Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects

1998 ◽  
Vol 516 ◽  
Author(s):  
Y. -L. Shen

AbstractThe effects of metal Joule heating in interconnects were studied numerically. Particular attention is devoted to the multilevel nature of interconnects in modem microelectronic devices. Heat conduction analyses were carried out to quantify the temperature rise in structures composed of various levels of metal lines under different electric current densities. Two types of metallization (aluminum and copper) and two types of interlevel dielectric (silicon dioxide and polyimide) were considered. It was found that increasing the total number of metal level and/or switching the dielectric from silicon dioxide to polymer-based low-k dielectrics can cause substantial temperature increases, pointing out that interconnect Joule heating can become a major reliability threat in future applications. Thermal stresses induced by the nonuniform temperature field were also analyzed.

2019 ◽  
Vol 116 (6) ◽  
pp. 613
Author(s):  
Cai-yi Liu ◽  
Yan Peng ◽  
Ling Kong ◽  
Lu-han Hao ◽  
Ren Zhai

High strength steel hot forming technology plays an important role in achieving lightweight vehicles, improving the safety of vehicles. The tensile strength of the blank formed by traditional hot forming process is as high as 1500–2000 MPa, the strength of the formed blank is high, but the elongation is usually low and comprehensive mechanical property is not high. In this article, the process control of material gradient properties hot forming technology is summarized through the analysis of strengthening mechanism of gradient distribution hot forming technology. Based on the traditional hot forming technology, a new hot forming technology based on partition cooling to achieve material property gradient distribution is proposed. By changing the cooling rate of blank in different zones is different, and the gradient distribution of material properties is finally obtained. The DEFORM is used to analyze the hot forming process of the blank under the nonuniform temperature field of the partition cooling. A set of partition cooling hot forming die was designed independently to verify the experimental results. The evolution mechanism of microstructure and its effect on material properties during hot forming under nonuniform temperature field with partition cooling were revealed.


2018 ◽  
Vol 60 (10) ◽  
pp. 1911
Author(s):  
Н.Н. Матвеев ◽  
Н.И. Борисова ◽  
Н.С. Камалова ◽  
Н.Ю. Евсикова

AbstractThe correlation between crystallite structural changes and polarization properties of a linear crystallized [–CH_2CH_2O–]_ n polyethylene oxide polymer is studied. The average spherulite radius and polarization of polyethylene oxide are inspected as functions of molecular weight of polymer and crystallization temperature from melt in a nonuniform temperature field.


Author(s):  
Qinlong Ren ◽  
Cho Lik Chan ◽  
Alberto L. Arvayo

Microfluidics and its applications to Lab-on-a-Chip have attracted a lot of attention. Because of the small length scale, the flow is characterized by a low Re number. The governing equations become linear. Boundary element method (BEM) is a very good option for simulating the fluid flow with high accuracy. In this paper, we present a 2D numerical modeling of the electrothermal flow using BEM. In electrothermal flow the volumetric force is caused by electric field and temperature gradient. The physics is mathematically modeled by (i) Laplace equation for the electrical potential, (ii) Poisson equation for the heat conduction caused by Joule heating, (iii) continuity and Stokes equation for the low Reynolds number flow. We begin by solving the electrical potential and electric field. The heat conduction is caused by the Joule heating as the heat generation term. Superposition principle is used to solve for the temperature field. The Coulomb and dielectric forces are generated by the electrical field and temperature gradient of the system. We analyze the Stokes flow problem by superposition of fundamental solution for free-space velocity caused by body force and BEM for the corresponding homogeneous Stokes equation. It is well known that a singularity integral arises when the source point approaches the field point. To overcome this problem, we solve the free-space velocity analytically. For the BEM part, we also calculate all the integral terms analytically. With this effort, our solution is more accurate. In addition, we improve the robustness of the matrix system by combining the velocity integral equation with the traction integral equation. Our purpose is to design a pump for the microfluidics system. Since the system is a long channel, the flow is fully developed in the area far away from the electrodes. With this assumption, the velocity profile is parabolic at the inlet and outlet of the channel. So we can get appropriate boundary conditions for the BEM part of Stokes equation. Consequently, we can simulate the electrothermal flow in an open channel. In this paper, we will present the formulation and implementation of BEM to model electrothermal flow. Results of electrical potential, temperature field, Joule heating, electrothermal force, and velocity field will be presented.


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