Characterization of Atmospheric Impurities in Tungsten Silicide Films by Secondary Ion Mass Spectrometry (SIMS)

1995 ◽  
Vol 402 ◽  
Author(s):  
Salman Mitha ◽  
David B. Sams
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Relative Sensitivity ◽  
Areal Density ◽  
Primary Beam ◽  
Tungsten Silicide ◽  
Secondary Ions ◽  
Signal Change ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

AbstractConcentrations of atmospheric impurities in tungsten silicide films and impurity areal densities silicide / polysilicon interface can usually only be measured using Secondary Ion Mass Spectrometry (SIMS). Normally these measurements are made using a Cs+ primary beam with negative secondary ions being monitored. This mode is used to achieve the best possible detection limits. However the Relative Sensitivity Factors (RSFs) used to quantify the impurities, as well as the reference matrix signal, change dramatically in going from one matrix to the other. These changes affect the quantification of the impurities at the interface. An alternate mode of analysis would be to use the Cs+ primary beam and monitor MCs+ ions, where M is the impurity, because these ions typically have less matrix dependent RSFs. We measure carbon and oxygen in a tungsten silicide film on polysilicon using both modes of analysis. Preliminary data indicates that we have determined the absolute accuracy of interface areal density to within a factor of 2.2 for oxygen and to within a factor of 1.5 for carbon.

Applications of Time-OF-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)

1990 ◽  
Vol 48 (2) ◽  
pp. 308-309
Author(s):  
Bruno Schueler ◽  
Robert W. Odom
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Structural Information ◽  
Time Of Flight ◽  
Biological Tissues ◽  
Polymer Surfaces ◽  
Tof Sims ◽  
Secondary Ions ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Time-of-flight secondary ion mass spectrometry (TOF-SIMS) provides unique capabilities for elemental and molecular compositional analysis of a wide variety of surfaces. This relatively new technique is finding increasing applications in analyses concerned with determining the chemical composition of various polymer surfaces, identifying the composition of organic and inorganic residues on surfaces and the localization of molecular or structurally significant secondary ions signals from biological tissues. TOF-SIMS analyses are typically performed under low primary ion dose (static SIMS) conditions and hence the secondary ions formed often contain significant structural information.This paper will present an overview of current TOF-SIMS instrumentation with particular emphasis on the stigmatic imaging ion microscope developed in the authors’ laboratory. This discussion will be followed by a presentation of several useful applications of the technique for the characterization of polymer surfaces and biological tissues specimens. Particular attention in these applications will focus on how the analytical problem impacts the performance requirements of the mass spectrometer and vice-versa.

Quantitation of Secondary Ion Mass Spectrometry (SIMS) for HgCdTe.

1983 ◽  
Vol 25 ◽  
Author(s):  
Lawrence E. Lapides ◽  
George L. Whiteman ◽  
Robert G. Wilson
Keyword(s):  
Mass Spectrometry ◽  
Ion Implantation ◽  
Ionization Potential ◽  
Electron Affinity ◽  
Secondary Ion Mass Spectrometry ◽  
Relative Sensitivity ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Sensitivity Factors ◽  
Secondary Ion

ABSTRACTQuantitative depth profiles of impurities in LPE layers of HgCdTe have been determined using relative sensitivity factors calculated from ion implantation profiles. Standards were provided for Li, Be, B, C, F, Na, Mg, Al, Si, P, S, Cl, Cu, Ga, As, Br, and In. Relative sensitivity factors as a function of ionization potential for O2+ primary ion SIMS and electron affinity for Cs+ primary ion SIMS have been calculated in order to extend quantitation to elements not yet implanted. Examples of depth profiles for implant standards and unimplanted layers are given.

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