Calorimetric Study of the Energetics and Kinetics of Interdiffusion in Cu/Cu6sn5 Thin Film Diffusion Couples

1995 ◽  
Vol 398 ◽  
Author(s):  
W. K. Neils ◽  
R. R. Chromik ◽  
K. F. Dreyer ◽  
D. Grosman ◽  
E. J. Cotts
Keyword(s):  
Differential Scanning Calorimetry ◽  
Bulk Diffusion ◽  
Heat Of Formation ◽  
Calorimetric Study ◽  
Diffusion Couples ◽  
Scanning Calorimetry ◽  
Metal Diffusion ◽  
Diffusion Limited ◽  
Thin Film Diffusion ◽  
Kinetics Of

ABSTRACTWe find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiflusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu6Sn5 diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu3Sn from Cu6Sn5 and Cu thin films was found to be ΔHr = −4.3 + 0.3 kJ/mol. Portions of our differential scanning calorimetry scans are identified with diffusion limited growth of Cu3Sn. From these calorimetry data we have estimated D(cm2 / s) = Do exp(−E / kbT), where kb is Boltzmann's constant, D0 = 3.2 × 10–2 cm2/s, and E=0.87 eV/atom.

The Formation of Cu3Si from Cu/a-Si Multilayers

1997 ◽  
Vol 481 ◽  
Author(s):  
R. R. Chromik ◽  
W. K. Neils ◽  
E. J. Cotts
Keyword(s):  
Diffusion Couples ◽  
X Ray Diffraction ◽  
Limited Growth ◽  
Scanning Calorimetry ◽  
Individual Layer ◽  
Diffusion Limited ◽  
Reaction Constant ◽  
Multilayered Composites ◽  
Reaction Constants ◽  
Kinetics Of

ABSTRACTThe kinetics of the formation of Cu3Si in Cu/a-Si diffusion couples have been investigated by means of differential scanning calorimetry and x-ray diffraction. Multilayered composites of average stoichiometry Cu3Si were prepared by sputter deposition with individual layer thicknesses varying in different samples between 2 and 100 nm. We observed diffusion limited growth of Cu3 Si upon annealing these diffusion couples below 500 K. Reaction constants were measured for a temperature range of 455 to 495 K for thicknesses of growing Cu3Si between 2.6 and 80 nm. The temperature dependence of the reaction constant, k2, was characterized as k2 = k0 exp(− Ea/kbT) with activation energy, Ea = 1.0 eV/atom and pre-factor, k0 = 1.9×10−3 cm2/s.

Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin‐film diffusion couples

1995 ◽  
Vol 67 (19) ◽  
pp. 2795-2797 ◽  
Author(s):  
K. F. Dreyer ◽  
W. K. Neils ◽  
R. R. Chromik ◽  
D. Grosman ◽  
E. J. Cotts
Keyword(s):  
Thin Film ◽  
Calorimetric Study ◽  
Diffusion Couples ◽  
Film Diffusion ◽  
Thin Film Diffusion ◽  
Kinetics Of

A Study of the Kinetics and Energetics of Solid State Reactions in Pd/Sn Diffusion Couples

1995 ◽  
Vol 398 ◽  
Author(s):  
R.R. Chromik ◽  
E. J. Cotts
Keyword(s):  
Differential Scanning Calorimetry ◽  
Solid State ◽  
Heat Of Formation ◽  
Solid State Reactions ◽  
Diffusion Couples ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
Limited Temperature ◽  
Reaction Constant ◽  
Limited Temperature Range

ABSTRACTUsing differential scanning calorimetry, supplemented by measurements from scanning electron microscopy images, we have investigated solid state reactions in Pd/Sn multilayer composites to form PdSn4 and PdSn3. Planar diffusion couples of Pd and Sn were prepared by means of mechanical co-deformation in a rolling mill. A phase formation sequence was determined using differential scanning calorimetry and x-ray diffraction. Growth of the PdSru phase was studied from room temperature to the melting point of Sn. For temperatures between 430 and 460K diffusion limited growth of PdSn4 was observed. From heat flow data over this limited temperature range, the form of the reaction constant was found to be k2 −k0 exp(−Ea / kbT), where k0= 0.16 cm2/s and Εn= 0.8 eV/atom. Also determined was a heat of formation, ΔHf = −27±1 kJ/mol for PdSn4 from Pd and Sn.

scholarly journals Calorimetric study on Bi-Cu-Sn alloys

2019 ◽  
Vol 38 (2019) ◽  
pp. 541-546
Author(s):  
Jolanta Romanowska
Keyword(s):  
Differential Scanning Calorimetry ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Temperature Interval ◽  
Energy Dispersive Spectrometer ◽  
Energy Dispersive ◽  
Calorimetric Study ◽  
Calorimetric Investigation ◽  
Scanning Calorimetry ◽  
Scanning Electron

AbstractThe paper presents results of calorimetric investigation of the Bi-Cu-Sn system by means of differential scanning calorimetry (DSC) at the temperature interval 25-1250∘C, Values of liquidus, solidus and invariant reactions temperatures, as well as melting enthalpies of the selected alloys were determined. Microstructure investigation of the alloys were performed by the use of a scanning electron microscope (SEM) equipped with an energy-dispersive spectrometer (EDS).

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