Fundamental Aspects of High Speed Crystal Growth from the Melt

1984 ◽  
Vol 35 ◽  
Author(s):  
A.G. Cullis

ABSTRACTAdvances in the study of high speed crystal growth from the melt are reviewed, with special emphasis on the fast melting and solidification of silicon achieved by use of Q-switched laser radiation pulses. Rapid melting of amorphous Si is confirmed to yield a liquid undercooled by several hundred Kelvins and, under suitable conditions, explosive crystal growth processes can occur. The latter involve the self-sustaining propagation of melt bands buried within the initially amorphous material. When the highest quench-rate conditions are established melting of even crystalline Si can yield a final amorphous solid phase. This breakdown in crystal growth is orientation dependent and can give regimes of crystal defect formation when amor-phization does not take place. The processes which characterize this limiting growth behaviour are discussed.

Author(s):  
A. G. Cullis

Fast melting and solidification of semiconductors by use of Q-switched laser irradiation techniques has provided, during the last few years, a large amount of information on novel high speed crystal growth processes. Under the highest quench rate conditions, the motion of the final solidification interface can be so rapid (many metres per second) that atomic ordering processes are overwhelmed and either defective crystal or even the amorphous solid phase is formed. Most work in this area has been carried out on elemental Si and electron microscopy of solidification structures has played an essential analytical role through both conventional and high resolution imaging studies. The present paper will outline recent progress which has been made in understanding the crystallographic orientation dependence of high-speed growth phenomena.


1990 ◽  
Vol 205 ◽  
Author(s):  
J. S. Custer ◽  
Michael O. Thompson ◽  
D. J. Eaglesham ◽  
D. C. Jacobson ◽  
J. M. Poate ◽  
...  

AbstractThe competition between solid phase epitaxy and random nucleation during thermal annealing of amorphous Si implanted with the fast diffusers Cu and Ag has been studied. For low concentrations of these impurities, solid phase epitaxy proceeds with small deviations from the intrinsic rate and with the impurity remaining in the shrinking amorphous layer. At a critical metal concentration in the amorphous layer of ∼ 0.12 at.% rapid random nucleation occurs, halting epitaxy and transforming the remaining amorphous material to polycrystalline Si via grain growth. The nucleation rate is at least 8 orders of magnitude greater than the intrinsic homogeneous rate. At higher Cu concentrations nucleation is observed below the temperature needed for epitaxy (400°C). This nucleation, clearly caused by the presence of Cu or Ag in the layer, may be induced by the impurities exceeding the absolute stability concentration and starting to phase separate, leading to enhanced crystal Si nucleation in the metal rich regions.


1985 ◽  
Vol 52 ◽  
Author(s):  
E. Myers ◽  
G. A. Rozgonyi ◽  
D. K. Sadana ◽  
W. Maszara ◽  
J. J. Wortman ◽  
...  

ABSTRACTCross-section transmission electron microscopy (X-TEM) has been used to illustrate the amornhous/ crystalline (a/c) micromorphology dependence of various low dose Ge+ preamorphizatlon implants in Si. Ge+ Implants were done at room _emperature at energies of 150 and 300 keV in the dose range of 1 to 9E14 cm−2. These implants result in the formation of either a buried or a continuous amorphous layer, with rough a/c interfaces. Nucleation of spanning “hairpin” dislocations during subsequent solid phase epltaxy (SPE) regrowth is known to be related to rough a/c interface morphology. Very low temperature anneals (VLTA),less than 500°C where the rate of SPE is minimal, were utilized to sharpen rough a/c interfaces prior to subsequent SPE regrowth. Sharpening of rough a/c interfaces is shown to result from an unexpected reverse crystalline to amorphous phase transition. This reverse phase transition results in the dissolution of detached microcrystallltes located within the amorphous layer near the a/c interface. Utilization of VLTA interfacial smoothing prior to SPE regrowth therfore, results in the reduction of residual spanning “hairpin” dislocations along with homogenization of the amorphous material.


1997 ◽  
Vol 472 ◽  
Author(s):  
Hideya Kumomi ◽  
Frank G. Shi

ABSTRACTWe introduce a non-Arrhenius method for measuring free-energy barrier to nucleation, W*, directly from size distribution of crystallites. W* is determined independent of any model for the nucleation barrier and independent of energy barrier to growth. The method is applicable to three-dimensionally growing crystallites, planar crystallites in thin films, and both compact and fractal crystallites. We apply the method to dendritic crystallites obtained by solid-phase crystallization of amorphous Si thin films into which Si+ ions are implanted at various conditions prior to the isothermal annealing. The ion implantation suppresses the nucleation of the crystallites and enhances the crystallite size of the resulting polycrystalline films. The directly measured W* increases as the accelerating energy or the dose of the Si+ ions increases. This result suggests that the observed suppression of the nucleation could not be accounted for simply by the amor-phization of the preexisting crystallites by the ion bombardment.


1983 ◽  
Vol 13 ◽  
Author(s):  
A.G. Cullis

ABSTRACTThe use of Q-switched laser melting techniques to investigate new rapid solidification phenomena is described. It has been found that Si, Ge, GaP and GaAs can give rise to orientation dependent, kinetically-controlled defect generation processes during fast recrystallization from the melt. Indeed, these materials yield amorphous phases at sufficiently high solidification rates. Ultra-fast pulsed melting permits the study of the basic thermodynamic properties of amorphous solids. It is shown that amorphous Si melts to give a normal, low viscosity, undercooled liquid and that novel explosive crystal growth processes can occur in this low temperature regime.


Author(s):  
M. Libera ◽  
J.A. Ott ◽  
K. Siangchaew ◽  
L. Tsung

Channeling occurs when fast electrons follow atomic strings in a crystal where there is a minimum in the potential energy (1). Channeling has a strong effect on high-angle scattering. Deviations in atomic position along a channel due to structural defects or thermal vibrations increase the probability of scattering (2-5). Since there are no extended channels in an amorphous material the question arises: for a given material with constant thickness, will the high-angle scattering be higher from a crystal or a glass?Figure la shows a HAADF STEM image collected using a Philips CM20 FEG TEM/STEM with inner and outer collection angles of 35mrad and lOOmrad. The specimen (6) was a cross section of singlecrystal Si containing: amorphous Si (region A), defective Si containing many stacking faults (B), two coherent Ge layers (CI; C2), and a contamination layer (D). CBED patterns (fig. lb), PEELS spectra, and HAADF signals (fig. lc) were collected at 106K and 300K along the indicated line.


CrystEngComm ◽  
2021 ◽  
Author(s):  
Wancheng Yu ◽  
Can Zhu ◽  
Yosuke Tsunooka ◽  
Wei Huang ◽  
Yifan Dang ◽  
...  

This study proposes a new high-speed method for designing crystal growth systems. It is capable of optimizing large numbers of parameters simultaneously which is difficult for traditional experimental and computational techniques.


2019 ◽  
Vol 3 (8) ◽  
pp. 207-213
Author(s):  
Teruaki Motooka ◽  
Shinji Munetoh ◽  
Ryuzo Kishikawa ◽  
Takahide Kuranaga ◽  
Tomohiko Ogata ◽  
...  

1990 ◽  
Vol 57 (13) ◽  
pp. 1340-1342 ◽  
Author(s):  
J. A. Roth ◽  
G. L. Olson ◽  
D. C. Jacobson ◽  
J. M. Poate

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