Effect of CU and SI in Aluminum on Stress Change and on TiAl3 Formation in Al Alloy/TI Bilayer Films During Annealing

1994 ◽  
Vol 356 ◽  
Author(s):  
Dirk D. Brown ◽  
Paul R. Besser ◽  
John E. Sanchez ◽  
Matt A. Korhonen ◽  
Che-Yu Li
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
Thermal Cycling ◽  
Al Alloys ◽  
Al Alloy ◽  
Stress Evolution ◽  
Dominant Effect ◽  
Yield Behavior ◽  
Intermetallic Formation ◽  
Bilayer Films

AbstractInterconnect metallizations used in advanced integrated circuits typically use an Al-alloy sputterdeposited onto a Ti barrier layer. The Ti and Al react above ∼ 400°C to form TiAl3, which affects the stress evolution of the metal stack during thermal cycling. This paper describes results of thin film experiments performed on Ti/Al-alloy bilayer films. Two Al alloys were studied: Al-I%Cu and Al-0.5%Cu-1%Si. The rate of TiAl3 formation at 430°C was determined for both alloys and used to relate TiAl3 formation to the stress evolution of the film stacks during thermal cycling. The dominant effect of the TiAl3 intermetallic formation on stress arises from a change in the stress-temperature behavior of the film stack, due to a change in the yield behavior, effective modulus, and thermal expansion coefficient of the stack. The presence of Si in the Al-alloy markedly reduces both the rate of TiAl3 formation and the resulting change in composite stress.

Thermal- And Electromigration- Induced Stresses In Passivated Al- And Alsicu-Interconnects

1996 ◽  
Vol 428 ◽  
Author(s):  
D. Beckers ◽  
H. Schroeder ◽  
I. Eppler ◽  
W. Schilling
Keyword(s):  
Thermal Cycling ◽  
Shear Deformation ◽  
Electronic Devices ◽  
Electrical Current ◽  
Al Alloys ◽  
Plastic Shear ◽  
Stress Evolution ◽  
Experimental Parameters ◽  
Induced Stresses ◽  
Electrical Current Density

AbstractAl and Al- alloys are commonly used as interconnect materials in integrated electronic devices. Stress induced voiding and degradation of metal lines by electromigration are closely related to the stresses in the lines.We have studied the strain and stress evolution during thermal cycling, isothermal relaxation and due to electromigration in passivated Al and AlSi(1%)Cu(0.5%) lines by Xray diffraction with variation of experimental parameters such as the aspect ratio and the electrical current density. Furthermore the extent of voiding and plastic shear deformation has been determined from the experimental metal strains with the help of finite element calculations.Main results are: 1) During thermal cycling the voiding is less than 2.10-3. The extent of plastic shear deformation increases with increasing line width and with decreasing flowstress. 2) During isothermal relaxation void growth occurs but no significant change in the plastic shear deformation. 3) An electric current in the lines causes no measurable additional change of the volume averaged stresses up to line failure.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Influence of ageing treatment on microstructure, mechanical properties and adhesive wear behaviour of 6063 aluminium alloy

2014 ◽  
Vol 66 (4) ◽  
pp. 520-524 ◽  
Author(s):  
Serkan Büyükdoğan ◽  
Süleyman Gündüz ◽  
Mustafa Türkmen
Keyword(s):  
Mechanical Properties ◽  
Wear Resistance ◽  
High Speed ◽  
Al Alloys ◽  
Wear Behaviour ◽  
Al Alloy ◽  
Strain Ageing ◽  
Content Type ◽  
Static Strain ◽  
Structural Applications

Purpose – The paper aims to provide new observations about static strain ageing in aluminium (Al) alloys which are widely used in structural applications. Design/methodology/approach – The present work aims to provide theoretical and practical information to industries or researchers who may be interested in the effect of static strain ageing on mechanical properties of Al alloys. The data are sorted into the following sections: introduction, materials and experimental procedure, results and discussion and conclusions. Findings – Tensile strength, proof strength (0.2 per cent) and percentage elongation measurement were used to investigate the effect of strain ageing on the mechanical properties. Wear tests were performed by sliding the pin specimens, which were prepared from as-received, solution heat-treated, deformed and undeformed specimens after ageing, on high-speed tool steel (64 HRC). It is concluded that the variations in ageing time improved the strength and wear resistance of the 6063 Al alloy; however, a plastically deformed solution-treated alloy has higher strength and wear resistance than undeformed specimens for different ageing times at 180°C. Practical implications – A very useful source of information for industries using or planning to produce Al alloys. Originality/value – This paper fulfils an identified resource need and offers practical help to the industries.

scholarly journals Experimental Study on the Thickness-Dependent Hardness of SiO2 Thin Films Using Nanoindentation

Coatings ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 23
Author(s):  
Weiguang Zhang ◽  
Jijun Li ◽  
Yongming Xing ◽  
Xiaomeng Nie ◽  
Fengchao Lang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Grain Size ◽  
Integrated Circuits ◽  
Film Thickness ◽  
Depth Range ◽  
Micro Electro Mechanical Systems ◽  
Si Substrates ◽  
Sio2 Thin Film ◽  
Average Grain Size

SiO2 thin films are widely used in micro-electro-mechanical systems, integrated circuits and optical thin film devices. Tremendous efforts have been devoted to studying the preparation technology and optical properties of SiO2 thin films, but little attention has been paid to their mechanical properties. Herein, the surface morphology of the 500-nm-thick, 1000-nm-thick and 2000-nm-thick SiO2 thin films on the Si substrates was observed by atomic force microscopy. The hardnesses of the three SiO2 thin films with different thicknesses were investigated by nanoindentation technique, and the dependence of the hardness of the SiO2 thin film with its thickness was analyzed. The results showed that the average grain size of SiO2 thin film increased with increasing film thickness. For the three SiO2 thin films with different thicknesses, the same relative penetration depth range of ~0.4–0.5 existed, above which the intrinsic hardness without substrate influence can be determined. The average intrinsic hardness of the SiO2 thin film decreased with the increasing film thickness and average grain size, which showed the similar trend with the Hall-Petch type relationship.

Direct Cladding from Molten Metals of Aluminum and Magnesium Alloys Using a Tandem Horizontal Twin Roll Caster

2015 ◽  
Vol 772 ◽  
pp. 250-256 ◽  
Author(s):  
Hideto Harada ◽  
Shin Ichi Nishida ◽  
Mayumi Suzuki ◽  
Hisaki Watari ◽  
T. Haga
Keyword(s):  
Surface Condition ◽  
Hardness Test ◽  
Al Alloys ◽  
Mg Alloy ◽  
Al Alloy ◽  
Molten Metals ◽  
Electron Probe Micro Analyzer ◽  
Twin Roll Caster ◽  
Aluminum And Magnesium Alloys ◽  
Twin Roll

This paper describes direct cladding of magnesium (Mg) and aluminum (Al) alloys using a tandem horizontal twin roll caster that has three pairs of upper and lower rolls. Manufacturing conditions that are appropriate for fabricating Al/Mg and Al/Mg/Al cladded material were investigated. The surface condition of the cladded cast strip was examined. An electron probe micro analyzer was used to observe the interface between Al alloy and Mg alloy. The thickness of the mixed layer of Al and Mg alloy was 15μm, and how the materials were connected was clarified. Microscopic observation and backscattered electron analysis were used to investigate the cladding mechanisms of the Al and Mg alloy layers. Average hardness was determined using the Vickers hardness test at the Al layer and at the diffused layer between Mg and Al alloys. Cladding of Al/Mg alloy and A/Mg/Al alloy was possible using a tandem twin-roll caster. In addition, Al3Mg2 and Al12Mg17 phase precipitation at the interface of the Al and Mg alloys was confirmed during direct cladding from molten metals.

scholarly journals Thin film wavelength converters for photonic integrated circuits

Optica ◽  
2016 ◽  
Vol 3 (5) ◽  
pp. 531 ◽  
Author(s):  
Lin Chang ◽  
Yifei Li ◽  
Nicolas Volet ◽  
Leiran Wang ◽  
Jon Peters ◽  
...  
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Wavelength Converters

scholarly journals Gigahertz Phononic Integrated Circuits on Thin-Film Lithium Niobate on Sapphire

2021 ◽  
Vol 15 (1) ◽  
Author(s):  
Felix M. Mayor ◽  
Wentao Jiang ◽  
Christopher J. Sarabalis ◽  
Timothy P. McKenna ◽  
Jeremy D. Witmer ◽  
...  
Keyword(s):  
Thin Film ◽  
Lithium Niobate ◽  
Integrated Circuits
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