High Resolution Auger Imaging Combined with Focused Ion Beam for the Investigation of Metal/GaAs Contacts in High Power Transistors

1998 ◽  
Vol 514 ◽  
Author(s):  
Patrick Etienne ◽  
Jean-Pierre Landesman ◽  
Frederic Wyczisk ◽  
Simone Cassette ◽  
Sylvain Delage

ABSTRACTInspecting and understanding the thermal stability of metal contacts in the context of reliability testing on high power transistors (especially in the GaAs technology) often necessitates to view atomic concentration profiles at deep interfaces. One common method for this purpose is the combined Auger spectroscopy/ion etching technique, where the region to be investigated is etched sequentially (with a “low” etch rate, typically in the Å/second regime) and Auger electron spectra (AES) are recorded at each step of the etching process. The 3 major resolution drawbacks of this approach are first that it is time-consuming, second that the spatial resolution is limited (atomic profiles on contact regions with lateral dimensions smaller that I R~m are difficult to obtain) and third that the interface of interest is “smoothed” during the etch process. The third point yields atomic concentration profiles with an apparent inter-mixing, which sometimes hinders observation of the details of interest for the interface under investigation.We have used a different approach for this aspect of metal contact testing, in which the interface to be studied is first “revealed” by focused ion beam (FIB) micro-sectioning. After this preparation step, chemical images of the interface are directly obtained by high resolution Auger electron spectra mapping. The different operating conditions for the FIB process (orientation of the cross-section with respect to the transistor surface, preliminary procedures to eliminate residual roughness as well as surface contamination) have been optimized in order to produce Auger spectra free of any artifact. The approach is demonstrated on Au/GeNiAu ohmics contacts to the emitter electrode of GaAs-based hererostructure bipolar transistor, designed for high power amplification in the microwave regime. Ultimate spatial resolution of 20 to 30 nm on the Ayuger chemical images is demonstrated on an Auger microscope equipped with a Schottky field emitting tip.

1975 ◽  
Vol 53 (3) ◽  
pp. 254-256 ◽  
Author(s):  
B.M. Johnson ◽  
D. Schneider ◽  
K.S. Roberts ◽  
J.E. Bolger ◽  
C.F. Moore

2002 ◽  
Vol 09 (01) ◽  
pp. 63-67 ◽  
Author(s):  
I. H. SUZUKI ◽  
K. OKADA ◽  
K. KAMIMORI ◽  
J. SASAKI ◽  
H. YOSHIDA ◽  
...  

Normal Auger electron spectra from Kr2p hole states, L 23 M 45 M 45 and L 23 M 23 M 45, have been measured using monochromatized synchrotron radiation and a high resolution electron spectrometer. Measured spectra were reproduced with a fitting calculation, where Voigt functions including an instrumental resolution and natural lifetime widths of related core hole states were used. At most final states estimated energies for spectral peaks agree with those by electron and ion beam techniques. Relative intensities for some peaks are appreciably different from the previous results.


Author(s):  
Becky Holdford

Abstract On mechanically polished cross-sections, getting a surface adequate for high-resolution imaging is sometimes beyond the analyst’s ability, due to material smearing, chipping, polishing media chemical attack, etc.. A method has been developed to enable the focused ion beam (FIB) to re-face the section block and achieve a surface that can be imaged at high resolution in the scanning electron microscope (SEM).


Author(s):  
Po Fu Chou ◽  
Li Ming Lu

Abstract Dopant profile inspection is one of the focused ion beam (FIB) physical analysis applications. This paper presents a technique for characterizing P-V dopant regions in silicon by using a FIB methodology. This technique builds on published work for backside FIB navigation, in which n-well contrast is observed. The paper demonstrates that the technique can distinguish both n- and p-type dopant regions. The capability for imaging real sample dopant regions on current fabricated devices is also demonstrated. SEM DC and FIB DC are complementary methodologies for the inspection of dopants. The advantage of the SEM DC method is high resolution and the advantage of FIB DC methodology is high contrast, especially evident in a deep N-well region.


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