Controls of Crystallinity and Surface Roughness of Cu Film in Partially Ionized Beam Deposition

1995 ◽  
Vol 396 ◽  
Author(s):  
Seok-Keun Koh ◽  
Ki-Hwan Kim ◽  
Won-Kook Choi ◽  
Hong-Gui Jang ◽  
Young-Soo Yoon ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ionization Potential ◽  
Relative Intensity ◽  
Intensity Ratio ◽  
Ion Beam ◽  
Average Energy ◽  
Relative Intensity Ratio ◽  
Cu Films ◽  
Acceleration Potential ◽  
Residual Gas

AbstractChanges of crystallinity and surface roughness are discussed in terms of the average energy per deposited atom in the partially ionized beam(PIB) deposition. The average energy per deposited atom can be controlled by adjusting the ionization potential, Vi and acceleration potential, Va. The ion beam consists of a Cu ion beam and residual gas ion beam and residual gases as well as Cu particles that were ionized and accelerated to provide the film with energy required for film-growth. The relative contribution of residual gas ions and Cu ions to total average energy per deposited atom was varied with the ionization potential. At fixed ionization potentials of Vi=400 V and Vi=450 V, the average energy per deposited atom was varied in the range of 0 to 120 eV with acceleration potential Va, of 0 to 4 kV. The relative intensity ratio, 1(111)/I(200), of the Cu films increased from 6 to 37 and the root mean square(Rms) surface roughness decreased with an increase in acceleration potential at Vi=400 V. The relative intensity ratio, I(lll)/I(200), of Cu films increased up to Va=2 kV at Vi=2 kV, above which a decrease occurred, and the surface roughness of Cu films increased as a funtion of acceleration potential. The degree of preferred orientation was closely related with the average energy per deposited atom. The change of Rms roughness might be affected by ion flux, particle energy and preferred orientation.

scholarly journals Raman Spectroscopy Analysis of Free Fatty Acid in Olive Oil

2019 ◽  
Vol 9 (21) ◽  
pp. 4510
Author(s):  
Jin Qiu ◽  
Hua-Yi Hou ◽  
In-Sang Yang ◽  
Xiang-Bai Chen
Keyword(s):  
Raman Spectroscopy ◽  
Fatty Acid ◽  
Free Fatty Acid ◽  
Olive Oil ◽  
Relative Intensity ◽  
Intensity Ratio ◽  
Green Laser ◽  
Critical Parameters ◽  
Vibrational Modes ◽  
Relative Intensity Ratio

Free fatty acid (FFA) is one of the most critical parameters for evaluating the quality of olive oil. In this paper, we present a simple and rapid Raman spectroscopy method for analyzing free fatty acid in olive oil. First, FFA degradation of carotenoids in olive oil is confirmed by analyzing the relative intensity of characteristic vibrational modes and introducing an intensity decrease factor. Second, it is demonstrated that the relative intensity ratio of the two characteristic vibrational modes at 1525 cm−1 and 1655 cm−1 presents a good and rapid analysis of FFA content in olive oil; the relative intensity ratio decreases linearly with FFA content. In addition, resonance Raman scattering of carotenoid is discussed, showing that a green laser should be utilized to study FFA in olive oil.

Hydrogen Ion Beam Processing of Single Crystal Diamond Chips

1994 ◽  
Vol 354 ◽  
Author(s):  
Shuji Kiyohara ◽  
Iwao Miyamoto
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Incidence Angle ◽  
Ion Beam ◽  
Etching Rate ◽  
Hydrogen Ion ◽  
Hydrogen Ions ◽  
Ion Beam Etching ◽  
Single Crystal Diamond ◽  
Before And After

AbstractIn order to apply ion beam etching with hydrogen ions to the ultra-precision processing of diamond tools, hydrogen ion beam etching characteristics of single crystal diamond chips with (100) face were investigated. The etching rate of diamond for 500 eV and 1000 eV hydrogen ions increases with the increase of the ion incidence angle, and eventually reaches a maximum at the ion incidence angle of approximately 50°, then may decrease with the increase of the ion incidence angle. The dependence of the etching rate on the ion incidence angle of hydrogen ions is fairly similar to that obtained with argon ions. Furthermore, the surface roughness of diamond chips before and after hydrogen ion beam etching was evaluated using an atomic force microscope. Consequently, the surface roughness after hydrogen ion beam etching decreases with the increase of the ion incidence angle within range of the ion incidence angle of 60°.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

scholarly journals J111022 Changes of Surface Roughness and Surface Energy of Glass Surfaces with Gas Cluster Ion Beam Treatment

2011 ◽  
Vol 2011 (0) ◽  
pp. _J111022-1-_J111022-3
Author(s):  
Katsuya NAMBA ◽  
Hiroyuki SAKAKIBARA ◽  
Hedong ZHANG ◽  
Yasunaga MITSUYA ◽  
Kenji FUKUZAWA ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Energy ◽  
Ion Beam ◽  
Ion Beam Treatment ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam ◽  
Glass Surfaces

Low energy ion beam machining of ULE® substrates: Evaluation of surface roughness

2009 ◽  
Vol 86 (4-6) ◽  
pp. 497-499 ◽  
Author(s):  
Takuro Inaba ◽  
Yuichi Kurashima ◽  
Shahjada A. Pahlovy ◽  
Iwao Miyamoto ◽  
Manabu Ando ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ion Beam ◽  
Low Energy

Surface roughness of a Co-less WC micro-die fabricated by focused-ion-beam machining

2004 ◽  
Vol 84 (3) ◽  
pp. 149-155 ◽  
Author(s):  
Hiroyuki Hosokawa ◽  
Koji Shimojima ◽  
Mamoru Mabuchi
Keyword(s):  
Surface Roughness ◽  
Focused Ion Beam ◽  
Ion Beam

Features of metal destruction under pulse laser and beam-plasma exposure

2020 ◽  
Vol 10 ◽  
pp. 34-47
Author(s):  
V. A. Gribkov ◽  
◽  
S. V. Latyshev ◽  
V. N. Pimenov ◽  
S. A. Maslayev ◽  
...  
Keyword(s):  
High Pressure ◽  
Laser Radiation ◽  
Solid Phase ◽  
Ion Beam ◽  
Pulsed Laser ◽  
Average Energy ◽  
Destructive Effect ◽  
Pulsed Laser Radiation ◽  
Beam Plasma ◽  
Metal Materials

The features of the destructive effect of high-pressure generated under comparable conditions, namely, upon irradiation of target samples with pulsed laser radiation and beam-plasma flows created in Plasma Focus (PF) devices, on metal materials were studied. In both cases, close parameters of radiation-heat treatment were provided: power density q ~ 1010–1011 W/cm2 and pulse duration τ ~ 10 –100 ns. It have been shown that the double exposure of laser radiation to thin samples of vanadium and molybdenum with a thickness of 0.3 mm and 0.1 mm, respectively, leads to the formation of molten zones in the materials, inside which there were deep craters. The craters extended over the entire thickness of the samples, on the reverse side of which the recesses end with holes of ~ 0.1 mm for V and 0.2 mm for Mo. In a tungsten sample 0.2 mm thick, the depth of the craters in the molten zone was less than its thickness and there were microcracks on the back of the sample. Based on numerical estimates of the process under study, it was suggested that the observed effects are associated with the creation of high pressure zones of ~ 1 – 10 GPa in the irradiated targets, localized in microregions of radius r ~ 0.1 mm. In these zones, the behavior of the solid phase of the target materials, for which the tensile strength σB ≤ 1 GPa (V, Mo, W), under high pressure became close to the behavior of the liquid. The pseudo-liquid phase of the material was displaced from the center of the crater, where the pressure was maximum, to its periphery to the region of low pressure with the subsequent release of matter from the target through the irradiated surface at a speed of ~ 103 m/s. In experiments using the PF, the mechanism responsible for the formation of craters when a powerful pulsed laser radiation is applied to the target is not realized due to the different nature of the distribution of the absorbed energy density in the surface layer of the irradiated sample. The region in which the energy absorbed during the of particles implantation into the material was determined mainly by the average energy and the diameter of the ion beam (Еi ≈ 100  keV, d ~ 2 – 10 mm) and exceeds by one or two orders of magnitude the corresponding volume under laser irradiation.

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