High-Quality Boron and BF2+-Implanted P+ Junctions in Si Using Solid Phase Epitaxy and Transient Annealing

1984 ◽  
Vol 35 ◽  
Author(s):  
P.K. Vasudev ◽  
A.E. Schmitz ◽  
G.L. Olson
Keyword(s):  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Impurity Effects ◽  
Solid Phase Crystallization ◽  
High Quality ◽  
Time Resolved ◽  
Boron Doped ◽  
Epitaxial Regrowth ◽  
Doping Profiles

ABSTRACTWe report on a systematic study of the doping profiles resulting from rapid thermal annealing of boron and BF2+-implanted silicon samples that were preamorphized by Si+ implantation. A two-step process consisting of an initial solid phase epitaxial regrowth followed by a brief (~5 sec) high temperature (1050ଌ) anneal produces extremely shallow (<1500Å) junctions with low defect concentrations. The quality of the epitaxial regrowth is very sensitive to implant conditions and impurity effects as deduced from time-resolved reflectivity measurements. Using the best conditions for implantation and solid phase crystallization, we have obtained boron-doped regions with sheet resistivities of 40 Ω/ and BF2-doped regions of resistivity 60 Ω/.

Kinetic Competition During Solid Phase Crystallization in Ion–Implanted Silicon

1983 ◽  
Vol 23 ◽  
Author(s):  
G.L. Olson ◽  
J.A. Roth ◽  
L.D. Hess ◽  
J. Narayan
Keyword(s):  
Complex Formation ◽  
Low Temperatures ◽  
Solid Phase ◽  
Solid Phase Epitaxy ◽  
Solid Phase Crystallization ◽  
Competing Interactions ◽  
Cross Sectional ◽  
Time Resolved ◽  
Vacancy Model ◽  
Dominant Process

ABSTRACTWe report on an investigation of the temperature and concentration dependent kinetic competition between solid phase epitaxy and complex formation and precipitation in arsenic–implanted Si(100). Crystallization kinetics were monitored using time–resolved reflectivity during cw laser irradiation or furnace heating; microstructural changes were evaluated using cross–sectional TEM. At low temperatures and high As concentrations, complex formation and precipitation substantially alter the SPE kinetics. At higher temperatures competing interactions are less significant, and SPE becomes the dominant process. The kinetic competition between these processes is discussed with respect to the vacancy model for SPE.

Solute Segregation and Dynamics of Solid-Phase Crystallization In in and Sb-Implanted Silicon

1981 ◽  
Vol 4 ◽  
Author(s):  
J. Narayan ◽  
G. L. Olson ◽  
O. W. Holland
Keyword(s):  
Laser Power ◽  
Solid Phase ◽  
Solute Segregation ◽  
Dislocation Loops ◽  
Solid Phase Crystallization ◽  
Time Resolved ◽  
Plan View ◽  
Ion Channeling ◽  
Retrograde Solubility ◽  
Transmission Electron

ABSTRACTTime-resolved-reflectivity measurements have been combined with transmission electron microscopy (cross-section and plan-view), Rutherford backscattering and ion channeling techniques to study the details of laser induced solid phase epitaxial growth in In+ and Sb+ implanted silicon in the temperature range from 725 to 1500 °K. The details of microstructures including the formation of polycrystals, precipitates, and dislocations have been correlated with the dynamics of crystallization. There were limits to the dopant concentrations which could be incorporated into substitutional lattice sites; these concentrations exceeded retrograde solubility limits by factors up to 70 in the case of the Si-In system. The coarsening of dislocation loops and the formation of a/2<110>, 90° dislocations in the underlying dislocation-loop bands are described as a function of laser power.

Defect Reduction and Defect Engineering in Silicon-on-Sapphire Material Using Ge Implantation

1990 ◽  
Vol 201 ◽  
Author(s):  
F. Namavar ◽  
E. Cortesi ◽  
N. M. Kalkhoran ◽  
J. M. Manke ◽  
B. L. Buchanan
Keyword(s):  
Leakage Current ◽  
Defect Density ◽  
Solid Phase ◽  
Substantial Reduction ◽  
Interface Region ◽  
Radiation Environment ◽  
Solid Phase Epitaxy ◽  
Defect Reduction ◽  
Radiation Induced

AbstractSubstantial reduction of defect density in silicon-on-sapphire (SOS) material is required to broaden its range of applications to include CMOS and bipolar devices. In recent years, solid phase epitaxy and regrowth (SPEAR) and double solid phase epitaxy (DSPE) processes were applied to SOS to reduce the density of defects in the silicon. These methods result in improved carrier mobilities, but also in increased leakage current, even before irradiation. In a radiation environment, this material has a large increase in radiation induced back channel leakage current as compared to standard wafers. In other words, the radiation hardness quality of the SOS declines when the crystalline quality of the Si near the sapphire interface is improved.In this paper, we will demonstrate that Ge implantation, rather than Si implantation normally employed in DSPE and SPEAR processes, is an efficient and more effective way to reduce the density of defects near the surface silicon region without improving the Si/sapphire interface region. Ge implantation may be used to engineer defects in the Si/sapphire interface region to eliminate back channel leakage problems.

Time-Resolved Reflectivity Study of Solid-Phase Epitaxial Regrowth in Relaxed and Strained Si1−xGex Epilayers

1992 ◽  
Vol 281 ◽  
Author(s):  
T. E. Haynes ◽  
C. Lee ◽  
K. S. Jones
Keyword(s):  
Composition Dependence ◽  
Solid Phase ◽  
Strain Relaxation ◽  
Alloy Layer ◽  
Atomic Fraction ◽  
Bulk Alloy ◽  
Strained Layers ◽  
Time Resolved ◽  
Epitaxial Regrowth ◽  
Different Types

ABSTRACTThe rate of solid-phase epitaxial regrowth has been studied using time-resolved reflectivity in three different types of SiGe/Si epilayers amorphized by ion implantation. In two of these cases, the alloy epilayer contained either 12% or 20% Ge, and the amorphization depth was greater than the thickness (2000 Å) of the SiGe alloy layer. Time-resolved reflectivity measurements showed that the rate of regrowth was not constant in these two cases, but first decreased after passing the SiGe/Si interface, and then increased. The minimum regrowth rate occurred closer to the SiGe/Si interface in the epilayers with the larger Ge atomic fraction. In the third type of sample, the alloy epilayer thickness was ∼7μm, so that the initial epilayer (15% Ge) had the lattice constant of the bulk alloy. Furthermore, amorphization and regrowth occurred entirely within the relaxed alloy layer. In this case, the regrowth rate was constant. The composition dependence of the regrowth-rate transient in the strained layers is discussed in the context of a ‘critical-thickness’ model of strain relaxation.

Optimising the Growth of Few-Layer Graphene on Silicon Carbide by Nickel Silicidation

2013 ◽  
Vol 740-742 ◽  
pp. 121-124 ◽  
Author(s):  
Enrique Escobedo-Cousin ◽  
Konstantin Vassilevski ◽  
Toby Hopf ◽  
Nick G. Wright ◽  
Anthony O’Neill ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Solid Phase ◽  
Sample Surface ◽  
Device Fabrication ◽  
Solid Phase Epitaxy ◽  
X Ray ◽  
Graphene Films ◽  
Few Layer Graphene ◽  
The Impact

Few-layers graphene films (FLG) were grown by local solid phase epitaxy on a semi-insulating 6H-SiC substrate by annealing Ni films deposited on the Si and C-terminated faces of the SiC. The impact of the annealing process on the final quality of the FLG films is studied using Raman spectroscopy. X-ray photoelectron spectroscopy was used to verify the presence of graphene on the sample surface. We also demonstrate that further device fabrication steps such as dielectric deposition can be carried out without compromising the FLG films integrity.

Solid-phase crystallization of high-quality Si films on SiO2 by local Ge-insertion

2004 ◽  
Vol 451-452 ◽  
pp. 489-492 ◽  
Author(s):  
I. Tsunoda ◽  
K. Nagatomo ◽  
A. Kenjo ◽  
T. Sadoh ◽  
M. Miyao
Keyword(s):  
Solid Phase ◽  
Solid Phase Crystallization ◽  
High Quality ◽  
Si Films

Time resolved reflectivity measurements of silicon solid phase epitaxial regrowth

2000 ◽  
Vol 364 (1-2) ◽  
pp. 228-232 ◽  
Author(s):  
M. Bauer ◽  
M. Oehme ◽  
M. Sauter ◽  
G. Eifler ◽  
E. Kasper
Keyword(s):  
Solid Phase ◽  
Time Resolved ◽  
Epitaxial Regrowth

Study on Solid Phase Crystallization of Silicon Films Deposited on Different Substrates

2011 ◽  
Vol 287-290 ◽  
pp. 1352-1355
Author(s):  
Qing Dong Chen ◽  
Jun Ping Wang ◽  
Yu Xiang Zhang
Keyword(s):  
Porous Silicon ◽  
Silicon Substrate ◽  
Solid Phase ◽  
Quartz Substrate ◽  
Silicon Crystal ◽  
Electrochemical Corrosion ◽  
Silicon Films ◽  
Solid Phase Crystallization ◽  
Boron Doped ◽  
Before And After

Porous silicon were prepared by electrochemical corrosion. Undoped and boron doped silicon films were deposited on quartz substrate、porous silicon and silicon substrate by PECVD,and were solid phase crystallized at different temperature and different hours. The microstructure of films before and after annealing were studied by Raman and XRD. The results show that:the crystallization of films deposited on porous silicon and monocrystalline silicon substrate are better than quartz substrate; The substrate which has silicon crystal lattice play an important role of seed crystal in the solid phase crystallization, the same grain orientation film can be grown on certain condition.

High-quality polycrystalline silicon thin film prepared by a solid phase crystallization method

1996 ◽  
Vol 198-200 ◽  
pp. 940-944 ◽  
Author(s):  
T. Matsuyama ◽  
N. Terada ◽  
T. Baba ◽  
T. Sawada ◽  
S. Tsuge ◽  
...  
Keyword(s):  
Thin Film ◽  
Polycrystalline Silicon ◽  
Solid Phase ◽  
Silicon Thin Film ◽  
Solid Phase Crystallization ◽  
High Quality ◽  
Crystallization Method
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