Bonded-H in Gate Dielectrics Deposited by Plasma Assisted Chemical Vapor Deposition and Subjected to Rapid Thermal Annealing
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AbstractThe incorporation of bonded nitrogen into ultra thin SiO2 gate dielectrics has become an important technology issue. Nitrogen atoms bonded in the immediate vicinity of the Si-SiO2 interface improve device reliability in n-channel field effect transistors. N- atom incorporation at the monolayer concentration range has been achieved by remote plasma assisted oxidation in N2O at 300°C. The incorporation mechanism and the stability of bonded-N are discussed.
2017 ◽
Vol 27
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pp. 1606469
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1999 ◽
Vol 38
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pp. L1099-L1101
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2020 ◽
Vol 67
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pp. 1839-1844
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1993 ◽
Vol 11
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pp. 1176
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2020 ◽
Vol 15
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pp. 673-678