A Universal Thermal Module™ for Clusterable RTP and MOCVD Applications

1995 ◽  
Vol 387 ◽  
Author(s):  
Mehrdad M. Moslehi ◽  
Tom Omstead ◽  
Yong Jin Lee ◽  
Ahmad Kermani ◽  
Lino Velo ◽  
...  
Keyword(s):  
High Performance ◽  
Rf Plasma ◽  
Copper Films ◽  
Control Techniques ◽  
Light Interference ◽  
High K ◽  
High K Dielectric ◽  
And Control ◽  
Measurement And Control

AbstractA Universal Thermal Module™ (UTM™) has been developed for vacuum-integrated cluster RTP and MOCVD as well as stand-alone atmospheric RTP applications. The UTM™ architecture provides highly modular RTP and MOCVD tool configurations for various single-wafer thermal processes. The UTM™ design comprises a temperature-controlled UHV-grade process chamber as well as an ultraclean gearless wafer rotation assembly for improved temperature uniformity and enhanced built-in reliability. The UTM™ RTP employs bottom/backside wafer heating using a multi-zone axisymmetric illuminator and a reflective multi-zone gas showerhead located above the wafer. Precision RTP control is achieved using a multi-zone controller in conjunction with a multipoint sensor system with real-time multi-zone compensations for wafer emissivity and illuminator light interference effects. The RTP temperature measurement and control techniques fully compensate for any axisymmetric or non-axisymmetric wafer emissivity patterns, eliminating the need for pre-RTP wafer backside conditioning. The UTM™ showerhead provides capabilities for ultraclean multi-zone gas injection and in-situ RF plasma for MOCVD and RTCVD processes. The UTM™ MOCVD module meets the most stringent specifications and tool parameters for various metallization and high-K dielectric deposition applications. This module has been used for deposition of low-resistivity copper films with excellent void-free sub-half-micron gap fill for high-performance multilevel interconnects. The UTM™ RTP and MOCVD modules have been implemented based on design optimizations in a virtual reactor environment.

Sub-20nm Device Voltage-Sensitive SRAM Characterization and Failure Analysis

2018 ◽  
Author(s):  
Seng Nguon Ting ◽  
Hsien-Ching Lo ◽  
Donald Nedeau ◽  
Aaron Sinnott ◽  
Felix Beaudoin
Keyword(s):  
Failure Analysis ◽  
High Performance ◽  
Yield Loss ◽  
Technology Development ◽  
High Density ◽  
High K ◽  
Yield Learning ◽  
Oxide Deposition ◽  
Edge Profile ◽  
High K Dielectric

Abstract With rapid scaling of semiconductor devices, new and more complicated challenges emerge as technology development progresses. In SRAM yield learning vehicles, it is becoming increasingly difficult to differentiate the voltage-sensitive SRAM yield loss from the expected hard bit-cells failures. It can only be accomplished by extensively leveraging yield, layout analysis and fault localization in sub-micron devices. In this paper, we describe the successful debugging of the yield gap observed between the High Density and the High Performance bit-cells. The SRAM yield loss is observed to be strongly modulated by different active sizing between two pull up (PU) bit-cells. Failure analysis focused at the weak point vicinity successfully identified abnormal poly edge profile with systematic High k Dielectric shorts. Tight active space on High Density cells led to limitation of complete trench gap-fill creating void filled with gate material. Thanks to this knowledge, the process was optimized with “Skip Active Atomic Level Oxide Deposition” step improving trench gap-fill margin.

scholarly journals In Situ Measurement and Control of the Fermi Level in Colloidal Nanocrystal Thin Films during Their Fabrication

2018 ◽  
Vol 9 (24) ◽  
pp. 7165-7172 ◽  
Author(s):  
Sebastian Volk ◽  
Nuri Yazdani ◽  
Olesya Yarema ◽  
Maksym Yarema ◽  
Deniz Bozyigit ◽  
...  
Keyword(s):  
Thin Films ◽  
Fermi Level ◽  
In Situ Measurement ◽  
And Control ◽  
Measurement And Control

Introducing Temperature Measurement and Control Techniques to Engineering Undergraduate Students in the Gulf Region

2008 ◽  
Author(s):  
Peter Rodgers ◽  
Arman Molki
Keyword(s):  
Engineering Education ◽  
Temperature Measurement ◽  
Temperature Control ◽  
Instrumentation Amplifier ◽  
Gulf Region ◽  
Linear Temperature ◽  
Control Techniques ◽  
The Third ◽  
And Control ◽  
Measurement And Control

Hands-on laboratory skills play a vital role in providing students with a sound understanding of the scientific fundamentals and their application in solving real-life engineering problems. One of the essential laboratory based courses taught at our Institute is Introduction to Measurements and Instrumentation. The design and implementation of such a course has been well documented in Western engineering education, but presents specific challenges in the Gulf region due to economical, social and cultural factors. This paper discusses the adaptation of corresponding Western courses to undergraduate mechanical engineering studies in the Gulf region. Laboratory exercises for temperature measurement and control are described, which consist of four modules, each building upon the other. In each module, students learn how to design an accurate measuring system, and process and interpret collected data. In the first module, the students are required to build a thermocouple reader using an AD620 instrumentation amplifier and to compare measurements with NIST reference tables. The second module is an introduction to LabVIEW, a graphical data acquisition programming language. The students are required to write a LabVIEW program to record multiple thermocouple signals from a heated plate under varying convective cooling conditions, using a high resolution temperature logger with on-board signal conditioning. The third and fourth modules focus on temperature control techniques. In the third laboratory exercise, the students are required to construct an electrical circuit using a low-power PCB relay and NPN bipolar transistor to develop a bang-bang linear temperature controller. The program created in module two is modified to have the heater operation automatically controlled for a fixed temperature set point. In module four, the students replace the bang-bang controller built in the previous lab with a commercially available PID controller and explore the differences between PID and linear temperature control systems. For each module, students are required to submit a formal report covering the theoretical background, the experimental procedure employed, uncertainty analysis, and conclusions and recommendations. An effective teaching strategy is outlined that covers the fundamental concepts of temperature measurement and control through carefully designed experiments, with sample results presented. Emphasis is placed on the tailoring of the course topics to engineering education in the Gulf region.

Hieratical CuO clusters in-situ grown on copper films coated three-dimensional nickel foams for high-performance supercapacitors

2020 ◽  
Vol 46 (11) ◽  
pp. 17461-17468 ◽  
Author(s):  
Haibin Sun ◽  
Li'na Xu ◽  
Jiao Li ◽  
Yan'an Li ◽  
Tong Wu ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Copper Films ◽  
Nickel Foams

Characterization of Random Telegraph Signal Noise of High-Performance p-MOSFETs With a High-$k$ Dielectric/Metal Gate

2011 ◽  
Vol 32 (5) ◽  
pp. 686-688 ◽  
Author(s):  
Hyuk-Min Kwon ◽  
In-Shik Han ◽  
Jung-Deuk Bok ◽  
Sang-Uk Park ◽  
Yi-Jung Jung ◽  
...  
Keyword(s):  
High Performance ◽  
Metal Gate ◽  
Random Telegraph Signal ◽  
Signal Noise ◽  
High K ◽  
High K Dielectric

scholarly journals Measurement and control techniques in geothermal power plants

1979 ◽  
Author(s):  
J.F. Whitbeck ◽  
R.H. Dart ◽  
J.D. Miller ◽  
D.R. Brewer
Keyword(s):  
Power Plants ◽  
Control Techniques ◽  
Geothermal Power ◽  
And Control ◽  
Measurement And Control
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