scholarly journals Morphology and Electron Emission Properties of Nanocrystalline CVD Diamond Thin Films

1997 ◽  
Vol 495 ◽  
Author(s):  
Alan R. Krauss ◽  
Dieter M. Gruen ◽  
Daniel Zhou ◽  
Thomas G. Mccauley ◽  
Lu Chang Qin ◽  
...  

ABSTRACTNanocrystalline diamond thin films have been produced by microwave plasma-enhanced chemical vapor deposition (MPECVD) using C60/Ar/H2 or CH4/Ar/H2 plasmas. Films grown with H2 concentration ≤ 20% are nanocrystalline, with atomically abrupt grain boundaries and without observable graphitic or amorphous carbon phases. The growth and morphology of these films are controlled via a high nucleation rate resulting from low hydrogen concentration in the plasma. Initial growth is in the form of diamond, which is the thermodynamic equilibrium phase for grains < 5 nm in diameter. Once formed, the diamond phase persists for grains up to at least 15–20 nm in diameter. The renucleation rate in the near-absence of atomic hydrogen is very high (∼1010 cm2sec−1), limiting the average grain size to a nearly constant value as the film thickness increases, although the average grain size increases as hydrogen is added to the plasma. For hydrogen concentrations less than ∼20%, the growth species is believed to be the carbon dimer, C2, rather than the CH3* growth species associated with diamond film growth at higher hydrogen concentrations. For very thin films grown from the C60 precursor, the threshold field (2 to ∼60 volts/micron) for cold cathode electron emission depends on the electrical conductivity and on the surface topography, which in turn depends on the hydrogen concentration in the plasma. A model of electron emission, based on quantum well effects at the grain boundaries is presented. This model predicts promotion of the electrons at the grain boundary to the conduction band of diamond for a grain boundary width ∼3–4 Å, a value within the range observed by TEM.

2009 ◽  
Vol 1242 ◽  
Author(s):  
Ramos A. Mitsuo ◽  
Martínez F. Elizabeth ◽  
Negrete S. Jesús ◽  
Torres-Villaseñor G.

ABSTRACTZinalco alloy (Zn-21mass%Al-2mass%Cu) specimens were deformed superplastically with a strain rate (ε) of 1×10-3 s-1 at homologous temperature (TH) of 0.68 (5 ). It was observed neck formation that indicate nonhomegeneus deformation. Grain size and grain boundaries misorientation changes, due superplastic deformation, were characterized by Orientation Imagining Microscopy (OIM) technique. It was studied three regions in deformed specimens and the results were compared with the results for a specimen without deformation. Average grain size of 1 mm was observed in non-deformed specimen and a fraction of 82% for grain boundary misorientation angles with a grain boundaries angles between 15° and 55° was found. For deformed specimen, the fraction of angles between 15° and 55° was decreced to average value of 75% and fractions of low angle (<5°) and high angle (>55°) misorientations were 10% and 15% respectively. The grain size and high fraction of grain boundary misorientation angles between 15° and 55° observed in the alloy without deformation, are favorable for grain rotation and grain boundary sliding (GBS) procces. The changes observed in the fraction of favorable grain boundary angles during superplastic deformation, shown that the superplastic capacity of Zinalco was reduced with the deformation.


1989 ◽  
Vol 147 ◽  
Author(s):  
Harry A. Atwater ◽  
Walter L. Brown

AbstractAmorphous Si is nucleated heterogeneously at grain boundaries during irradiation of polycrystalline Si by 1.5 MeV Xe+ ions for temperatures of 150–225°C. Following formation at grain boundaries, the amorphous Si layer grows at a rate comparable to the growth rate of a pre-existing amorphous-crystal interface, resulting in a decrease in average grain size and a marked change in the grain size distribution. The heterogeneous nucleation kinetics of amorphous Si are strongly dependent on grain boundary structure. A simple atomistic model for amorphous phase formation, which suggests that the nucleation kinetics are dependent on the point defect mobilities and grain boundary structure, is related to the experimental results.


2015 ◽  
Vol 21 (4) ◽  
pp. 927-935 ◽  
Author(s):  
Matthew M. Nowell ◽  
Michael A. Scarpulla ◽  
Naba R. Paudel ◽  
Kristopher A. Wieland ◽  
Alvin D. Compaan ◽  
...  

AbstractThe performance of polycrystalline CdTe photovoltaic thin films is expected to depend on the grain boundary density and corresponding grain size of the film microstructure. However, the electrical performance of grain boundaries within these films is not well understood, and can be beneficial, harmful, or neutral in terms of film performance. Electron backscatter diffraction has been used to characterize the grain size, grain boundary structure, and crystallographic texture of sputtered CdTe at varying deposition pressures before and after CdCl2 treatment in order to correlate performance with microstructure. Weak fiber textures were observed in the as-deposited films, with (111) textures present at lower deposition pressures and (110) textures observed at higher deposition pressures. The CdCl2-treated samples exhibited significant grain recrystallization with a high fraction of twin boundaries. Good correlation of solar cell efficiency was observed with twin-corrected grain size while poor correlation was found if the twin boundaries were considered as grain boundaries in the grain size determination. This implies that the twin boundaries are neutral with respect to recombination and carrier transport.


1981 ◽  
Vol 10 ◽  
Author(s):  
D. R. Campbell ◽  
S. Mader ◽  
W. K. Chu

ABSTRACTResistivity and grain size measurements on thin films of co-sputtered WSi2 show that the resistivity in this material is dominated by grain boundary scattering. The reflection coefficient for the transport of charge carriers through the grain boundaries was determined to be approximately 0.9.


2002 ◽  
Vol 35 ◽  
pp. 552-558 ◽  
Author(s):  
Jérôme Weiss ◽  
Jérôme Vidot ◽  
Michel Gay ◽  
Laurent Arnaud ◽  
Paul Duval ◽  
...  

AbstractWe present a detailed analysis of the microstructure in the shallow part (100–580m) of the European Project for Ice Coring in Antarctica (EPICA) ice core at Dome Concordia. In the Holocene ice, the average grain-size increases with depth. This is the normal grain-growth process driven by a reduction of the total grain-boundary energy. Deeper, associated with the Holocene–Last Glacial Maximum (LGM) climatic transition, a sharp decrease of the average grain-size is observed. to explain modifications to the microstructure with climatic change, we discuss the role of soluble and insoluble (microparticles) impurities in the grain-growth process of Antarctic ice, coupled with an analysis of the pinning of grain boundaries by microparticles. Our data indicate that high soluble impurity content does not necessarily imply a slowing-down of grain-growth kinetics, whereas the pinning of grain boundaries by dust particles located along the boundaries does explain modifications to the microstructure (small grain-sizes; change in grain-size distributions, etc.) observed in volcanic ash layers or dusty LGM ice.Moreover, classical mean-field models of grain-boundary pinning are in good quantitative agreement with the evolution of grain-size along the EPICA ice core. This suggests a major role for dust in the modification of shallow polar ice microstructure.


2007 ◽  
Vol 14 (06) ◽  
pp. 1053-1059 ◽  
Author(s):  
YONGZHONG JIN ◽  
WEI WU ◽  
DONGLIANG LIU ◽  
JIAN CHEN ◽  
YALI SUN

To investigate the initial morphological evolution of 321 stainless steel (SS) films, we examined the effect of sputtering time on the morphology of 321 SS film. In this study, a group of samples were prepared at nine different sputtering times within 20 s using radio-frequency (r.f.) magnetron sputtering and characterized by atomic force microscopy (AFM). Only globular-like grains were formed on mica substrates within 6 s, whose average grain size is ~ 21–44 nm. Meanwhile, few grains with larger size are subject to settle at the defect sites of mica substrates. At 8 s, we found large columnar crystallites with the average grain size of 61 nm. From 10 to 14 s, islands grew continuously and coalesced in order to form an interconnected structure containing irregular channels or grooves, with a depth of ~ 3.5–5 nm. Up to 16 s, a nearly continuous film was formed and some new globular-like grains were again present on the film. Study of the AFM image at 20 s suggests that the watercolor masking method designed by us is an effective method, by which we can prepare thin films with steps for the measurement of the thickness of continuous thin films. It is also found that the coverage rate of films increases with the increase in sputtering time (from 2 to 16 s). On the other hand, the increase in root mean square (RMS) roughness is much more significant from 6 to 10 s, and there is a maximum value, 2.81 nm at 10 s due to more islands during deposition. However, RMS roughness decreases with the decrease in length and width of channels or grooves from 10 to 16 s. Especially, a lower RMS roughness of 0.73 nm occurs at 16 s, because of the continuous film produced with a large coverage rate of 98.43%.


1990 ◽  
Vol 5 (11) ◽  
pp. 2414-2423 ◽  
Author(s):  
J. Narayan

We have used transmission electron microscopy techniques to study the nature of dislocations, stacking faults, twins, and grain boundaries in CVD (chemical-vapor-deposition) diamond thin films. Perfect a/2〈110〉 and partial a/6〈112〉 and a/3〈111〉 type dislocations are observed; the partial dislocations are also associated with twins and stacking faults. The most common defect in diamond thin films, particularly in 〈110〉 textured films, is Σ = 3 grain boundary or the primary twin. These twins in 〈110〉 textured films can lead to formation of fivefold microcrystallites. We have also investigated the splitting of Σ = 9 grain boundary (second order twin) into two Σ = 3 boundaries or primary twins via reaction Σ9 = 2Σ3. A rapid thermal annealing treatment has been shown to result in annealing of Σ = 3 boundaries and produce “defect-free” regions in thin films. A mechanism of annealing (removal) of Σ = 3 boundaries is discussed. Atomic structure and energetics of dislocations, twins, and grain boundaries are calculated using Tersoff potentials. The calculated atomic structure for Σ = 3 boundary is compared with high-resolution TEM images and a good agreement is obtained. These boundaries consist of periodic units of 5–7 rings which are similar to the core structure of 90° a/2〈110〉{001} dislocations. The energy of the 5–7 rings in the grain boundaries is considerably lower, due to overlapping and strain cancellation effects, than that associated with single dislocations. The 5–7 ring energy and consequently the boundary energy increases as the overlapping effects decrease. An interesting analogy between the diamond and silicon results is drawn.


Coatings ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 23
Author(s):  
Weiguang Zhang ◽  
Jijun Li ◽  
Yongming Xing ◽  
Xiaomeng Nie ◽  
Fengchao Lang ◽  
...  

SiO2 thin films are widely used in micro-electro-mechanical systems, integrated circuits and optical thin film devices. Tremendous efforts have been devoted to studying the preparation technology and optical properties of SiO2 thin films, but little attention has been paid to their mechanical properties. Herein, the surface morphology of the 500-nm-thick, 1000-nm-thick and 2000-nm-thick SiO2 thin films on the Si substrates was observed by atomic force microscopy. The hardnesses of the three SiO2 thin films with different thicknesses were investigated by nanoindentation technique, and the dependence of the hardness of the SiO2 thin film with its thickness was analyzed. The results showed that the average grain size of SiO2 thin film increased with increasing film thickness. For the three SiO2 thin films with different thicknesses, the same relative penetration depth range of ~0.4–0.5 existed, above which the intrinsic hardness without substrate influence can be determined. The average intrinsic hardness of the SiO2 thin film decreased with the increasing film thickness and average grain size, which showed the similar trend with the Hall-Petch type relationship.


2021 ◽  
Vol 196 ◽  
pp. 113748
Author(s):  
Srinivas K. Yadavalli ◽  
Mingyu Hu ◽  
Nitin P. Padture

2007 ◽  
Vol 336-338 ◽  
pp. 505-508
Author(s):  
Cheol Jin Kim ◽  
In Sup Ahn ◽  
Kwon Koo Cho ◽  
Sung Gap Lee ◽  
Jun Ki Chung

LiNiO2 thin films for the application of cathode of the rechargeable battery were fabricated by Li ion diffusion on the surface oxidized NiO layer. Bi-axially textured Ni-tapes with 50 ~ 80 μm thickness were fabricated using cold rolling and annealing of Ni-rod prepared by cold isostatic pressing of Ni powder. Surface oxidation of Ni-tapes were conducted using tube furnace or line-focused infrared heater at 700 °C for 150 sec in flowing oxygen atmosphere, resulted in NiO layer with thickness of 400 and 800 μm, respectively. After Li was deposited on the NiO layer by thermal evaporation, LiNiO2 was formed by Li diffusion through the NiO layer during subsequent heat treatment using IR heater with various heat treatment conditions. IR-heating resulted in the smoother surface and finer grain size of NiO and LiNiO2 layer compared to the tube-furnace heating. The average grain size of LiNiO2 layer was 0.5~1 μm, which is much smaller than that of sol-gel processed LiNiO2. The reacted LiNiO2 region showed homogeneous composition throughout the thickness and did not show any noticeable defects frequently found in the solid state reacted LiNiO2, but crack and delamination between the reacted LiNiO2 and Ni occurred as the reaction time increased above 4hrs.


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