Evolution of Co/Ge Films on Si(100) and Ge(100) Substrates

1995 ◽  
Vol 382 ◽  
Author(s):  
G.R. Carlow ◽  
T.D. Lowes ◽  
M. Grunwell ◽  
M. Zinke-Allmang

ABSTRACTWe present results on the evolution of Co/Ge films on Si(100) substrates. Room temperature deposition of 18 nm thick Ge films followed by 5 nm thick Co films was done by Molecular Beam Epitaxy (MBE) and then post-deposited annealing was done at 700 C. Using combinations of Scanning electron microscopy, Auger electron spectroscopy and Rutherford backscattering spectroscopy, we determine that the Co and Ge are clustering on the Si surface at these annealing temperatures. During the clustering, the Co is diffusing into the Si substrate leaving a Ge-rich clustered morphology. To test the effect of the Si substrate on the evolution of the films, Co films were deposited on Ge(100) substrates and annealed at 700 C. Clustered morphologies are seen on the Ge substrates and Co in-diffusion is also occurring. The morphologies on the Ge substrates are significantly different from those on the Si substrates.

1996 ◽  
Vol 423 ◽  
Author(s):  
C. B. Vartuli ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
J. D. MacKenzie ◽  
J. C. Zolper ◽  
...  

AbstractThe surface stoichiometry, surface morphology and electrical conductivity of AIN, GaN, InN, InGaN and InAIN was examined at rapid thermal annealing temperatures up to 1150 °C. The sheet resistance of the AIN dropped steadily with annealing, but the surface showed signs of roughening only above 1000 °C. Auger Electron Spectroscopy (AES) analysis showed little change in the surface stoichiometry even at 1150 °C. GaN root mean square (RMS) surface roughness showed an overall improvement with annealing, but the surface became pitted at 1000 °C, at which point the sheet resistance also dropped by several orders of magnitude, and AES confirmed a loss of N from the surface. The InN surface had roughened considerably even at 650 °C, and scanning electron microscopy (SEM) showed significant degradation. In contrast to the binary nitrides the sheet resistance of InAIN was found to increase by ˜ 102 from the as grown value after annealing at 800 °C and then remain constant up to 1000 °C, while that of InGaN increased rapidly above 700 °C. The RMS roughness increased above 800 °C and 700 °C respectively for InAIN and InGaN samples. In droplets began to form on the surface at 900 °C for InAIN and at 800 °C for InGaN, and then evaporate at 1000 °C leaving pits. AES analysis showed a decrease in the N concentration in the top 500 Å of the sample for annealing ≥800 °C in both materials.


1990 ◽  
Vol 5 (6) ◽  
pp. 1169-1175 ◽  
Author(s):  
A. D. Berry ◽  
R. T. Holm ◽  
M. Fatemi ◽  
D. K. Gaskill

Films containing the metals copper, yttrium, calcium, strontium, barium, and bismuth were grown by organometallic chemical vapor deposition (OMCVD). Depositions were carried out at atmospheric pressure in an oxygen-rich environment using metal beta-diketonates and triphenylbismuth. The films were characterized by Auger electron spectroscopy, Nomarski and scanning electron microscopy, and x-ray diffraction. The results show that films containing yttrium consisted of Y2O3 with a small amount of carbidic carbon, those with copper and bismuth were mixtures of oxides with no detectable carbon, and those with calcium, strontium, and barium contained carbonates. Use of a partially fluorinated barium beta-diketonate gave films of BaF2 with small amounts of BaCO3.


1990 ◽  
Vol 198 ◽  
Author(s):  
R. D. Bringans ◽  
D. K. Biegelsen ◽  
F. A. Ponce ◽  
L.-E. Swartz ◽  
J. C. Tramontana

ABSTRACTZinc selenide films have been grown heteroepitaxially on Si(100) substrates by molecular beam epitaxy. The growth has been carried out for raised substrate temperatures and also at room temperature followed by solid-phase epitaxial (SPE) regrowth. The ZnSe films have been characterized by a number of surface-sensitive techniques and both the interface and the bulk material have been examined with high resolution transmission electron microscopy (HRTEM). We find that an interlayer, which is most likely SiSex, is present between the ZnSe film and the Si substrate for growths made at 300 °C and causes loss of epitaxy. In the case of room temperature deposition and SPE, it is absent, leading to good epitaxy. In the latter situation, the films are very uniform and there is a 4° rotation of the ZnSe crystal axes relative to those of the Si substrate.


Vacuum ◽  
1992 ◽  
Vol 43 (5-7) ◽  
pp. 613-615
Author(s):  
Vladimir Ciprus ◽  
Joze Pirs ◽  
Loreta Pomenić ◽  
Marija Kern ◽  
Borut Praček

Author(s):  
В.В. Привезенцев ◽  
Е.П. Kириленко ◽  
А.В. Горячев ◽  
А.В. Лютцау

AbstractThe results of studying the surface Si layer and precipitate formation in CZ n -Si(100) samples sequentially implanted with ^64Zn^+ ions with a dose of 5 × 10^16 cm^2 and energy of 100 keV and ^16O^+ ions with the same dose but an energy of 33 keV at room temperature so that their projection paths R _ p = 70 nm would coincide are presented. The post-implantation samples are annealed for 1 h in an inert Ar medium in the temperature range of 400–900°C with a step of 100°C. The profiles of the implanted impurities are studied by time-of-flight secondary ion mass spectrometry. The Si surface is visualized using a scanning electron microscope, while the near-surface layer is visualized with the help of maps of elements formed by Auger electron spectroscopy with profiling over depth. The ZnO(002) texture is formed in an amorphized Si layer after the implantation of Zn and O ions. ZnO(102) crystallites of 5 nm in size are found in a recrystallized single-crystalline Si layer after annealing in Ar at 700°C.


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