Thermal- and Electromigration- Induced Stresses in Passivated AL- and Alsicu-Interconnects

1996 ◽  
Vol 436 ◽  
Author(s):  
D. Beckers ◽  
H. Schroeder ◽  
I. Eppler ◽  
W. Schilling
Keyword(s):  
Thermal Cycling ◽  
Shear Deformation ◽  
Electronic Devices ◽  
Electrical Current ◽  
Plastic Shear ◽  
Stress Evolution ◽  
X Ray Diffraction ◽  
X Ray ◽  
Experimental Parameters ◽  
Electrical Current Density

AbstractAl and Al- alloys are commonly used as interconnect materials in integrated electronic devices. Stress induced voiding and degradation of metal lines by electromigration are closely related to the stresses in the lines.We have studied the strain and stress evolution during thermal cycling, isothermal relaxation and due to electromigration in passivated Al and AlSi(l%)Cu(0.5%) lines by X-Ray diffraction with variation of experimental parameters such as the aspect ratio and the electrical current density. Furthermore the extent of voiding and plastic shear deformation has been determined from the experimental metal strains with the help of finite element calculations.Main results are: 1) During thermal cycling the voiding is less than 2 ·10−3. The extent of plastic shear deformation increases with increasing line width and with decreasing flowstress. 2) During isothermal relaxation void growth occurs but no significant change in the plastic shear deformation. 3) An electric current in the lines causes no measurable additional change of the volume averaged stresses up to line failure.

Thermal- And Electromigration- Induced Stresses In Passivated Al- And Alsicu-Interconnects

1996 ◽  
Vol 428 ◽  
Author(s):  
D. Beckers ◽  
H. Schroeder ◽  
I. Eppler ◽  
W. Schilling
Keyword(s):  
Thermal Cycling ◽  
Shear Deformation ◽  
Electronic Devices ◽  
Electrical Current ◽  
Al Alloys ◽  
Plastic Shear ◽  
Stress Evolution ◽  
Experimental Parameters ◽  
Induced Stresses ◽  
Electrical Current Density

AbstractAl and Al- alloys are commonly used as interconnect materials in integrated electronic devices. Stress induced voiding and degradation of metal lines by electromigration are closely related to the stresses in the lines.We have studied the strain and stress evolution during thermal cycling, isothermal relaxation and due to electromigration in passivated Al and AlSi(1%)Cu(0.5%) lines by Xray diffraction with variation of experimental parameters such as the aspect ratio and the electrical current density. Furthermore the extent of voiding and plastic shear deformation has been determined from the experimental metal strains with the help of finite element calculations.Main results are: 1) During thermal cycling the voiding is less than 2.10-3. The extent of plastic shear deformation increases with increasing line width and with decreasing flowstress. 2) During isothermal relaxation void growth occurs but no significant change in the plastic shear deformation. 3) An electric current in the lines causes no measurable additional change of the volume averaged stresses up to line failure.

Induced Alignment of a Solution-Cast Discotic Hexabenzocoronene Derivative for Electronic Devices Investigated by Surface X-ray Diffraction

2003 ◽  
Vol 125 (8) ◽  
pp. 2252-2258 ◽  
Author(s):  
Oliver Bunk ◽  
Martin M. Nielsen ◽  
Theis I. Sølling ◽  
Anick M. van de Craats ◽  
Natalie Stutzmann
Keyword(s):  
Electronic Devices ◽  
X Ray Diffraction ◽  
X Ray ◽  
Solution Cast

scholarly journals High temperature x-ray diffraction of zr-2.5nb during thermal cycling in vacuum

2017 ◽  
Vol 110 ◽  
pp. 01084 ◽  
Author(s):  
Mikhail Tumanov ◽  
Lyudmila Lyubimova ◽  
Evgeniy Puzyrev
Keyword(s):  
High Temperature ◽  
Thermal Cycling ◽  
X Ray Diffraction ◽  
X Ray

Controlled Synthesis of Different Morphologies of SrWO4 Crystals via a Surfactant-Assisted Hydrothermal Precipitation Method

2013 ◽  
Vol 785-786 ◽  
pp. 449-454
Author(s):  
Yan Zhao ◽  
Chun Yan Wu ◽  
Dan Qin ◽  
Xin Lai ◽  
Si Wu ◽  
...  
Keyword(s):  
Ph Value ◽  
Precipitation Method ◽  
Molar Ratio ◽  
X Ray Diffraction ◽  
X Ray ◽  
Experimental Parameters ◽  
Infrared Spectrometer ◽  
Luminescent Spectra ◽  
Hydrothermal Precipitation ◽  
Surfactant Assisted

SrWO4 octahedrons, flowers, bundles, ellipsoids and dendrites had been successfully synthesized via surfactant-assisted method. The products were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), photo-luminescent spectra techniques (PL) and fourier transrform infrared spectrometer (FTIR). By through various comparison experiments, it can be found that some related experimental parameters including the reagent concentration, [Sr2+]/[WO42-] molar ratio (R), aging temperature and the pH value had great influences on morphology of the products.

scholarly journals PREPARATION OF NICKEL NANOWIRES AND EFFECTS OF SYNTHESIS CONDITIONS ON THEIR MORPHOLOGY

2019 ◽  
Vol 57 (3A) ◽  
pp. 21
Author(s):  
Minh Truong Xuan Nguyen ◽  
Thu Thi Minh Bui ◽  
Cuc Thi Le ◽  
Linh Huu Nguyen ◽  
Y Ngoc Pham ◽  
...  
Keyword(s):  
Synthesis Process ◽  
X Ray Diffraction ◽  
One Dimensional ◽  
X Ray ◽  
Synthesis Conditions ◽  
Nickel Nanowires ◽  
Transmission Electron ◽  
Experimental Parameters ◽  
Polyol Medium ◽  
Nickel Nanostructures

Nickel nanostructures prepared by various methods have received considerable attentions due to their numerous applications. In this study, one-dimensional nickel nanowires (NiNWs) were synthesized by the reduction of nickel (II) chloride in polyol medium. Poly (vinylpyrrolidone) (PVP) served as the surfactant and hydrazine hydrate was used as the reductant. The effects of different experimental parameters, i.e. concentration of Ni2+, volume of N2H4, concentration of PVP and reaction temperature on the formation and morphology of NiNWs were studied. The structure, composition and surface morphology of the materials were characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The results showed that the morphology as well as the diameter of NiNWs could be effectively controlled by adjusting parameters of the synthesis process.

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

2011 ◽  
Vol 41 (2) ◽  
pp. 425-430 ◽  
Author(s):  
Limin Ma ◽  
Fu Guo ◽  
Guangchen Xu ◽  
Xitao Wang ◽  
Hongwen He ◽  
...  
Keyword(s):  
Solder Joints ◽  
Stress Evolution ◽  
X Ray Diffraction ◽  
X Ray

scholarly journals A Large Piezoelectric Strain Recorded in BCT Ceramics Obtained by a Modified Pechini Method

Materials ◽  
2020 ◽  
Vol 13 (7) ◽  
pp. 1620 ◽  
Author(s):  
Lucjan Kozielski ◽  
Agnieszka Wilk ◽  
Mirosław M. Bućko ◽  
Juras Banys
Keyword(s):  
Pechini Method ◽  
Electronic Devices ◽  
Ceramic Technology ◽  
X Ray Diffraction ◽  
Sensors And Actuators ◽  
X Ray ◽  
Lead Titanate Zirconate ◽  
Modified Pechini Method ◽  
Piezoelectric Strain ◽  
The Many

There is a strong need in the industry to develop lead-free piezoelectrics for sensors and actuators. Although these materials have become an important component of many electronic devices, it is very important for the industry to decarbonise ceramic technology, especially through the introduction of modern sintering technologies. Among the many piezoelectric compounds available, Calcium Barium Titanate (BCT) have been widely investigated because of its similar performance to lead-containing Lead Titanate Zirconate (PZT). In this paper, a modified Pechini method for obtaining ceramic Ba0.9Ca0.1TiO3 nano-powders is described. Deviation from the established procedure resulted in the precipitation of the solution or obtaining of a low-quality (poorly crystallized) product with numerous impurities. The samples of BCT materials were examined to find their ideal microstructures and structures; these factors were confirmed by their outstanding X-ray diffraction spectra and high piezoelectric constant values that are comparable to commercial lead-containing materials.

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