Characterization of AlGaAs/GaAs Heterojunction Bipolar Transistors Using Photoreflectance and Spectral Ellipsometry

1995 ◽  
Vol 406 ◽  
Author(s):  
Patricia B. Smith ◽  
Tae S. Kim ◽  
Lissa K. Magel ◽  
Walter M. Duncan ◽  
A. Vance Ley ◽  
...  
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Electrical Characterization ◽  
Contact Layer ◽  
Bipolar Transistors ◽  
Spectral Ellipsometry ◽  
Depth Profiles ◽  
Auger Electron Spectroscopy Depth ◽  
Capacitance Voltage ◽  
Layer Composition

AbstractPhotoreflectance spectroscopy (PR) and spectral ellipsometry (SE) have been used to characterize the doping and structure of heterojunction bipolar transistors (HBT). This information provides a more complete description of the epitaxial HBT structure than is possible by relying solely on electrical characterization of specially processed test structures. Additional benefit is derived from the nondestructive nature of both SE and PR. The measurements are fast enough to be implemented on all production-bound HBT material. We describe our recent results comparing capacitance-voltage measurements with PRderived doping levels in the emitter layer of the HBT. We also describe some work comparing SE fit results with Auger electron spectroscopy depth profiles for InGaAs contact layer composition and thickness.

Thermal characterization of thermally-shunted heterojunction bipolar transistors

1996 ◽  
Vol 17 (1) ◽  
pp. 19-21 ◽  
Author(s):  
J. Sewell ◽  
L.L. Liou ◽  
D. Barlage ◽  
J. Barrette ◽  
C. Bozada ◽  
...  
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Thermal Characterization ◽  
Bipolar Transistors

Microstructural Characterization of High-Pressure Oxidized Si1-x Gex /Si Heterolayers

1992 ◽  
Vol 280 ◽  
Author(s):  
N. David Theodore ◽  
Gordon Tam
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Atmospheric Pressure ◽  
High Pressures ◽  
Microstructural Characterization ◽  
Bipolar Transistors ◽  
Pure Silicon ◽  
Device Structures ◽  
Microstructural Behavior ◽  
Very High

ABSTRACTSiGe alloys have recently been of interest for fabrication of heterojunction bipolar transistors using pre-existing or modified silicon-processing technology. These devices are faster than devices using pure silicon. Because of the interest in developing SiGe device structures, various elements of processing relevant to fabrication of the devices are being investigated. One such element has been the use of thermal oxidation for isolation of SiGe devices. Utilization of the technique requires an understanding of oxidation behavior of SiGe layers under a variety of oxidation conditions. Past studies in the literature have investigated the oxidation of SiGe at atmospheric pressure or at very high pressures (∼650–1300 atmospheres). The present study investigates the wet-oxidation of SiGe structures at intermediate pressures (∼25 atmospheres) and temperatures (∼750°C). Unlike atmospheric oxidation, most of the Ge (from SiGe) remains in the oxidized silicon (SiO2) in the form of GeO2. Occasional segregation of Ge to the oxidizing interface is noted. The microstructural behavior of partially and entirely oxidized structures is presented.

Fabrication and Characterization of InP Heterojunction Bipolar Transistors with Emitter Edges Parallel to [001] and [010] Crystal Orientations

1999 ◽  
Vol 38 (Part 1, No. 2B) ◽  
pp. 1200-1203 ◽  
Author(s):  
Noureddine Matine ◽  
Martin W. Dvorak ◽  
Jean-Luc Pelouard ◽  
Fabrice Pardo ◽  
Colombo R. Bolognesi
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Crystal Orientations ◽  
Fabrication And Characterization

Characterization of InGaP/GaAs Heterojunction Bipolar Transistors with a Heavily Doped Base

2001 ◽  
Vol 40 (Part 1, No. 9A) ◽  
pp. 5221-5226 ◽  
Author(s):  
Tohru Oka ◽  
Kiyoshi Ouchi ◽  
Kazuhiro Mochizuki
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Heavily Doped

Electrical Characterization of In Schottky Contacts to Epitaxial n-In0.46Ga0.54P Grown on n+-GaAs by Mocvd

1996 ◽  
Vol 448 ◽  
Author(s):  
N. Marcano ◽  
A. Singh
Keyword(s):  
Barrier Height ◽  
Thermionic Emission ◽  
Electrical Characterization ◽  
Interface Layer ◽  
Zero Bias ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Direct Current Voltage ◽  
Etched Surface

AbstractIn/n-In0.46Ga0.54P Schottky diode was fabricated by thermal evaporation of In on chemically etched surface of In0.45Ga0.54P:Si epitaxial layer grown on highly doped n type GaAs. The In metal formed a high quality rectifying contact to In0.46Ga0.54P:Si with a rectification ratio of 500. The direct current-voltage/temperature (I-V/T) characteristics were non-ideal with the values of the ideality factor (n) between 1.26-1.78 for 400>T>260 K. The forward I-V data strongly indicated that the current was controlled by the generation-recombination (GR) and thermionic emission (TE) mechanisms for temperature in the range 260-400 K. From the temperature variation of the TE reverse saturation current, the values of (0.75±0.05)V and the (4.5±0.5)×10-5 Acm-2K-2 for the zero bias zero temperature barrier height (φoo) and modified effective Richardson constant were obtained. The 1 MHz capacitance-voltage (C-V) data for 260 K < T < 400 K was analyzed in terms of the C-2-V relation including the effect of interface layer to obtain more realistic values of the barrier height (φbo). The temperature dependence of φbo was described the relation φbo =(0.86±10.03) - (8.4±0.7)×l0-4T. The values of φoo, obtained by the I-V and C-V techniques agreed well.

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