Depth Profiles of Medium Energy Phosphorus Implants into Silicon

1995 ◽  
Vol 396 ◽  
Author(s):  
J. P. Lavine ◽  
L. Zheng ◽  
P. M. Whalen ◽  
D. F. Downey
Keyword(s):  
Crystal Structure ◽  
Experimental Data ◽  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Silicon Crystal ◽  
Medium Energy ◽  
Depth Profiles ◽  
Present Experimental Data ◽  
Phosphorus In Silicon ◽  
Secondary Ion

AbstractSecondary ion mass spectrometry (SIMS) is used to produce depth profiles of ion-implanted phosphorus in silicon. The implant energies are 250, 500, and 750 keV, and there is a 0.06-μm thick oxide on the silicon. The experimental profiles are compared with predictions from a variety of simulation programs, most of which give larger projected ranges than the data. The silicon crystal structure needs to be included in the calculations to produce projected ranges and depth profiles that agree with the present experimental data and with data from the literature.

Dissociation of Deuterium-Defect Complexes in Ion-Implanted Epitaxial 4H-SiC

1998 ◽  
Vol 513 ◽  
Author(s):  
M. Janson ◽  
M. K. Linnarsson ◽  
A. Hallén ◽  
B. G. Svensson
Keyword(s):  
Experimental Data ◽  
Mass Spectrometry ◽  
Monte Carlo ◽  
Depth Distribution ◽  
Secondary Ion Mass Spectrometry ◽  
Depth Profiles ◽  
Defect Complexes ◽  
Induced Defects ◽  
Secondary Ion ◽  
Anneal Time

ABSTRACTEpitaxial layers of low doped 4H-SiC are implanted with 20 keV 2H+ ions to a dose of 1×1015 cm−2. The samples are subsequently annealed at temperatures ranging from 1040 to 1135 °C. Secondary ion mass spectrometry is used to obtain the concentration versus depth profiles of the atomic deuterium in the samples. It is found that the concentration of implanted deuterium decreases rapidly in the samples as a function of anneal time.The experimental data are explained by a model where the deuterium migrates rapidly and becomes trapped and de-trapped at implantation-induced defects which exhibit a slightly shallower depth distribution than the implanted deuterium ions. Computer simulations using this model, in which the damage profile is taken from Monte Carlo simulations and the surface is treated as a perfect sink for the diffusing deuterium atoms, are performed with good results compared to the experimental data. The complexes are tentatively identified as carbon-deuterium at a Si-vacancy and a dissociation energy (ED) of approximately 4.9 eV is extracted for the deuterium-vacancy complexes.

Thermal Annealing of Shallow Implanted Phosphorus in Si(100)

1991 ◽  
Vol 235 ◽  
Author(s):  
Ning Yu ◽  
K. B. Ma ◽  
Z. H. Zhang ◽  
W. K. Chu ◽  
C. Kirschbaum ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Thermal Annealing ◽  
Secondary Ion Mass Spectrometry ◽  
Electrical Activation ◽  
Tail Region ◽  
Depth Profiles ◽  
Profile Depth ◽  
Phosphorus In Silicon ◽  
Secondary Ion ◽  
Concentration Depth Profiles

ABSTRACTThe effect of channeling on the diffusion of ion implanted phosphorus in silicon has been investigated. Silicon samples, implanted with 25–100 keV P along the [100] channeling and the random equivalent directions, were subjected to thermal annealing over a temperature range of 600–1050 °C. Secondary Ion Mass Spectrometry (SIMS) and Spreading Resistance Probe (SRP) have been used to determine the atomic and carrier concentration depth profiles, respectively. The findings show that after annealing, the P profiles by implantation along the random equivalent direction can be kept shallower than the profiles obtained by implantation along the [100] channeling direction. Through proper annealing and electrical activation, only minimal diffusion in the tail region of the profiles occurred. For 50 keV P at 1×1015 at./cm2, changing the implantation from the [100] to the random equivalent direction leads to a reduction in the profile depth of about 50% (at 1×1017at./cm3). After 10 seconds of rapid thermal annealing (RTA) at 1050 °C, the profile depth remains more than 30% shallower than the channeled profile.

Effects of Cryogenic Sample Analysis on Molecular Depth Profiles with TOF-Secondary Ion Mass Spectrometry

2010 ◽  
Vol 82 (19) ◽  
pp. 8291-8299 ◽  
Author(s):  
Alan M. Piwowar ◽  
John S. Fletcher ◽  
Jeanette Kordys ◽  
Nicholas P. Lockyer ◽  
Nicholas Winograd ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Secondary Ion Mass Spectrometry ◽  
Sample Analysis ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Quantitation of Secondary Ion Mass Spectrometry (SIMS) for HgCdTe.

1983 ◽  
Vol 25 ◽  
Author(s):  
Lawrence E. Lapides ◽  
George L. Whiteman ◽  
Robert G. Wilson
Keyword(s):  
Mass Spectrometry ◽  
Ion Implantation ◽  
Ionization Potential ◽  
Electron Affinity ◽  
Secondary Ion Mass Spectrometry ◽  
Relative Sensitivity ◽  
Depth Profiles ◽  
Ion Mass Spectrometry ◽  
Sensitivity Factors ◽  
Secondary Ion

ABSTRACTQuantitative depth profiles of impurities in LPE layers of HgCdTe have been determined using relative sensitivity factors calculated from ion implantation profiles. Standards were provided for Li, Be, B, C, F, Na, Mg, Al, Si, P, S, Cl, Cu, Ga, As, Br, and In. Relative sensitivity factors as a function of ionization potential for O2+ primary ion SIMS and electron affinity for Cs+ primary ion SIMS have been calculated in order to extend quantitation to elements not yet implanted. Examples of depth profiles for implant standards and unimplanted layers are given.

Grain Boundary Diffusion in Cation-Doped Superplastic 3Y-TZP

2006 ◽  
Vol 45 ◽  
pp. 1626-1631
Author(s):  
Marek Boniecki ◽  
Rafał Jakieła ◽  
Zdzislaw Librant ◽  
Wladyslaw Wesolowski ◽  
Danuta Dabrowska ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Thin Films ◽  
Grain Boundary ◽  
Diffusion Coefficients ◽  
Boundary Diffusion ◽  
Secondary Ion Mass Spectrometry ◽  
Tetragonal Zirconia ◽  
Grain Boundary Diffusion ◽  
Depth Profiles ◽  
Secondary Ion

The superplastic flow in tetragonal zirconia polycrystals stabilised 3mol% Y2O3 (3YTZP) is strongly affected by the dopant cations, which segregate at the grain boundary. It is proposed that this flow is controlled by grain boundary diffusion of Zr4+ ions and therefore the dopant cations should change the grain boundary diffusion. In order to prove this thesis the measurements of grain boundary diffusion coefficients were made using Hf4+ ions as tracer. Zirconia samples were doped with 1mol% of Al2O3, SiO2, MgO, MgAl2O4, GeO2 and TiO2. The tracer was deposited on the surface of the zirconia specimens by placing several drops of hafnium nitrate and then drying at 373 K. In this way, thin films of HfO 2 were obtained. The samples were heated in the range 1553 – 1773 K for 1 to 24 h. The concentration versus depth profiles were measured using secondary ion mass spectrometry (SIMS). Calculated hence grain boundary diffusion coefficients were several times bigger for doped samples than for pure 3Y-TZP samples.

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