The Microstructure and Properties of Layered Oxide Thin Films Fabricated by MOCVD

1995 ◽  
Vol 415 ◽  
Author(s):  
Tingkai Li ◽  
Yongfei Zhu ◽  
Seshu B. Desu ◽  
Masaya Nagata

ABSTRACTFor the first time, layered oxide thin films of SrBi2Ta2O9 (SBT) with very good ferroelectric properties have been prepared by direct-liquid-injection MOCVD technique. The SBT films were deposited onto both Pt/Ti/SiO2/Si wafers and single-crystal sapphire substrates to measure their phase formation, microstructure and ferroelectric properties. Crystalline SBT phase had been observed at temperatures as low as 500°C. With increasing deposition temperature above 500°C, the grain size of SBT thin films was increased from 0.01 μ m to 0.2 μm. The films were found to be dense and homogenous. Typically, SBT thin films of 200 nm thick with grain size about 0. 1μm have 2Pr around 10 μC/cm2 at 5V, Ec 55.7 kV/cm, and dielectric constant around 100. The leakage 9 2 currents were as low as 8 × 10−9 A/cm2 at 150 kV/cm. The films also showed fatigue-free characteristics: no fatigue was observed up to 1.4 × 1010 switching cycles. This development of MOCVD technique for good quality SBT films make their integration into high density nonvolatile memories relatively easy.

2015 ◽  
Vol 589 ◽  
pp. 246-251 ◽  
Author(s):  
N. Zanfoni ◽  
L. Avril ◽  
L. Imhoff ◽  
B. Domenichini ◽  
S. Bourgeois

2003 ◽  
Vol 59 (1) ◽  
pp. 1483-1489 ◽  
Author(s):  
Young Jin Cho ◽  
Yo-Sep Min ◽  
Jung-Hyun Lee ◽  
Bum-Seok Seo ◽  
June Key Lee ◽  
...  

2017 ◽  
Vol 19 (8) ◽  
pp. 1700193 ◽  
Author(s):  
Mattias Vervaele ◽  
Bert De Roo ◽  
Jolien Debehets ◽  
Marilyne Sousa ◽  
Luman Zhang ◽  
...  

2004 ◽  
Vol 10 (1) ◽  
pp. 13-17 ◽  
Author(s):  
H.C. Aspinall ◽  
J. Gaskell ◽  
P.A. Williams ◽  
A.C. Jones ◽  
P.R. Chalker ◽  
...  

1996 ◽  
Vol 446 ◽  
Author(s):  
Tingkai Li ◽  
Pete Zawadzkp ◽  
Richard A. Stall ◽  
Yongfei Zhu ◽  
Seshu B. Desu

AbstractNanoscale oxide thin films such as Ba1‐xSrxTiO3 (BST), SrBi2Ta2O9 (SBT), and PbZr1‐xTixO3 (PZT) that have a high dielectric constant and excellent ferroelectric properties have been receiving greatly increased attention, especially for high density memories in next generation integrated circuits. However, with increasing deposition temperature the surface roughness of the films increases, which results in high leakage current, and when the thickness of oxide films is decreased, the apparent bulk‐like properties of thin films tend to worsen due to the increased influence of the interface. To solve these problems, novel MOCVD techniques, plasma enhanced deposition, and a two step process, were developed for high quality oxide thin films.


2002 ◽  
Vol 16 (28n29) ◽  
pp. 4469-4474 ◽  
Author(s):  
KYOUNG-TAE KIM ◽  
CHANG-IL KIM ◽  
DONG-HEE KANG ◽  
IL-WUN SHIM

The Bi 3.25 La 0.75 Ti 3 O 12 (BLT) thin films were prepared by metalorganic decomposition method. The effect of grain size on the ferroelectric properties during crystallization were investigated by x-ray diffraction and field emission scanning electron microscope. The grain size and the roughness of BLT films increase with increasing of drying temperature. The leakage current densities of the BLT thin film with large grains are higher than that with small grains. The remanent polarization of BLT increase with increasing grain size. As compared BLT with small grain size, the BLT film with larger grain size shows better fatigue properties. This may be explained that small grained films shows more degradation of switching charge than large grained films.


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