Advances in Ion and Laser Beam Technology: Achievements of Japanese Government and University Projects

1997 ◽  
Vol 504 ◽  
Author(s):  
Isao Yamada
Keyword(s):  
Laser Beam ◽  
Ion Beam ◽  
Dielectric Materials ◽  
Ion Beams ◽  
High Rate ◽  
Laser Beams ◽  
Research Association ◽  
Technology Research ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

ABSTRACTThis paper reviews recent R&D activity in advanced beam technologies funded by MITI and JST. A large-scale national project known as AMMTRA (Advanced Material-Processing and Machining Technology Research Association) funded by MITI has made a significant contribution to industrial applications of beam processing by developing high density ion and laser beam equipment. A subsequent program, the ACTA (Advanced Chemical Processing Technology Research Association) project involves development of multi-beam deposition systems for metal and dielectric materials formation including several systems which combine ion and laser beams, ion beams and CVD and plasma, and laser beams with sputtering. NEDO Proposal Based Project and JST (The Japan Science and Technology Corporation)-Exploitation and Application Study Project are fundamentally aimed to transfer technology from university to industry. Research in gas cluster ion beam technology is currently being conducted in the following areas: (i) shallow ion implantation for 0.1 μ m PMOS junction formation, (ii) high rate etching and smoothing for Si, diamond, SiC and metal oxide films and (iii) thin film depositions for optical filter and transparent conductive film. The gas cluster ion beam processes are discussed in comparison with traditional ion beam processing methods which are presently limited by available atomic and molecular ion beams.

High rate etching of GaAs and GaP by gas cluster ion beams

2003 ◽  
Vol 792 ◽  
Author(s):  
Masahiro Nagano ◽  
Shingo Houzumi ◽  
Noriaki Toyoda ◽  
Susumu Yamada ◽  
Shirabe Akita ◽  
...  
Keyword(s):  
Cluster Size ◽  
Ion Beam ◽  
Ion Beams ◽  
High Rate ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
New Processing ◽  
Gas Cluster Ion Beam ◽  
Ar Gas ◽  
Sputtering Yields

ABSTRACTGas cluster ion beam (GCIB) techniques have recently been proposed as new processing methods. We have been investigating the characteristics of GCIB techniques through sputtering GaAs and GaP by Ar gas cluster ion beams as a function of cluster size and acceleration energy. The Ar cluster size was selected by a magnetic spectrometer, and was obtained from the mass spectra measured by a time of flight mass spectrometer. The average sputtering yields of GaAs and GaP were 0–47 and 0–66 atoms/ion for 5–30 k V, respectively. The sputtering yields of GaAs and GaP were higher than those of an Ar monomer ion.

Gas Cluster Ion Beam Technology for Nano-Fabrication

2012 ◽  
Vol 82 ◽  
pp. 1-8
Author(s):  
Noriaki Toyoda ◽  
Isao Yamada
Keyword(s):  
Ion Beam ◽  
Surface Region ◽  
Local Area ◽  
Industrial Applications ◽  
Ion Beams ◽  
Low Energy ◽  
Cluster Ions ◽  
Nano Fabrication ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

A gas cluster is an aggregate of a few to several thousands of gaseous atoms or molecules, and it can be accelerated to a desired energy after ionization. Since the kinetic energy of an atom in a cluster is equal to the total energy divided by the cluster size, a quite-low-energy ion beam can be realized. Although it is difficult to obtain low-energy monomer ion beams due to the space charge effect, equivalently low-energy ion beams can be realized by using cluster ion beams at relatively high acceleration voltages. Not only the low-energy feature but also the dense energy depositions at a local area are important characteristics of the irradiation by gas cluster ions. All of the impinging energy of a gas cluster ion is deposited at the surface region, and this dense energy deposition is the origin of enhanced sputtering yields, crater formation, shockwave generation, and other non-linear effects. GCIBs are being used for industrial applications where a nano-fabrication process is required. Surface smoothing, shallow doping, low-damage etching, trimming, and thin-film formations are promising applications of GCIBs. In this paper, fundamental irradiation effects of GCIB are discussed from the viewpoint of low-energy irradiation, sputtering, and dense energy depositions. Also, various applications of GCIB for nano-fabrications are explained.

High-speed Processing with Reactive Cluster Ion Beams

2004 ◽  
Vol 843 ◽  
Author(s):  
Toshio Seki ◽  
Jiro Matsuo
Keyword(s):  
High Speed ◽  
Ion Beam ◽  
Beam Current ◽  
Ion Beams ◽  
High Rate ◽  
Cluster Ions ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Sputtering Yield ◽  
Reactive Cluster

ABSTRACTCluster ion beam processes can produce high rate sputtering with low damage in comparison with monomer ion beam processes. Especially, it is expected that extreme high rate sputtering can be obtained using reactive cluster ion beams. Reactive cluster ion beams, such as SF6, CF4, CHF3, and CH2F2, were generated and their cluster size distributions were measured using Time-of-Flight (TOF) method. Si substrates were irradiated with the reactive cluster ions at the acceleration energy of 5–65 keV. Each sputtering yield was increased with acceleration energy and was about 1000 times higher than that of Ar monomer ions. The sputtering yield of SF6 cluster ions was about 4600 atoms/ion at 65 keV. With this beam, 12 inches wafers can be etched 0.5 μm per minute at 1 mA of beam current. The TOF measurement showed that the size of SF6 cluster was about 550 molecules and the number of fluorine atoms in a SF6 cluster was about 3300. If the sputtered product was SiF, the yield has to be less than 3300 atoms/ion. These results indicate that the reactive cluster ions etch targets not only chemically, but also physically. This high-speed processing with reactive cluster ion beam can be applied to fabricate nano-devices.

High-speed Processing with Cluster Ion Beams

2003 ◽  
Vol 792 ◽  
Author(s):  
Toshio Seki ◽  
Jiro Matsuo
Keyword(s):  
High Speed ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Ion Beams ◽  
High Rate ◽  
Cluster Ions ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Sputtering Yield ◽  
Reactive Cluster

ABSTRACTCluster ion beam processes can produce high rate sputtering with low damage in comparison with monomer ion beam processes. Especially, it is expected that extreme high rate sputtering can be obtained using reactive cluster ion beams. High current SF6 cluster ion beams were recently obtained with new modifications in the basic cluster ion beam technique. The cluster size distribution was measured with Time-of-Flight (TOF) method and the mean size of cluster was about 500 molecules. Si substrates were irradiated with SF6 cluster ions at the acceleration energy of 5–45 keV. Sputtering yield with SF6 cluster ions was increased with acceleration energy and was about 2300 atoms/ion at 45 keV. The sputtering yield was about 1000 times higher than that of Ar monomer ions and was also higher than that of Ar cluster ions. It was found that reactive sputtering occurred with SF6 cluster ion irradiation. These results indicate that high-speed fabrication can be realized with reactive cluster ion irradiation at high energy.

Lateral Sputtering by Gas Cluster Ion Beams and its Applications to Atomic Level Surface Modification

1995 ◽  
Vol 396 ◽  
Author(s):  
Isao Yamada ◽  
Jiro Matsuo
Keyword(s):  
Ion Beam ◽  
High Vacuum ◽  
Surface Cleaning ◽  
Ion Beams ◽  
Dynamics Simulation ◽  
Average Roughness ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam ◽  
Ion Size

AbstractGas cluster ion beam equipment (max. voltage 30kV) for sputtering has been developed. Cluster ion beams from gaseous materials such as Ar, O2, N2 and compound materials such as SF6, N2O, CO2 can be generated by expanding them through a Laval nozzle into a high-vacuum region. With this equipment sputtering process fundamentals have been studied. One of the unique characteristics of gas cluster ion bombardment is lateral sputtering. This is shown experimentally by measuring the angular distribution of sputtered atoms and is predicted by molecular dynamics simulation. Dependencies of sputtering yield (10-1000 times higher than for the monomer ion case) on cluster ion size and on ion beam energy for different substrate surfaces have been obtained. Examples of surface smoothing (typically less than 1 nm average roughness) on metals, semiconductors and insulators and of surface cleaning are presented.

Gas cluster ion beam processing equipment

2002 ◽  
Author(s):  
J. Bachand ◽  
A. Freytsis ◽  
E. Harrington ◽  
M. Gwinn ◽  
N. Hofmeester ◽  
...  
Keyword(s):  
Ion Beam ◽  
Processing Equipment ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

Gas Cluster Ion Beam Processing for Si Photonics

2007 ◽  
Author(s):  
N. Toyoda ◽  
l. Yamada ◽  
S. Akiyama ◽  
L.C. Kimerling ◽  
Y. Ishikawa ◽  
...  
Keyword(s):  
Ion Beam ◽  
Si Photonics ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

Ar gas cluster ion beam assisted XPS study of LiNbO3 Z cut surface

2021 ◽  
pp. 101428
Author(s):  
E.A. Skryleva ◽  
B.R. Senatulin ◽  
D.A. Kiselev ◽  
T.S. Ilina ◽  
D.A. Podgorny ◽  
...  
Keyword(s):  
Ion Beam ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam ◽  
Ar Gas ◽  
Xps Study ◽  
Cut Surface

Smoothing Thin Films with Gas-Cluster Ion Beams

2000 ◽  
Vol 614 ◽  
Author(s):  
D.B. Fenner ◽  
J. Hautala ◽  
L.P. Allen ◽  
J.A. Greer ◽  
W.J. Skinner ◽  
...  
Keyword(s):  
Thin Film ◽  
Ion Beam ◽  
Spin Valve ◽  
High Spatial Frequency ◽  
Atomic Scale ◽  
Force Microscopy ◽  
Tantalum Films ◽  
Cluster Ion Beams ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

ABSTRACTThin-film magnetic sensor and memory devices in future generations may benefit from a processing tool for final-step etching and smoothing of surfaces to nearly an atomic scale. Gas-cluster ion-beam (GCIB) systems make possible improved surface sputtering and processing for many types of materials. We propose application of GCIB processing as a key smoothing step in thin-film magnetic-materials technology, especially spin-valve GMR. Results of argon GCIB etching and smoothing of surfaces of alumina, silicon, permalloy and tantalum films are reported. No accumulating roughness or damage is observed. The distinct scratches and tracks seen in atomic-force microscopy of CMP-processed surfaces, are removed almost entirely by subsequent GCIB processing. The technique primarily reduces high spatial-frequency roughness and renders the topographic surface elevations more nearly gaussian (randomly distributed).

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