Silicon on Insulator Formed By O+ OR N+ Ion Implantation

1985 ◽  
Vol 53 ◽  
Author(s):  
P.L.F. Hemment
Keyword(s):  
High Temperature ◽  
Ion Implantation ◽  
Silicon On Insulator ◽  
Defect Annealing ◽  
Chemical Segregation ◽  
High Temperature Processing ◽  
Buried Layers

ABSTRACTThe synthesis of buried layers of SiO2 and Si3N4, by ion implantation is reviewed. This process, which may be used to form device worthy silicon-on-insulator (SOI) structures, involves (i) implantation of O+ or N+ ions and (ii) high temperature processing to achieve defect annealing and chemical segregation of the implanted species.

Interfacial Structure and Evolution in Mesotaxial CoSi2/Si Heterostructure

1991 ◽  
Vol 238 ◽  
Author(s):  
S. R. Hull ◽  
Y. F. Hsieh ◽  
A. E. White ◽  
K. T. Short
Keyword(s):  
High Temperature ◽  
Ion Implantation ◽  
Interfacial Structure ◽  
High Temperature Annealing ◽  
Ripening Process ◽  
Si Substrates ◽  
Buried Layers ◽  
Precipitate Nucleation ◽  
And Control ◽  
First Time

ABSTRACTWe describe the evolution and microstructure of Si/CoSi2/Si (100) and (111) heterostructures formed by Co+ ion implantation into Si substrates (“mesotaxy”), followed by high temperature annealing. It is shown that the CoSi2 precipitate nucleation and ripening process, and eventual coalescence into buried layers, is controlled by interfacial structure and energetics. Understanding and control of these processes allows for the first time synthesis of otherwise almost identical CoSi2 buried layers with either twinned or untwinned CoSi2/Si(111) interfaces.

High temperature antimony ion implantation in strained silicon-on-insulator

2009 ◽  
Vol 53 (8) ◽  
pp. 828-832 ◽  
Author(s):  
D. Buca ◽  
W. Heiermann ◽  
H. Trinkaus ◽  
B. Holländer ◽  
U. Breuer ◽  
...  
Keyword(s):  
High Temperature ◽  
Ion Implantation ◽  
Silicon On Insulator ◽  
Strained Silicon

Optical Reflectometry for Detailed Modeling of Buried Layers in Silicon-on-Insulator

1987 ◽  
Vol 93 ◽  
Author(s):  
S. N. Bunker ◽  
P. Sioshansi ◽  
M. M. Sanfacon ◽  
S. P. Tobin
Keyword(s):  
Ion Implantation ◽  
Oxide Thickness ◽  
Silicon On Insulator ◽  
High Dose ◽  
Layer Depth ◽  
Oxygen Ion ◽  
Optical Reflectometry ◽  
Buried Layers ◽  
Oxygen Ion Implantation ◽  
Selection Of

ABSTRACTOptical reflectometry has been used to describe the morphology of buried layers by high dose oxygen ion implantation into silicon. Previous work has demonstrated that the layer depth, thickness, and shape of surrounding regions with a graded concentration of oxygen can be successfully modeled when compared to SIMS and XTEM. A selection of nomographs for analyzing spectra resulting from conventional implant conditions as a function of dose and screen oxide thickness are presented.

AFM study of the dynamics of α-alumina surface faceting during high-temperature processing

1995 ◽  
Vol 53 ◽  
pp. 334-335 ◽  
Author(s):  
Michael W. Bench ◽  
Jason R. Heffelfinger ◽  
C. Barry Carter
Keyword(s):  
High Temperature ◽  
Thin Foil ◽  
Sem Analysis ◽  
Conductive Coatings ◽  
Force Microscopy ◽  
Minimal Sample ◽  
Atomic Force ◽  
Formation And Evolution ◽  
High Temperature Processing ◽  
Nominal Surface

To gain a better understanding of the surface faceting that occurs in α-alumina during high temperature processing, atomic force microscopy (AFM) studies have been performed to follow the formation and evolution of the facets. AFM was chosen because it allows for analysis of topographical details down to the atomic level with minimal sample preparation. This is in contrast to SEM analysis, which typically requires the application of conductive coatings that can alter the surface between subsequent heat treatments. Similar experiments have been performed in the TEM; however, due to thin foil and hole edge effects the results may not be representative of the behavior of bulk surfaces.The AFM studies were performed on a Digital Instruments Nanoscope III using microfabricated Si3N4 cantilevers. All images were recorded in air with a nominal applied force of 10-15 nN. The alumina samples were prepared from pre-polished single crystals with (0001), , and nominal surface orientations.

Analysis of Silicon-On-Insulator Structures Formed By Oxygen Ion Implantation

1985 ◽  
Vol 43 ◽  
pp. 300-301
Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Dose ◽  
Crystal Silicon ◽  
Oxygen Ion ◽  
Oxygen Ion Implantation

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.

Defect reduction in oxygen implanted silicon-on-insulator material during high-temperature annealing

1989 ◽  
Vol 47 ◽  
pp. 604-605
Author(s):  
P. Roitman ◽  
B. Cordts ◽  
S. Visitserngtrakul ◽  
S.J. Krause
Keyword(s):  
High Temperature ◽  
Annealing Temperature ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Temperature Annealing ◽  
High Current ◽  
Defect Reduction ◽  
Annealing Step ◽  
Multiple Cycle ◽  
Defect Densities

Synthesis of a thin, buried dielectric layer to form a silicon-on-insulator (SOI) material by high dose oxygen implantation (SIMOX – Separation by IMplanted Oxygen) is becoming an important technology due to the advent of high current (200 mA) oxygen implanters. Recently, reductions in defect densities from 109 cm−2 down to 107 cm−2 or less have been reported. They were achieved with a final high temperature annealing step (1300°C – 1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. However, the processes and conditions for reduction and elimination of precipitates and defects during high temperature annealing are not well understood. In this work we have studied the effect of annealing temperature on defect and precipitate reduction for SIMOX samples which were processed first with high temperature, high current implantation followed by high temperature annealing.

TEM study of buried cobalt disilicide layers formed by ion implantation: Identification of cobalt monosilicide inclusions

1990 ◽  
Vol 48 (4) ◽  
pp. 576-577
Author(s):  
A. De Veirman ◽  
J. Van Landuyt ◽  
K.J. Reeson ◽  
R. Gwilliam ◽  
C. Jeynes ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Annealing Treatment ◽  
Silicon On Insulator ◽  
High Dose ◽  
Nitrogen Flow ◽  
Cobalt Disilicide ◽  
Transmission Electron ◽  
Beam Heating ◽  
Co Concentration ◽  
Silicon On Insulator Technology

In analogy to the formation of SIMOX (Separation by IMplanted OXygen) material which is presently the most promising silicon-on-insulator technology, high-dose ion implantation of cobalt in silicon is used to synthesise buried CoSi2 layers. So far, for high-dose ion implantation of Co in Si, only formation of CoSi2 is reported. In this paper it will be shown that CoSi inclusions occur when the stoichiometric Co concentration is exceeded at the peak of the Co distribution. 350 keV Co+ ions are implanted into (001) Si wafers to doses of 2, 4 and 7×l017 per cm2. During the implantation the wafer is kept at ≈ 550°C, using beam heating. The subsequent annealing treatment was performed in a conventional nitrogen flow furnace at 1000°C for 5 to 30 minutes (FA) or in a dual graphite strip annealer where isochronal 5s anneals at temperatures between 800°C and 1200°C (RTA) were performed. The implanted samples have been studied by means of Rutherford Backscattering Spectroscopy (RBS) and cross-section Transmission Electron Microscopy (XTEM).

Influence of Enzyme Activity of Bacteria and Leucocytes in Raw Milk on Age Gelation after UHT Processing

1984 ◽  
Vol 47 (2) ◽  
pp. 105-107 ◽  
Author(s):  
BARBARA P. KEOGH ◽  
G. PETTINGILL
Keyword(s):  
Enzyme Activity ◽  
High Temperature ◽  
Inhibitory Action ◽  
Raw Milk ◽  
Bacterial Counts ◽  
High Temperature Processing ◽  
The Relationship ◽  
Ultra High Temperature

An investigation was undertaken into the relationship between the enzyme activity of cells harvested from raw milk and time taken for age gelation (TAG) to occur in the milk after ultra-high-temperature processing. It was shown that there was no relationship between the TAG and the bacterial counts on milk agar at 30°C or 7°C nor was there a relationship between the counts and the level of enzyme activity of the harvested cells. There was, however, a significant correlation between the level of enzyme activity of the harvested cells and the TAG. When extra bovine leucocytes were added to raw milk before processing, the TAG was increased. This suggested that there was an inhibitory action of leucocytes in development of age gelation.

Interpretation of macropore shape transformation in crystalline silicon upon high temperature processing

2010 ◽  
Vol 108 (7) ◽  
pp. 074902 ◽  
Author(s):  
Moustafa Y. Ghannam ◽  
Abdulazeez S. Alomar ◽  
Jef Poortmans ◽  
Robert P. Mertens
Keyword(s):  
High Temperature ◽  
Crystalline Silicon ◽  
Shape Transformation ◽  
High Temperature Processing
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