Re6Se8 Te7 and the slowest in Re6Te15. The temperature at which a reaches maximum decreases with the increasing Se content. Above this temperature, a decreases uniformly as the temperature increases, the slowest increase being for Re6Se8Te7 and the fastest for Re6Te15. Such α(T) dependence is also discussed. The temperature dependence of the power factor, α2/ρ, is presented. Comparison of ρ, α, and the power factor in Re6SexTe15-x with currently used state-of-the-art materials is given.


2014 ◽  
Vol 787 ◽  
pp. 210-214 ◽  
Author(s):  
Yi Li ◽  
Jian Liu ◽  
Chun Lei Wang ◽  
Wen Bin Su ◽  
Yuan Hu Zhu ◽  
...  

The thermoelectric properties of Sr0.61Ba0.39Nb2O6 ceramics, reduced in various conditions, were investigated in the temperature range from 323K to 1073K. Both the electrical resistivity and the absolute Seebeck coefficient decreased with the deepening degree of oxygen-reduction. However, the decrease of the electrical resistivity had a major influence on the thermoelectric power factor. Therefore, the more heavily reduced sample can gain the higher value of thermoelectric power factor. It has been observed that the thermal conductivity increased with the deepening degree of oxygen-reduction, which indicates that the scattering of the oxygen vacancies produced by reduction does not play a dominant role in the thermal conduction. In spite of the increase of the thermal conductivity, the oxygen-reduction still promoted the thermoelectric figure of merit via the increase of the thermoelectric power factor. And the most heavily reduced Sr0.61Ba0.39Nb2O6 ceramic has the highest thermoelectric figure of merit (~0.18 at 1073 K) among all the samples.


2009 ◽  
Vol 1166 ◽  
Author(s):  
Julio E. Rodríguez ◽  
J. A. Niño

AbstractThermoelectric properties of polycrystalline La0.75Sr0.25Co1-xMnxO3-δ(0<x<0.08) (LSCoO-Mn) compounds have been studied. The samples were grown by solid-state reaction method; their transport properties were studied in the temperature range between 100 and 290K, as a function of temperature and the manganese content. The Seebeck coefficient (S) is positive over the measured temperature range and its magnitude increases with the manganese content up to values close to 160 μV/K. The electrical resistivity (ρ) goes from metallic to semiconducting behavior as the Mn level increases, at room temperature, ρ(T) exhibit values less than 4mΩ-cm. From S(T), ρ(T) and κ(T) data, the thermoelectric power factor and the figure of merit were determined. These performance parameters reach maximum values around 18 μW/K2-cm and 0.2, respectively. The observed behavior in the transport properties become these compounds potential thermoelectric materials, which could be used in thermoelectric applications.


2015 ◽  
Vol 29 (27) ◽  
pp. 1550189
Author(s):  
Q. R. Hou ◽  
B. F. Gu ◽  
Y. B. Chen

In this paper, we report a large enhancement in the thermoelectric power factor in CrSi2 film via Si:B (1 at.% B content) addition. The Si:B-enriched CrSi2 films are prepared by co-sputtering CrSi2 and heavily B-doped Si targets. Both X-ray diffraction patterns and Raman spectra confirm the formation of the crystalline phase CrSi2. Raman spectra also indicate the crystallization of the added Si:B. With the addition of Si:B, the electrical resistivity [Formula: see text] decreases especially at low temperatures while the Seebeck coefficient [Formula: see text] increases above 533 K. As a result, the thermoelectric power factor, [Formula: see text], is greatly enhanced and can reach [Formula: see text] at 583 K, which is much larger than that of the pure CrSi2 film.


2002 ◽  
Vol 17 (5) ◽  
pp. 1092-1095 ◽  
Author(s):  
Gaojie Xu ◽  
Ryoji Funahashi ◽  
Ichiro Matsubara ◽  
Masahiro Shikano ◽  
Yuqin Zhou

Polycrystalline samples of Ca1-xBixMnO3 (0.02 ≤ x ≤ 0.20) were studied by means of x-ray diffraction, electrical resistivity (ρ), thermoelectric power (S), and thermal conductivity (κ) at high temperature. Bi doping leads to the lattice parameters a, b, and c increasing. And the ρ and the absolute value of S decrease rapidly with Bi doping. The largest power factor, S2/ρ, is obtained in the x = 0.04 sample, which is 3.6×10−4 Wm−1 K−2 at 400 K. The figures of merit (Z = S2/ρκ) for this sample and 1.0×10−4 and 0.86 × 10−4 K−1 at 600 and 1000 K, respectively.


2011 ◽  
Vol 25 (22) ◽  
pp. 1829-1838 ◽  
Author(s):  
Q. R. HOU ◽  
B. F. GU ◽  
Y. B. CHEN ◽  
Y. J. HE

Phonon-drag effect usually occurs in single crystals at very low temperatures (10–200 K). Strong phonon-drag effect is observed in ultra-thin β- FeSi 2 films at around room temperature. The Seebeck coefficient of a 23 nm-thick β- FeSi 2 film can reach -1.375 mV/K at 343 K. However, the thermoelectric power factor of the film is still small, only 0.42×10-3 W/m-K2, due to its large electrical resistivity. When a 27 nm-thick MnSi 1.7 film with low electrical resistivity is grown on it, the thermoelectric power factor of the MnSi 1.7 film can reach 1.5×10-3 W/m-K2 at around room temperature. This value is larger than that of bulk MnSi 1.7 material in the same temperature range.


2003 ◽  
Vol 805 ◽  
Author(s):  
Tsunehiro Takeuchi ◽  
Toshio Otagiri ◽  
Hiroki Sakagami ◽  
Uichiro Mizutani

ABSTRACTThe electrical resistivity, thermoelectric power, and thermal conductivity were investigated for the Al71.6-xMn 17.4Six and Al71.6-xRe 17.4Six (7 ≤ x ≤ 12) 1/1-cubic approximants. A large thermoelectric power ranging from -40 to 90 μV/K and a low thermal conductivity less than 3 W/K·cm were observed at room temperatures. The electrical resistivity at room temperature for these approximants was kept below 4,000 μΩcm, that is much smaller than that in the corresponding quasicrystals. As a result of the large thermoelectric power, the low thermal conductivity, and the low electrical resistivity, large dimensionless figure of merit ZT = 0.10 (n-type) and 0.07 (p-type) were achieved for the Al71.6Re17.4Si11 and Al71.6Mn17.4Si11 at room temperature, respectively.


NANO ◽  
2011 ◽  
Vol 06 (05) ◽  
pp. 481-487 ◽  
Author(s):  
Q. R. HOU ◽  
B. F. GU ◽  
Y. B. CHEN ◽  
Y. J. HE

The introduction of an un-doped silicon layer (spacer) enhances significantly the thermoelectric power factor in modulation-doped Si(Al)-MnSi1.7-Si(Al) sandwich structure. This un-doped silicon layer is inserted between the MnSi1.7 (HMS) and Al -doped silicon layers. With a proper spacer thickness, the electrical resistivity decreases sharply and is weakly dependent on temperature from 300 K to 683 K. As a result, the thermoelectric power factor can reach 0.973 × 10-3 W/m-K2 at 683 K, which is about ten times larger than that of an ordinary MnSi1.7 film without modulation doping.


2013 ◽  
Vol 750 ◽  
pp. 130-133
Author(s):  
Katsuhiro Sagara ◽  
Yun Lu ◽  
Dao Cheng Luan

Analysis model of finite element method with a random distribution for thermoelectric composites was built. Thermoelectric properties including electrical resistivity, Seebeck coefficient and thermal conductivity of M/TiO2–x (M = Cu, Ni, 304 stainless steel (304SS)) thermoelectric composites were investigated by the proposed model. Cu/TiO2–x composite showed a large decrease in electrical resistivity while 304SS/TiO2–x composite thermal conductivity was slightly increased. Calculated dimensionless figure-of-merit, ZT of Ni/TiO2–x composite was higher than those of TiO2–x and the other composites in a wide range of metal volume fractions because Ni has large absolute values of Seebeck coefficient, power factor and dimensionless figure-of-merit compared to the other two metals. It was found that power factor and dimensionless figure-of-merit of thermoelectric composites depended on the balance among electrical resistivity, thermal conductivity and Seebeck coefficient. The results revealed that it is important for M/TiO2–x composites to choose suitable addition metal with high power factor and dimensionless figure-of-merit.


1987 ◽  
Vol 97 ◽  
Author(s):  
Jan W. Vandersande ◽  
Charles Wood ◽  
Susan Draper

ABSTRACTSilicon-germanium alloys doped with GaP are used for thermoelectric energy conversion in the temperature range 300°C - 1000°C. The conversion efficiency depends on Z - S2/ρΛ, a material's parameter (the figure of merit), where S is the Seebeck coefficient, ρ is the electrical resistivity and Λ is the thermal conductivity. The annealing of several samples in the temperature range of 1100°C - 1300°C resulted in the power factor P (=S2/ρ) increasing with increased annealing temperature. This increase in P was due to a decrease in ρ which was not completely offset by a drop in S2 suggesting that other changes besides that in the carrier concentration took place. SEM and EDX analysis of the samples indicated the formation of a Ca- P-Ge rich phase as a result of the annealing. It is speculated that this phase is associated with the improved properties. Several reasons which could account for the improvement in the Power factor of annealed GaP doped SiGe are given.


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