Porous Silica: A Potential Material for Low Dielectric Constant Applications

1998 ◽  
Vol 511 ◽  
Author(s):  
Edward D. Birdsell ◽  
Rosario A. Gerhardt

ABSTRACTHighly porous (15% dense) silica thin films with k < 2.2 have been produced using a colloidal sol-gel process. This process uses relatively inexpensive, commercially available colloidal silica and potassium silicate. These films were deposited by spin coating. The parameters for spin coating (spin speed, gelation time, gel composition, etc.) have been optimized and coherent films with thicknesses ranging from 0.7–2.0 μm can be reproducibly fabricated. Preliminary work shows that the porosity of these films ranges from a few rn to < 1 μm. The dielectric properties were examined for frequencies up to 1 MHz. Compatibility of the films with IC processing was also investigated.

2008 ◽  
Vol 47-50 ◽  
pp. 973-976 ◽  
Author(s):  
Yi He Zhang ◽  
Qing Song Su ◽  
Li Yu ◽  
Hong Zheng ◽  
Hai Tao Huang ◽  
...  

A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1µm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.


2008 ◽  
Vol 2008 ◽  
pp. 1-7 ◽  
Author(s):  
Peter Pucher ◽  
Rabah Azouani ◽  
Andrei Kanaev ◽  
Gernot Krammer

Efficient photocatalysis for gas cleaning purposes requires a large accessible, illuminated active surface in a simple and compact reactor. Conventional concepts use powdered catalysts, which are nontransparent. Hence a uniform distribution of light is difficult to be attained. Our approach is based on a coarse granular, UV-A light transparent, and highly porous adsorbent that can be used in a simple fixed bed reactor. A novel sol-gel process with rapid micro mixing is used to coat a porous silica substrate withTiO2-based nanoparticles. The resulting material posses a high adsorption capacity and a photocatalytic activity under UV-A illumination (PCAA = photocatalytic active adsorbent). Its photocatalytic performance was studied on the oxidation of trichloroethylene (TCE) in a fixed bed reactor setup in continuous and discontinuous operation modes. Continuous operation resulted in a higher conversion rate due to less slip while discontinuous operation is superior for a total oxidation toCO2due to a user-defined longer residence time.


2000 ◽  
Vol 628 ◽  
Author(s):  
Guang-Way Jang ◽  
Ren-Jye Wu ◽  
Yuung-Ching Sheen ◽  
Ya-Hui Lin ◽  
Chi-Jung Chang

This work successfully prepared an UV curable organic-inorganic hybrid material consisting of organic modified colloidal silica. Applications of UV curable organic-inorganic hybrid materials include abrasion resistant coatings, photo-patternable thin films and waveguides. Colloidal silica containing reactive functional groups were also prepared by reacting organic silane and tetraethyl orthosilicate (TEOS) using sol-gel process. In addition, the efficiency of grafting organic moiety onto silica nanoparticles was investigated by applying TGA and FTIR techniques. Experimental results indicated a strong interdependence between surface modification efficiency and solution pH. Acrylate-SiO2 hybrid formation could result in a shifting of thermal degradation temperature of organic component from about 200°C to near 400°C. In addition, the stability of organic modified colloidal silica in UV curable formula and the physical properties of resulting coatings were discussed. Furthermore, the morphology of organic modified colloidal silica was investigated by performing TEM and SEM studies‥


2000 ◽  
Vol 617 ◽  
Author(s):  
Ian W. Boyd ◽  
Jun-Ying Zhang

AbstractIn this paper, UV-induced large area growth of high dielectric constant (Ta2O5, TiO2and PZT) and low dielectric constant (polyimide and porous silica) thin films by photo-CVD and sol-gel processing using excimer lamps, as well as the effect of low temperature LW annealing, are discussed. Ellipsometry, Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), UV spectrophotometry, atomic force microscope (AFM), capacitance-voltage (C-V) and current-voltage (I-V) measurements have been employed to characterize oxide films grown and indicate them to be high quality layers. Leakage current densities as low as 9.0×10−8 Acm−2 and 1.95×10−7 Acm−2 at 0.5 MV/cm have been obtained for the as-grown Ta2O5 films formed by photo-induced sol-gel processing and photo-CVD. respectively - several orders of magnitude lower than for any other as-grown films prepared by any other technique. A subsequent low temperature (400°C) UV annealing step improves these to 2.0×10−9 Acm−2 and 6.4× 10−9 Acm−2, respectively. These values are essentially identical to those only previously formed for films annealed at temperatures between 600 and 1000°C. PZT thin films have also been deposited at low temperatures by photo-assisted decomposition of a PZT metal-organic sol-gel polymer using the 172 nm excimer lamp. Very low leakage current densities (10−7 A/cm2) can be achieved, which compared with layers grown by conventional thermal processing. Photo-induced deposition of low dielectric constant organic polymers for interlayer dielectrics has highlighted a significant role of photo effects on the curing of polyamic acid films. I-V measurements showed the leakage current density of the irradiated polymer films was over an order of magnitude smaller than has been obtained in the films prepared by thermal processing. Compared with conventional furnace processing, the photo-induced curing of the polyimide provided both reduced processing time and temperature, A new technique of low temperature photo-induced sol-gel process for the growth of low dielectric constant porous silicon dioxide thin films from TEOS sol-gel solutions with a 172 nm excimer lamp has also been successfully demonstrated. The dielectric constant values as low as 1.7 can be achieved at room temperature. The applications investigated so far clearly demonstrate that low cost high power excimer lamp systems can provide an interesting alternative to conventional UV lamps and excimer lasers for industrial large-scale low temperature materials processing.


2000 ◽  
Vol 612 ◽  
Author(s):  
Sylvie Acosta ◽  
André Ayral ◽  
Christian Guizard ◽  
Charles Lecornec ◽  
Gérard Passemard ◽  
...  

AbstractPorous silica exhibits attractive dielectric properties, which make it a potential candidate for use as insulator into interconnect structures. A new way of preparation of highly porous silica layers by the sol-gel route was investigated and is presented. The synthesis strategy was based on the use of common and low toxicity reagents and on the development of a simple process without gaseous ammonia post-treatment or supercritical drying step. Defect free layers were deposited by spin coating on 200 mm silicon wafers and characterized. Thin layers with a total porosity larger than 70% and an average pore size of 5 nm were produced. The dielectric constant measured under nitrogen flow on these highly porous layers is equal to ∼ 2.5, which can be compared to the value calculated from the measured porosity, ∼ 1.9. This difference is explained by the presence of water adsorbed on the hydrophilic surface of the unmodified silica.


2002 ◽  
Vol 737 ◽  
Author(s):  
R.E. Melgarejo ◽  
M.S. Tomar ◽  
A. Hidalgo ◽  
R.S. Katiyar

ABSTRACTNd substituted bismuth titanate Bi4-xNdxTi3O12 were synthesized by sol-gel process and thin films were deposited on Pt substrate (Pt/TiO2/SiO2/Si) by spin coating. Thin films, characterized by X-ray diffraction and Raman spectroscopy, shows complete solid solution up to the composition x < 1. Initial results indicate that the ferroelectric polarization increases with increasing Nd content in the film with 2Pr = 50μC/cm2 for x = 0.46, which may have application in non-volatile ferroelectric memory devices.


2015 ◽  
Vol 6 ◽  
pp. 2105-2112 ◽  
Author(s):  
Roberto Nisticò ◽  
Paola Avetta ◽  
Paola Calza ◽  
Debora Fabbri ◽  
Giuliana Magnacca ◽  
...  

Highly selective porous films were prepared by spin-coating deposition of colloidal silica nanoparticles on an appropriate macroporous substrate. Silica nanoparticles very homogenous in size were obtained by sol–gel reaction of a metal oxide silica precursor, tetraethyl orthosilicate (TEOS), and using polystyrene-block-poly(ethylene oxide) (PS-b-PEO) copolymers as soft-templating agents. Nanoparticles synthesis was carried out in a mixed solvent system. After spin-coating onto a macroporous silicon nitride support, silica nanoparticles were calcined under controlled conditions. An organized nanoporous layer was obtained characterized by a depth filter-like structure with internal porosity due to interparticle voids. Permeability and size-selectivity were studied by monitoring the diffusion of probe molecules under standard conditions and under the application of an external stimulus (i.e., electric field). Promising results were obtained, suggesting possible applications of these nanoporous films as selective gates for controlled transport of chemical species in solution.


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