Thermal Stability of Ion Implanted, Laser Annealed Films

1981 ◽  
Vol 4 ◽  
Author(s):  
S. R. Wilson ◽  
W. M. Paulson ◽  
G. Tam ◽  
R. B. Gregory ◽  
C. W. White ◽  
...  

ABSTRACTElectrical measurements and Rutherford backscattering have been used to evaluate the thermal stability of single crystal and polycrystalline Si films that were ion implanted and laser annealed. The films were implanted with 75As or 31p and annealed with either a pulsed ruby, a pulsed Nd:YAG or a CW­Ar+ laser. The samples were then thermally annealed at temperatures between 450 and 900°C. The single crystal samples implanted with arsenic below 1 × 10-15 cm−2 were thermally stable. For higher doses the electrical concentration reaches a minimum at 800°C. The same trends are observed in the polysilicon films for sufficiently high doping levels. RBS shows that As is precipitating at 700°C in single crystal material and has begun to go back into solution at 900°C for concentrations of ∼7 × 1020 cm−3. Similar trends are observed for 31P implanted samples.

2008 ◽  
Vol 1079 ◽  
Author(s):  
Kazuya Okubo ◽  
Kazuo Kawamura ◽  
Shinich Akiyama ◽  
Yasutoshi Kotaka ◽  
Tsukasa Itani ◽  
...  

ABSTRACTWe report NiSi and Ni(Pt)Si films with excellent thermal stability showing a particular crystal orientation on Si(001). The Ni-silicide film with a deposition temperature of about 200 °C consists of a conformal domain structure. We examined detail crystallographic analysis of silicide and clarified the psudo-epitaxial growth of NiSi(202)//Si(220) [or NiSi(211)//Si(220)] was the key scheme of superior thermal stability. By using this optimized Ni-silicide formation process, we have fabricated Ni-silicide that is thermally stable up to 650 °C and shows low fluctuation in sheet resistance and low leakage current in electrical measurements. This process is a promising candidate for future silicidation technology.


Author(s):  
J. S. Mills ◽  
F. R. Edwards

The propensity of aviation turbine fuels to produce deposits in the oil-cooler and filter sections of aircraft fuel systems has been examined using a rig that simulates the fuel system of an aircraft and which employs realistic flow rates. All the fuels examined were found to be thermally stable up to temperatures in excess of those currently attained in engine oil coolers. Comparison with results obtained with the JFTOT indicates that this is not suited for use as a research tool.


1993 ◽  
Vol 73 (11) ◽  
pp. 7969-7971 ◽  
Author(s):  
Qixin Guo ◽  
Osamu Kato ◽  
Akira Yoshida

2002 ◽  
Vol 81 (21) ◽  
pp. 3996-3998 ◽  
Author(s):  
K. Ip ◽  
M. E. Overberg ◽  
Y. W. Heo ◽  
D. P. Norton ◽  
S. J. Pearton ◽  
...  

2020 ◽  
Vol 46 (7) ◽  
pp. 9192-9197 ◽  
Author(s):  
Liaoyuan Zhang ◽  
Wenping Geng ◽  
Xi Chen ◽  
Yimeng Li ◽  
Xiaojun Qiao ◽  
...  

1987 ◽  
Vol 46 (4) ◽  
pp. 364-368
Author(s):  
S. A. Batishche ◽  
N. I. Danilovich ◽  
V. A. Mostovnikov ◽  
A. M. Pristrem ◽  
G. A. Tatur

2016 ◽  
Vol 45 (2) ◽  
pp. 831-840 ◽  
Author(s):  
Kasper T. Møller ◽  
Morten B. Ley ◽  
Pascal Schouwink ◽  
Radovan Černý ◽  
Torben R. Jensen

Synthesis of new thermally stable perovskite-type metal strontium borohydrides, MSr(BH4)3 (M = K, Rb, Cs).


1990 ◽  
Vol 182 ◽  
Author(s):  
J. R. Phillips ◽  
P. Revesz ◽  
J. O. Olowolafe ◽  
J. W. Mayer

AbstractThe thermal stability of Co silicide on single crystal and polycrystalline Si has been investigated. Co films were evaporated onto (100) Si and undoped polycrystalline Si and annealed in vacuum. Resulting silicide films were examined using Rutherford backscattering spectroscopy, scanning electron microscopy, electron—induced x—ray spectroscopy, and sheet resistivity measurements. We find that CoSi2 on single crystal (100) Si remains stable through 1000ºC. In contact with undoped polycrystalline Si, intermixing begins at temperatures as low as 650ºC for 30min annealing. The Co silicide and Si layers are intermixed after 750ºC 30min annealing, giving islands of Si surrounded by silicide material, with both components extending from the surface down to the underlying oxide layer. The behavior of CoSi2 contrasts with results reported for TiSi2 which agglomerates on single crystal Si around 900ºC but is stable on polycrystalline silicon as high as 800ºC. Resistivity measurements show that the Co silicide remained interconnected despite massive incursion by Si into the silicide layer.


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