Selective Deposition of ZnS Thin Films by KrF Excimer Laser on Patterned Zn Seeds

1993 ◽  
Vol 334 ◽  
Author(s):  
K. Yamane ◽  
M. Murahara

AbstractThe patterned Zn nucleation and the ZnS growth onto the Zn seeds on a thermal oxidized silicon substrate was demonstrated at room temperature with the excimer laser chemical vapor deposition method.The formation of ZnS films was realized by the method based on the two—step process consisting of the nucleation and the subsequent ZnS growth. In the nucleation, a gaseous dimethylzinc was sealed in a reaction chamber and was then evacuated immediately. Then, the substrate surface which was uniformly adsorbed by dimethylzinc molecules was exposed with a single shot irradiation of a patterned KrF laser; Zn seeds were created only on the irradiated parts by a photodecomposition. And the subsequent growth of ZnS was performed by the parallel or perpendicular irradiation methods. As a result, in the perpendicular irradiation method, the high selectivity and crystallinity of the film were performed by irradiating the whole substrate surface with very low fluence of the KrF laser such as 3 mJ/cm2.

2015 ◽  
Vol 780 ◽  
pp. 17-21
Author(s):  
A.F.M. Anuar ◽  
Yufridin Wahab ◽  
M.Z. Zainol ◽  
H. Fazmir ◽  
M. Najmi ◽  
...  

A simple theoretical model and resistor fabrication for calculating the resistance of a polycrystalline silicon thin film is presented. The resistance value for poly-resistor is perfomed in terms of polysilicon thickness and its total area. The KrF excimer laser micromachine is used in assisting the resistor formation for a low pressure chemical vapor deposition (LPCVD) based polysilicon. Laser micromachine with three main parameters is used to aid the fabrication of the poly-resistor; namely as the pulse rate (i.e. number of laser pulses per second), laser beam size and laser energy. These parameters have been investigated to create the isolation between materials and also to achieve the desired poly-resistor shape. Preliminary results show that the 35 um beam size and 15 mJ of energy level is the most effective parameter to produce the pattern. Poly-resistor formation with 12 and 21 number of squares shows the total average resistance of 303.52 Ω and 210.14 Ω respectively. The laser micromachine process also significantly reduce the total time and number of process steps that are required for resistor fabrication.


1995 ◽  
Vol 261 (1-2) ◽  
pp. 76-82 ◽  
Author(s):  
Yoji Imai ◽  
Akio Watanabe ◽  
Masakazu Mukaida ◽  
Kazuo Osato ◽  
Tatsuo Tsunoda ◽  
...  

1997 ◽  
Vol 495 ◽  
Author(s):  
T. Mori ◽  
K. Hatao ◽  
M. Murahara

ABSTRACTA single-crystalline 3C-SiC is very difficult to etch compared with a polycrystalline SiC. Thus, a photochemical pattern etching of the SiC was demonstrated by using Xe2* excimer lamp and ArF or KrF excimer laser. To promote the surface reaction, a Xe2* excimer lamp was employed to produce many radicals on the sample surface; simultaneously, ArF or KrF laser light irradiated the surface via a circuit pattern to dissociate the Si-C bonds. The Si and C reacted with the F and N radicals photo-dissociated from NF3 gas to form SiF4, CFn and CN, which diffused in the reaction cell. As a result, the single-crystalline 3C-SiC was photo-chemically etched effectively. With the NF3 gas of 200Torr, the Xe2* excimer lamp of 7mW/cm2, and the KrF excimer laser of 650mJ/cm2, 20Hz and 10,000shots, the etch depth of 700 Å was successfully achieved.


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