Advances in Liquid Encapsulated Chip-on-Board / MCM-L Technology

1995 ◽  
Vol 390 ◽  
Author(s):  
Dale L. Robinson ◽  
David B. Clegg
Keyword(s):  
Paradigm Shift ◽  
High Reliability ◽  
Low Cost ◽  
Cost Effective ◽  
Electronics Packaging ◽  
Multichip Module ◽  
Successful Implementation ◽  
Recent Advances ◽  
History Of ◽  
Reliability Performance

ABSTRACTChip-on-Board technology (COB), or the currently more often used MCM-L acronym (MultiChip Module - Laminate), has long been touted as the low cost, high density electronics packaging choice of the future. Unfortunately, poor reliability performance in comparison to traditional plastic packaging, has been a trademark of COB/MCM-L. Recent advances in processes and materials for COB/MCM-L are providing a paradigm shift in reliability, and providing cost effective high reliability packaging solutions for COB/MCM-L. This paper examines the history of recent advances in liquid encapsulated COB/MCM-L and provides guidelines for selecting appropriate materials and processes for their successful implementation into cost effective manufacturing.

ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal Performance

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 1-32
Author(s):  
Senthil Sivaswamy ◽  
Theodore (Ted) G. Tessier ◽  
Tony Curtis ◽  
David Clark ◽  
Kazuhisa Itoi ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Reliability ◽  
Low Cost ◽  
Cost Effective ◽  
Polymer Processing ◽  
Wafer Level ◽  
Component Level ◽  
Novel Approach ◽  
Reliability Performance ◽  
Board Level

Fan-Out Wafer Level Packaging (FO-WLP) technology has been developed in recent years to overcome the limitations of Fan-in WLP (FI-WLP) packages and to add more functionality to WLP. Fan-Out packages expand the WLP market to higher pin count devices and add multiple die System in Package (SiP) capability. In this paper, a novel approach to low cost fan-out packaging based on polyimide flex circuits and wafer level Embedded Die Customization (EDC) is discussed. ChipletT refers to Fan-Out packaging. ChipsetT refers to System in Package developed with WABE (Wafer and Board Level Embedding) technology. WABE technology is based on co-lamination of multi layer polyimide flex wiring and conductive z-axis sintered metal interconnections. Using WABE technology, ultra thin fan-out packages (0.4mm) can be fabricated with lower processing costs, higher throughput and with 3D extendibility. Embedded Die Customization is performed at the wafer level and involves optimization of the die-to-embedding process by using optimized wafer level processing capabilities including polymer processing, copper plating and wafer thinning. Reliability of the ChipletT packages, both component level and board level is evaluated. ChipletT packages show high reliability in component level testing and board level testing (Thermal Cycling and Drop Testing). The thermal performance of ChipletT packages were also evaluated in this study. Thermal resistance parameters θja and θjc were simulated with and without thermal vias for both face up and face down configurations. ChipletT provides a new low cost fan out packaging option with proven component level and board level reliability performance.

Recent Advances in Chromium-Catalyzed Organic Transformations

Synlett ◽  
2019 ◽  
Vol 31 (03) ◽  
pp. 205-210 ◽  
Author(s):  
Xiaoming Zeng
Keyword(s):  
Low Cost ◽  
Cost Effective ◽  
Organic Transformations ◽  
Chromium Chloride ◽  
Recent Advances ◽  
Chloride Salts ◽  
Catalytic Functionalization

The use of simple and low-cost chromium chloride salts as catalysts or precatalysts for the development of cost-effective methods is of significant synthetic and mechanistic interest. Here, recent advances in chromium-catalyzed organic transformations are highlighted.1 Introduction2 Arylmagnesiation of Alkynes3 Catalytic Functionalization of C(aryl)–O Bonds4 Catalytic Functionalization of C(aryl)–N Bonds5 Catalytic Functionalization of C(aryl)–H Bonds6 NHK-Type Reactions7 Hydrogenation8 Conclusions

scholarly journals Novel Cost-Effective Microfluidic Chip Based on Hybrid Fabrication and Its Comprehensive Characterization

Sensors ◽  
2019 ◽  
Vol 19 (7) ◽  
pp. 1719 ◽  
Author(s):  
Sanja P. Kojic ◽  
Goran M. Stojanovic ◽  
Vasa Radonic
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
Modern Science ◽  
Cost Effective ◽  
Middle Layer ◽  
Microfluidic Chips ◽  
Fabrication Technology ◽  
Rapid Fabrication ◽  
Wide Range ◽  
Good Potential

Microfluidics, one of the most attractive and fastest developed areas of modern science and technology, has found a number of applications in medicine, biology and chemistry. To address advanced designing challenges of the microfluidic devices, the research is mainly focused on development of efficient, low-cost and rapid fabrication technology with the wide range of applications. For the first time, this paper presents fabrication of microfluidic chips using hybrid fabrication technology—a grouping of the PVC (polyvinyl chloride) foils and the LTCC (Low Temperature Co-fired Ceramics) Ceram Tape using a combination of a cost-effective xurography technique and a laser micromachining process. Optical and dielectric properties were determined for the fabricated microfluidic chips. A mechanical characterization of the Ceram Tape, as a middle layer in its non-baked condition, has been performed and Young’s modulus and hardness were determined. The obtained results confirm a good potential of the proposed technology for rapid fabrication of low-cost microfluidic chips with high reliability and reproducibility. The conducted microfluidic tests demonstrated that presented microfluidic chips can resist 3000 times higher flow rates than the chips manufactured using standard xurography technique.

scholarly journals Dynamic Fault-Tolerant Workflow Scheduling with Hybrid Spatial-Temporal Re-Execution in Clouds

Information ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 169 ◽  
Author(s):  
Na Wu ◽  
Decheng Zuo ◽  
Zhan Zhang
Keyword(s):  
Large Scale ◽  
Fault Tolerant ◽  
Critical Path ◽  
High Reliability ◽  
Low Cost ◽  
Cost Effective ◽  
Scientific Workflow ◽  
Workflow Scheduling ◽  
Workflow Execution ◽  
Computing Environments

Improving reliability is one of the major concerns of scientific workflow scheduling in clouds. The ever-growing computational complexity and data size of workflows present challenges to fault-tolerant workflow scheduling. Therefore, it is essential to design a cost-effective fault-tolerant scheduling approach for large-scale workflows. In this paper, we propose a dynamic fault-tolerant workflow scheduling (DFTWS) approach with hybrid spatial and temporal re-execution schemes. First, DFTWS calculates the time attributes of tasks and identifies the critical path of workflow in advance. Then, DFTWS assigns appropriate virtual machine (VM) for each task according to the task urgency and budget quota in the phase of initial resource allocation. Finally, DFTWS performs online scheduling, which makes real-time fault-tolerant decisions based on failure type and task criticality throughout workflow execution. The proposed algorithm is evaluated on real-world workflows. Furthermore, the factors that affect the performance of DFTWS are analyzed. The experimental results demonstrate that DFTWS achieves a trade-off between high reliability and low cost objectives in cloud computing environments.

From Subsurface to Riser: An Integrated Approach to Subsea Surveillance

2010 ◽  
Author(s):  
Jon Machin
Keyword(s):  
Surveillance System ◽  
Production Control ◽  
High Reliability ◽  
Cost Effective ◽  
Integrated Approach ◽  
Production Optimization ◽  
Surveillance Systems ◽  
Physical Layers ◽  
Key Enabling Technologies ◽  
Reliability Performance

The high reliability performance of a subsea surveillance system, from subsurface to riser, is of the utmost importance for maximizing production availability. In designing such a surveillance system, there are a multitude of considerations that need to be addressed. These have traditionally focused on safe and cost effective production control system availability. However, they are now being extended to also address enablers for secondary recovery, production optimization, and increased recovery activities. This paper addresses the idea that latest-generation surveillance systems must operate seamlessly from the subsurface to the seabed and in turn from seabed to riser. In doing so they must integrate a number of key enabling technologies over different physical layers and predefined technical interfaces. They must also serve to integrate these technologies over the project management interfaces which arise from the selection of the different proprietary technologies, and the commercial and contractual barriers which can result.

scholarly journals Synaptic and Fast Switching Memristance in Porous Silicon-Based Structures

Nanomaterials ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 825 ◽  
Author(s):  
Vicente Torres-Costa ◽  
Ermei Mäkilä ◽  
Sari Granroth ◽  
Edwin Kukk ◽  
Jarno Salonen
Keyword(s):  
Porous Silicon ◽  
Low Cost ◽  
Electrical Characterization ◽  
Cost Effective ◽  
Successful Implementation ◽  
Memristive Behavior ◽  
Silicon Structures ◽  
Proper Material ◽  
Silicon Based ◽  
New Generation

Memristors are two terminal electronic components whose conductance depends on the amount of charge that has flown across them over time. This dependence can be gradual, such as in synaptic memristors, or abrupt, as in resistive switching memristors. Either of these memory effects are very promising for the development of a whole new generation of electronic devices. For the successful implementation of practical memristors, however, the development of low cost industry compatible memristive materials is required. Here the memristive properties of differently processed porous silicon structures are presented, which are suitable for different applications. Electrical characterization and SPICE simulations show that laser-carbonized porous silicon shows a strong synaptic memristive behavior influenced by defect diffusion, while wet-oxidized porous silicon has strong resistance switching properties, with switching ratios over 8000. Results show that practical memristors of either type can be achieved with porous silicon whose memristive properties can be adjusted by the proper material processing. Thus, porous silicon may play an important role for the successful realization of practical memristorics with cost-effective materials and processes.

An Innovative Quasi-Continuous Power Transmission System

2007 ◽  
Author(s):  
Asghar Nasr ◽  
Yasser Jafari Jozani ◽  
Mehrdad Zoroufi
Keyword(s):  
Power Transmission ◽  
High Reliability ◽  
Low Cost ◽  
Cost Effective ◽  
Transmission Systems ◽  
Governing Parameter ◽  
Output Torque ◽  
Power Transmission Systems ◽  
Continuous Power ◽  
High Output

Conventional stepped power transmission systems exhibit abundant energy dissipation, complicated handling and costly maintenance. On the other hand, continuously-variable power transmissions (CVTs), which are recently considered to be used in the industry, despite their high capabilities, face a number of drawbacks including limited torque transmission capacity, high-precision manufacturing and installation requirements, low cost effectiveness and relatively modest power transmission efficiencies. Therefore, innovative power transmission systems that intend to resolve or lessen one or more of these disadvantages are critical in power transmission from pinion to wheel in electric traction motors of both diesel and electric locomotives; especially when active and advanced control of traction effort and adhesion is of high importance and are going to be welcomed by rail industries. In this research, an innovative quasi-continuous power transmission (QCPT) system is introduced. In this system, a fully-automatic gear box including six pairs of engaging gears is considered where only one pair of gears is engaged in any operating moment. The main components of the QCPT are the input and output shafts each having six engaging gears, speed regulating sensor, electrical module and intelligent pins. The governing parameter in this design is output shaft rotating speed or output torque of the system. When high output torque is needed, the system automatically transfers power to lower gears, and in the need of high output speed, higher gears are assigned. The proposed system is simple and cost-effective, while having high reliability and efficiency.

A Cost Effective Process for Silicon Nitride Engine Components

1994 ◽  
Author(s):  
Garry J. Garvey ◽  
Jack D. Sibold
Keyword(s):  
Silicon Nitride ◽  
High Reliability ◽  
Low Cost ◽  
High Strength ◽  
Cost Effective ◽  
Shock Resistance ◽  
Baseline Cost ◽  
Engine Components ◽  
Low Cost Manufacturing ◽  
High Thermal Shock Resistance

Silicon Nitride (Si3N4) ceramics offer tremendous material advantages for automotive and other high strength, high thermal shock resistance applications. Yet while the need for such a material continues to rise, the high cost of silicon nitride components remains a significant barrier to market acceptance. It was determined that market acceptance hinged on achieving three goals: high flexural strength (i.e. 4 pt. MOR >525 MPa), high reliability (i.e. Weibull modulus >15) and a spray-dried body cost of <$13.00/kg. To address this need, GTC/Coors licensed a prototype process from Eaton for making Sintered Reaction-Bonded Silicon Nitride (SRBSN) that offered the potential for low cost manufacturing. This paper describes the process optimization that took place to adapt this prototype process to GTC/Coors existing manufacturing technology base. It also presents the material properties and baseline cost-efficiency goals that were achieved.

scholarly journals Surge of the Innovative Quest in the first lockdown period due to the Pandemic Effect

2021 ◽  
Vol 9 (4) ◽  
pp. 34-43
Author(s):  
Ishita Ghosh
Keyword(s):  
Review Paper ◽  
Low Cost ◽  
Cost Effective ◽  
Physical Contact ◽  
Effective Vaccine ◽  
Successful Implementation ◽  
Human Beings ◽  
To Come ◽  
The One ◽  
Effective Drugs

When the entire world is reeling under the COVID 19 pandemic effect and the tensed human race is struggling to return back to the normalcy of life, the one thing which has become very active is the grey cells of our brain. The pandemic effect has cut down our physical limits due to the movement constraints. But it is thankfully unable to restrict the ticking of the grey cells of the human brain. As is said, “Necessity is the mother of the invention”. Sure enough!! We can be extremely pleased to know that the innovative surge in science and technology continues unabated in this lockdown period. The prime requirement of the pandemic effect is social distancing, less physical contact and keeping ourselves away from infection by corona virus. Keeping this necessity in mind, the doctors, the engineers, the researchers as well as the students’ community are keeping themselves busy in pumping out the solutions to the currently faced problems. The outputs include automatic masks machines, low cost PPE’s, automatic wash basins, suitable ventilators, sanitizer tunnels etc. This review paper looks into the innovative surge already made and what more can be churned out for the effective social safety in this tensed pandemic effect. The most awaited news as of now is the successful implementation of an effective vaccine and cost effective drugs which can help the human beings breathe easy. The pandemic effect has also showed us the way for a cleaner and greener nature. It is now a challenge to the intellectual world to come up with inexpensive, innovative and smart solutions which will make our beautiful planet safer, greener, cleaner and worthier to live in.

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