Plastic Packaging Reliability of Optoelectronic Devices for Telecom Use

1998 ◽  
Vol 531 ◽  
Author(s):  
Mitsuo Fukuda ◽  
Kuniharu Kato
Keyword(s):  
High Temperature ◽  
Environmental Conditions ◽  
Laser Diodes ◽  
Optoelectronic Devices ◽  
Temperature Cycling ◽  
Access Networks ◽  
High Humidity ◽  
Plastic Packaging

AbstractTwo types of plastic modules for laser diodes and photodiodes are developed and tested under various environmental conditions. The stable operations for both types of modules are confirmed under various long-term aging tests, high humidity high temperature tests (85°C, 85% RH), and temperature cycling tests (-40 / +85°C). These plastic moduless are potentially suitable for economic access networks.

scholarly journals FCCSP IMC growth under reliability stress follows automotive criteria

2019 ◽  
Vol 3 (1) ◽  
pp. 70-83
Author(s):  
Wei Wei Liu ◽  
Berdy Weng ◽  
Scott Chen
Keyword(s):  
High Temperature ◽  
Flip Chip ◽  
Stress Test ◽  
Temperature Cycling ◽  
Content Type ◽  
Initial Stage ◽  
High Temperature Storage ◽  
Temperature Cycling Test ◽  
Temperature Storage

Purpose The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu3Sn and Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture. Design/methodology/approach The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology. Findings The Cu6Sn5 intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu3Sn IMC. Cu6Sn5 IMC will convert to Cu3Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu3Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni3Sn4 IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni3Sn4 IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell. Research limitations/implications The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design. Practical implications This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology. Originality/value The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

scholarly journals Sensitivity of shotcrete Brazilian discs coated with thin spray-on liners to environmental conditions

2021 ◽  
Vol 121 (7) ◽  
Author(s):  
M.J. Kanda ◽  
T.R. Stacey
Keyword(s):  
High Temperature ◽  
Environmental Conditions ◽  
Laboratory Testing ◽  
Laboratory Tests ◽  
Room Temperature ◽  
Mining Industry ◽  
High Humidity ◽  
Rock Support ◽  
Strength Enhancement ◽  
Indirect Tensile

SYNOPSIS Thin spray-on liners (TSLs) have been used as sealants and rock support in tunnels for over 25 years. Laboratory tests have indicated satisfactory properties that can provide adequate strength, adhesion, toughness, and elasticity as part of rock support systems in mining excavations. These characteristics are, however, not always demonstrated in practice, when mine environmental conditions do not correspond with laboratory environmental conditions. The shortcomings of TSLs experienced in the mining industry have raised concerns, resulting in scepticism from some operators regarding their utilization. The research described in this paper aims to investigate TSL performance in environmental conditions similar to those experienced in mines. Brazilian indirect tensile (BIT) specimens were prepared from precast shotcrete and coated with TSLs. The specimens were then exposed to different environmental conditions for up to 112 days before BIT testing under various conditions: laboratory room temperature and humidity; saturated room temperature; and combined saturated and high temperature (50°C). Additional uncoated shotcrete and TSL BIT specimens were prepared for comparison purposes. The results of the BIT tests showed that environmental conditions have a significant influence on the tensile strength enhancement of shotcrete by TSLs. Water-based TSLs are most likely to be suitable for high humidity environments, although their performance decreases at higher temperatures. Numerical modelling of TSL-coated BIT samples confirms the potential limitations of designing TSL support based only on laboratory testing carried out under room conditions. Keywords: thin spray-on liner, Brazilian indirect tensile (BIT) test, TSL performance, environmental conditions, humidity, high temperature.

scholarly journals Testing the Effects of Seacoast Atmosphere on Tantalum Capacitors

2011 ◽  
Vol 2011 ◽  
pp. 1-9 ◽  
Author(s):  
Johanna Virkki ◽  
Pasi Raumonen
Keyword(s):  
High Temperature ◽  
Salt Spray ◽  
Significant Risk ◽  
Temperature Cycling ◽  
High Humidity ◽  
Temperature Changes ◽  
Effects Of Temperature ◽  
Salt Fog ◽  
Very High ◽  
Salt Spray Testing

The goal of this research was to test the effects of seacoast atmosphere on tantalum capacitors. Four tests were chosen for this purpose: the 85/85 test was chosen for testing the effects of the combination of high humidity and high temperature, salt spray testing was done for examining the effects of high humidity and salt, temperature cycling test was applied for testing the effects of temperature changes, and a 100% RH humidity test was developed for examining the effects of very high humidity. The results show that combination of high humidity and high temperature did not possess a significant risk for these capacitors during their normal use. Very high humidity and radical temperature changes both affected the breakdown voltages of tantalum capacitors. Salt fog caused corrosion of these components and had a small effect on breakdown voltage but did not have an effect on capacitance or ESR.

Modelling the Swelling due to Delayed Ettringite Formation - Application to a Real Bridge

2016 ◽  
Vol 711 ◽  
pp. 722-729
Author(s):  
Othman Omikrine-Metalssi ◽  
Badreddine Kchakech ◽  
Stéphane Lavaud ◽  
Bruno Godart
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Cement Paste ◽  
Early Age ◽  
High Humidity ◽  
Delayed Ettringite Formation ◽  
Precise Control ◽  
Ettringite Formation ◽  
Structural Disorders

Delayed ettringite formation (DEF) can affect the long-term durability of concrete structures by causing cracking and expansion of the material. Consequently, mechanical properties decrease which may cause large structural disorders due to unexpected deformations and additional stresses in concrete and reinforcement. This reaction consists in ettringite crystallization within concrete after hardening is substantially complete, and in which no sulphates come from outside the cement paste. It may occur in materials that have been subjected to temperature above about 65 °C at early age and to high humidity. At this high temperature, the ettringite turns unstable while the concrete is still plastic and forms again after cooling in the hardened material, thus generating swelling due to crystallisation pressure.This article aims to present a new model for the calculation of structures affected by DEF and to study the effect of the prefabrication temperature on the development of this reaction. In this context, the elaborated model was applied to the 3D simulations of a real bridge affected by this phenomenon. The results highlight that the temperature reached in the precast beams of the studied bridge during prefabrication has a significant effect on the displacements and stresses. Therefore, more precise control of the prefabrication temperature has to be applied in order to prevent the swelling and damage to structures.

Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

1988 ◽  
Vol 46 ◽  
pp. 550-551
Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Second Phase ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

KUBOTA KNC-03

Alloy Digest ◽  
2010 ◽  
Vol 59 (1) ◽  
Keyword(s):  
Compressive Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
High Strength ◽  
Temperature Performance ◽  
Resistance To Oxidation

Abstract Kubota KNC-03 is a grade with a combination of high strength and excellent resistance to oxidation. These properties make this alloy suitable for long-term service at temperature up to 1250 deg C (2282 deg F). This datasheet provides information on physical properties, hardness, elasticity, tensile properties, and compressive strength as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: Ni-676. Producer or source: Kubota Metal Corporation, Fahramet Division. See also Alloy Digest Ni-662, April 2008.

ATI 6-2-4-2

Alloy Digest ◽  
2020 ◽  
Vol 69 (8) ◽  
Keyword(s):  
Tensile Strength ◽  
Titanium Alloy ◽  
High Temperature ◽  
Creep Strength ◽  
High Strength ◽  
Heat Treating ◽  
Good Combination ◽  
Long Term Stability ◽  
Temperature Performance

Abstract ATI 6-2-4-2 is a near-alpha, high strength, titanium alloy that exhibits a good combination of tensile strength, creep strength, toughness, and long-term stability at temperatures up to 425 °C (800 °F). Silicon up to 0.1% frequently is added to improve the creep resistance of the alloy. This datasheet provides information on composition, physical properties, hardness, and tensile properties as well as creep. It also includes information on high temperature performance as well as forming, heat treating, machining, and joining. Filing Code: Ti-169. Producer or Source: ATI.

scholarly journals CO Detection Investigation at High Temperature by SiC MISFET Metal/Oxide Gas Sensors

Proceedings ◽  
2021 ◽  
Vol 56 (1) ◽  
pp. 41
Author(s):  
Lida Khajavizadeh ◽  
Anita Lloyd Spetz ◽  
Mike Andersson
Keyword(s):  
High Temperature ◽  
Gas Sensors ◽  
Elevated Temperatures ◽  
Long Term Stability ◽  
Stability Performance ◽  
Catalytic Metal ◽  
Co Detection ◽  
Effect Transistor ◽  
Metal Oxide Gas Sensors

In order to investigate the necessary device improvements for high-temperature CO sensing with SiC metal insulator semiconductor field effect transistor (MISFET)-based chemical gas sensors, devices employing, as the gas-sensitive gate contact, a film of co-deposited Pt/Al2O3 instead of the commonly used catalytic metal-based contacts were fabricated and characterized for CO detection at elevated temperatures and different CO and O2 levels. It can be concluded that the sensing mechanism at elevated temperatures correlates with oxygen removal from the sensor surface rather than the surface CO coverage as observed at lower temperatures. The long-term stability performance was also shown to be improved compared to that of previously studied devices.

First Demonstration of High Temperature SiC CMOS Gate Driver in Bridge Leg for Hybrid Power Module Application

2018 ◽  
Vol 924 ◽  
pp. 854-857
Author(s):  
Ming Hung Weng ◽  
Muhammad I. Idris ◽  
S. Wright ◽  
David T. Clark ◽  
R.A.R. Young ◽  
...  
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Initial Increase ◽  
Reliability Test ◽  
Power Devices ◽  
Power Module ◽  
Hybrid Power ◽  
Gate Driver ◽  
Passive Circuit

A high-temperature silicon carbide power module using CMOS gate drive technology and discrete power devices is presented. The power module was aged at 200V and 300 °C for 3,000 hours in a long-term reliability test. After the initial increase, the variation in the rise time of the module is 27% (49.63ns@1,000h compared to 63.1ns@3,000h), whilst the fall time increases by 54.3% (62.92ns@1,000h compared to 97.1ns@3,000h). The unique assembly enables the integrated circuits of CMOS logic with passive circuit elements capable of operation at temperatures of 300°C and beyond.

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