Microstructural Characterization of Creep Tested Cryomilled NiAl-13vol. % AlN

1994 ◽  
Vol 350 ◽  
Author(s):  
A. Garg ◽  
J. D. Whittenberger ◽  
B. J. M. Aikin

AbstractCryomilling of prealloyed NiAl powders, followed by extrusion, has been used to produce a particulate strengthened NiAl-13vol.% AlN material. At 1300 K, the compressive strain rate-flow stress diagram has two distinct deformation regimes, with the transition occurring near 150 MPa. The low and the high stress regimes have power law creep exponents of ∼ 6.1 and 14.2, respectively. Microstructural characterization of the as-extruded and tested samples has been performed to develop an understanding of the superior mechanical properties of the material. The microstructure of the as-extruded material was inhomogeneous and consisted of mantle regions containing a mixture of small NiAl grains (diameter ∼ 50–150 nm) and fine AlN particles (size ∼ 5–50 nm) that surround larger NiAl grains (diameter ∼ 0.3–8.0 μm) which were mostly particle free. In the low-stress regime, samples tested to steady state exhibited a structure composed of subgrain boundaries in the particle-free NiAl grains. In addition, some of the subgrains had developed a well defined dislocation network. AlN patricles occasionally found within large NiAl grains acted as pinning centers for dislocations. Small NiAl grains and the AlN particles constituting the mantle coarsened during these tests. In the high-stress regime, samples tested to steady state exhibited a high density of dislocations in most of the particle-free NiAl grains. Subgrain boundaries were found occasionally but dislocation networks were rare. The AlN particles had not significantly coarsened due to the shorter times at temperature.

2010 ◽  
Vol 89-91 ◽  
pp. 715-720 ◽  
Author(s):  
Paolo Deodati ◽  
Riccardo Donnini ◽  
Saulius Kaciulis ◽  
Alessio Mezzi ◽  
Roberto Montanari ◽  
...  

Roll Diffusion Bonding (RDB) is a new process, developed at C.S.M., for producing Ti composites reinforced by long fibres. The prototypal “diffusion bonding” plant permits to co-roll at high temperature in superplastic rolling field (under temperature and strain rate control) foils of titanium alloy and fabrics made of SiC monofilaments. This study evidenced that the Ti6Al4V-SiCf composite produced by roll-bonding exhibits superior mechanical properties with respect the same material prepared by Hot Isostatic Pressing (HIP) owing to the smaller grain size and the higher dislocation density.


Author(s):  
M.A. Parker ◽  
K.E. Johnson ◽  
C. Hwang ◽  
A. Bermea

We have reported the dependence of the magnetic and recording properties of CoPtCr recording media on the thickness of the Cr underlayer. It was inferred from XRD data that grain-to-grain epitaxy of the Cr with the CoPtCr was responsible for the interaction observed between these layers. However, no cross-sectional TEM (XTEM) work was performed to confirm this inference. In this paper, we report the application of new techniques for preparing XTEM specimens from actual magnetic recording disks, and for layer-by-layer micro-diffraction with an electron probe elongated parallel to the surface of the deposited structure which elucidate the effect of the crystallographic structure of the Cr on that of the CoPtCr.XTEM specimens were prepared from magnetic recording disks by modifying a technique used to prepare semiconductor specimens. After 3mm disks were prepared per the standard XTEM procedure, these disks were then lapped using a tripod polishing device. A grid with a single 1mmx2mm hole was then glued with M-bond 610 to the polished side of the disk.


Author(s):  
A.K. Rai ◽  
A.K. Petford-Long ◽  
A. Ezis ◽  
D.W. Langer

Considerable amount of work has been done in studying the relationship between the contact resistance and the microstructure of the Au-Ge-Ni based ohmic contacts to n-GaAs. It has been found that the lower contact resistivity is due to the presence of Ge rich and Au free regions (good contact area) in contact with GaAs. Thus in order to obtain an ohmic contact with lower contact resistance one should obtain a uniformly alloyed region of good contact areas almost everywhere. This can possibly be accomplished by utilizing various alloying schemes. In this work microstructural characterization, employing TEM techniques, of the sequentially deposited Au-Ge-Ni based ohmic contact to the MODFET device is presented.The substrate used in the present work consists of 1 μm thick buffer layer of GaAs grown on a semi-insulating GaAs substrate followed by a 25 Å spacer layer of undoped AlGaAs.


Author(s):  
G. M. Micha ◽  
L. Zhang

RENi5 (RE: rare earth) based alloys have been extensively evaluated for use as an electrode material for nickel-metal hydride batteries. A variety of alloys have been developed from the prototype intermetallic compound LaNi5. The use of mischmetal as a source of rare earth combined with transition metal and Al substitutions for Ni has caused the evolution of the alloy from a binary compound to one containing eight or more elements. This study evaluated the microstructural features of a complex commercial RENi5 based alloy using scanning and transmission electron microscopy.The alloy was evaluated in the as-cast condition. Its chemistry in at. pct. determined by bulk techniques was 12.1 La, 3.2 Ce, 1.5 Pr, 4.9 Nd, 50.2 Ni, 10.4 Co, 5.3 Mn and 2.0 Al. The as-cast material was of low strength, very brittle and contained a multitude of internal cracks. TEM foils could only be prepared by first embedding pieces of the alloy in epoxy.


2015 ◽  
Vol 52 (2) ◽  
pp. 83-107 ◽  
Author(s):  
B. S. Mocker ◽  
A. M. Matz ◽  
N. Jost ◽  
P. Krug

2018 ◽  
Vol 72 (1) ◽  
pp. 111-121 ◽  
Author(s):  
A. Saikumaran ◽  
R. Mythili ◽  
S. Saroja ◽  
V. Srihari

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