Determination of Shear Stress at a Solder Paste/Stencil Interface

1993 ◽  
Vol 323 ◽  
Author(s):  
Linda M. Head ◽  
Vincent Rogers ◽  
Chitteranjan Sahay ◽  
James Constable
Keyword(s):  
Shear Stress ◽  
Mechanical Test ◽  
Test Procedure ◽  
Shear Thinning ◽  
Solder Paste ◽  
Parallel Plates ◽  
Release Process ◽  
Stencil Printing ◽  
Plate Separation ◽  
Lift Off

AbstractTo create a model for the release process of solder paste during stencil printing for surface mount applications it is necessary to determine the shear stress developed at the interface between the solder paste and stencil sidewall. An experiment has been developed to determine the value of the shear stress for solder paste samples. For the purpose of this experiment a Micro-mechanical tester has been adapted and programmed to provide both a shear thinning cycle and a pull-off cycle that simulate aperture fill and stencil lift-off. The shear stress developed at the solder/stencil-sidewall interface is estimated from the data obtained during the pull-off portion of the Micro-mechanical test procedure. The micro-mechanical tester is fitted with a set of parallel plates that can be adjusted for plate separation and surface roughness.The experiment consists of two parts: (1) the shear thinning cycle and (2) the horizontal pull-off. After application of the solder paste and adjustment of plate separation, a back and forth movement of the upper plate provides shear thinning of the paste. This step is necessary to simulate the shear thinning that occurs from the application of squeege pressure during aperture fill. The horizontal pull-off then simulates the lift-off step of the stencil printing procedure. During the horizontal pull-off data is. taken which allows calculation of the force developed as the upper plate is pulled away from the lower. Results from this experiment show the values of shear stress that develop during pull-off with a variation of surface treatments and plate separations.This paper will present the experimental set-up, a description of the relationship between this experiment and the actual stencil lift-off process, and shear stress data that has been acquired for a variety of solder pastes and plate separations.

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

1999 ◽  
Vol 121 (3) ◽  
pp. 169-178 ◽  
Author(s):  
G. Rodriguez ◽  
D. F. Baldwin
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Imaging System ◽  
Main Process ◽  
Print Quality ◽  
Solder Paste ◽  
Release Process ◽  
Stencil Printing ◽  
Fine Pitch ◽  
Analytical Approaches

Advanced electronics packaging technologies such as chip scale packages, fine pitch ball grid arrays, and flip chip are pushing solder paste stencil printing to the limit. In order to achieve solder print deposits of the sizes required for emerging electronic packaging technology, a rigorous understanding of the process is required. This paper seeks to expand our understanding of the physical characteristics of stencil printing specifically focusing on the solder paste release process based on experimental and analytical approaches. First, designed experiments were conducted to identify the main process variables affecting final print quality. An in-situ measurement system using a high speed imaging system monitored the solder paste release process. Based on experimental observations, different modes of solder paste release and their corresponding mechanisms were identified. A model was developed to predict print quality for fine pitch applications. The proposed model was experimentally verified showing good agreement with measured values for fine pitch and very fine pitch printing. It was found that the cohesive and adhesive forces acting on the paste tend to govern the release process rather than the viscous and inertial forces.

Study of Print Release Process in Solder Paste Printing

1995 ◽  
Vol 117 (3) ◽  
pp. 230-234 ◽  
Author(s):  
C. Sahay ◽  
L. M. Head ◽  
R. Shereen ◽  
P. Dujari ◽  
J. H. Constable ◽  
...  
Keyword(s):  
Shear Strength ◽  
Print Quality ◽  
Solder Paste ◽  
Release Process ◽  
Wall Area ◽  
Soldering Process ◽  
Solder Paste Printing ◽  
Lift Off ◽  
Definition Of ◽  
Paste Properties

Solder paste printing is central to the mass reflow soldering process for surface mount technology. The miniaturization of components has put an increased demand on the printing process and requires it to successfully print 75 μm-100 μm(3 to 4 mil) wide apertures. The amount of solder paste deposited is a matter of concern. This study presents results from experiments on printing with apertures having circular, rectangular, square and triangular geometries. The ratio of the printed volume to the aperture volume has been used as a definition of print quality. It was observed that acceptable prints were obtained when the ratio of aperture area to the aperture wall area was more than 0.8. A simple analytical model is also presented for the release of solder paste as the stencil separates from the substrate board assuming that the apertures were filled. The solder is currently treated as a single phase material with Newtonian behavior. The motion of solder paste in the stencil aperture is modelled as the developing viscous flow with velocity boundary layers developing along the walls. The shear strength of the paste is used to determine the area sticking to the wall, thus making it possible to get an estimate of the print quality. The model incorporates the effect of paste properties like viscosity, density, tack and shear strength, and other process variables like aperture dimensions and separation (lift off) velocities between the stencil and the board in predicting the print quality. The model predicts the effect of shear to tack strength of the paste, stencil thickness, and the ratio of aperture to wall area ratio on print quality.

scholarly journals The Effect of Wall Shear Stress on Two Phase Fluctuating Flow of Dusty Fluids by Using Light Hill Technique

Water ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1587
Author(s):  
Dolat Khan ◽  
Ata ur Rahman ◽  
Gohar Ali ◽  
Poom Kumam ◽  
Attapol Kaewkhao ◽  
...  
Keyword(s):  
Shear Stress ◽  
Wall Shear Stress ◽  
Base Fluid ◽  
Perturbation Technique ◽  
Fluid Velocity ◽  
Dust Particles ◽  
Stress Effect ◽  
Parallel Plates ◽  
Dusty Fluid ◽  
Wall Shear

Due to the importance of wall shear stress effect and dust fluid in daily life fluid problems. This paper aims to discover the influence of wall shear stress on dust fluids of fluctuating flow. The flow is considered between two parallel plates that are non-conducting. Due to the transformation of heat, the fluid flow is generated. We consider every dust particle having spherical uniformly disperse in the base fluid. The perturb solution is obtained by applying the Poincare-Lighthill perturbation technique (PLPT). The fluid velocity and shear stress are discussed for the different parameters like Grashof number, magnetic parameter, radiation parameter, and dusty fluid parameter. Graphical results for fluid and dust particles are plotted through Mathcad-15. The behavior of base fluid and dusty fluid is matching for different embedded parameters.

Investigation on the Rheological Behavior of Polyamide6/Montmorillonite Nanocomposites by Reactive Extrusion

2011 ◽  
Vol 233-235 ◽  
pp. 1998-2001 ◽  
Author(s):  
Ming Zhao ◽  
Xiao Zhong Lu ◽  
Kai Gu ◽  
Xiao Min Sun ◽  
Chang Qing Ji
Keyword(s):  
Activation Energy ◽  
Shear Stress ◽  
Shear Rate ◽  
Rheological Behavior ◽  
Reactive Extrusion ◽  
Shear Thinning ◽  
Experimental Results ◽  
Montmorillonite Nanocomposites

The rheological behavior of PA6/montmorillonite(MMT) by reactive extrusion was investigated using cone-and-plate rheometer. The experimental results indicated that PA6/MMT exhibited shear-thinning behavior. The shear stress of both neat PA6 and PA6/MMT increased with the increase in the shear rate. The reduction of the viscous activation energy with the increase of shear stress reflected PA6/MMT can be processed over a wider temperature.

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

1999 ◽  
Author(s):  
Jianbiao Pan ◽  
Gregory L. Tonkay
Keyword(s):  
Flip Chip ◽  
Deposition Process ◽  
Area Ratio ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Surface Mount ◽  
Fine Pitch ◽  
Main Indicator ◽  
Advanced Packaging

Abstract Stencil printing has been the dominant method of solder deposition in surface mount assembly. With the development of advanced packaging technologies such as ball grid array (BGA) and flip chip on board (FCOB), stencil printing will continue to play an important role. However, the stencil printing process is not completely understood because 52–71 percent of fine and ultra-fine pitch surface mount assembly defects are printing process related (Clouthier, 1999). This paper proposes an analytical model of the solder paste deposition process during stencil printing. The model derives the relationship between the transfer ratio and the area ratio. The area ratio is recommended as a main indicator for determining the maximum stencil thickness. This model explains two experimental phenomena. One is that increasing stencil thickness does not necessarily lead to thicker deposits. The other is that perpendicular apertures print thicker than parallel apertures.

2. Adhesion of the plasma-polymerized fluorocarbon films to silicon substrates The adhesion properties of the plasma-polymerized FC coatings were determined by using a test, already employed by Yasuda and Sharma [13] (see Fig. 1 and Table 1) in which the silicon substrates coated with plasma FC-films were boiled in a0.9% sodium chloride solution. The FC thin films produced in the processes 1 and 2 were lifted after a very short time (15 minutes). Coatings generated in process 3 were lifted after the second cycle of boiling. The films produced in processes 4 and 5 withstood the complete test procedure. The results are shown in Fig. 3. The poor adhesion of the polymerized films in the first two processes is due to the fact that these processes do not involve a plasma pre-treatment process. The difference between processes 1 and 3 is only in the plasma pre-treatment (process 1 does not contain the pre-treatment step of the silicon surface). The fluorocarbon films deposited by processes 4 and 5 have shown the best adhesion. These test results indicate that the plasma pre-treatment is very important and necessary for a good adhesion of the FC coatings to the silicon surfaces. 2.3. Patterning of FC films 2.3.1. Patterning through resist mask. The patterning of the FC films through a photoresist mask (conventional All resist AR-P351) was examined after deposition for process No. 5. Different coating parameters were investigated to improve the adhesion of the resist to the FC surface. The best adhesion results were obtained using the process parameters, shown in Table 3. Differences in the thickness uniformity of so-deposited resists were in a range below 5%. The samples were etched in a pure oxygen plasma in an RIE-system after the lithography steps (pre-bake, exposure, development, post-bake). A resolution of 2 /xm was obtained. A significant increase in the surface energy was not observed after resist stripping. The sessile contact angle of water was 103°. 2.3.2. Lift-off process for patterning thin plasma polymerized FC films. A lift-off process was also examined to pattern the thin FC films. The lithography steps were used before the plasma polymerization process was carried out (Fig. 2). A standard resist AR-P351 was coated directly onto the Si substrates. After all lithography

2014 ◽  
pp. 275-278
Keyword(s):  
Treatment Process ◽  
Test Procedure ◽  
Silicon Surfaces ◽  
Silicon Substrates ◽  
Fluorocarbon Films ◽  
Si Substrates ◽  
Complete Test ◽  
The Difference ◽  
Pre Treatment ◽  
Lift Off

scholarly journals A Mechanical Test Procedure for Avalanche Snow

1977 ◽  
Vol 19 (81) ◽  
pp. 489-497 ◽  
Author(s):  
S. L. McCabe ◽  
F. W. Smith
Keyword(s):  
Mechanical Test ◽  
Test Procedure ◽  
Testing Machine ◽  
Constant Strain Rate ◽  
Time Behavior ◽  
Stress Strain ◽  
Direct Measurements ◽  
Natural Snow ◽  
Relaxation Curves ◽  
Design Construction

AbstractThe design, construction and testing of a portable, constant strain-rate testing machine for determining the mechanical behavior of avalanche now is described. The machine is intended for use in determining the stress-strain-time behavior of low-density natural snow in the field. A technique for making direct measurements of strain in the snow sample is described and stress-strain curves are presented for strain-rates ranging from 0.5 to 5.0 × 10−5 s−1. The densities of the snow samples tested range from 186 to 335 kg m−3. Ultimate-strength data and relaxation curves are also presented.

ENTROPY GENERATION FOR A NON-NEWTONIAN SHEAR THINNING FLUID WITH VISCOUS HEATING EFFECTS

2017 ◽  
Vol 41 (4) ◽  
pp. 593-607
Author(s):  
Muharrem Imal ◽  
Coskun Ozalp ◽  
Bulent Yaniktepe ◽  
Mohammed Mehdi-Rashidi ◽  
Ertac Hurdogan
Keyword(s):  
Temperature Dependence ◽  
Entropy Generation ◽  
Pseudospectral Method ◽  
Shear Thinning ◽  
Bejan Number ◽  
Parallel Plates ◽  
Heating Effects ◽  
Exponential Temperature Dependence ◽  
Power Law Index ◽  
Shear Thinning Fluid

This paper reports the entropy generation of a two-dimensional, non-isothermal, steady, hydrodynamically and thermally fully-developed flow of an incompressible, non-Newtonian shear thinning fluid between two infinite parallel plates. The inelastic fluid is modeled by a two parameter Carreau constitutive equation with an exponential temperature dependence of viscosity. Temperature dependence of the fluid is modeled through Arrhenius law. Momentum and energy balance equations, which govern the flow, are coupled, and this nonlinear boundary value problem is solved numerically using a Pseudospectral method based on the Chebyshev polynomials. The effect of various flow controlling parameters on velocity, temperature and entropy generation is analyzed. The results indicated that Brinkman number and activation energy have opposite effects on entropy generation due to heat transfer. In contrast to the power-law index, an increase in the material time constant results in a decrease in the Bejan Number.

Optimising pin-in-paste technology using gradient boosted decision trees

2018 ◽  
Vol 30 (3) ◽  
pp. 164-170 ◽  
Author(s):  
Péter Martinek ◽  
Oliver Krammer
Keyword(s):  
Decision Tree ◽  
Prediction Method ◽  
Percentage Error ◽  
Solder Paste ◽  
Hole Filling ◽  
Decision Tree Learning ◽  
Stencil Printing ◽  
Content Type ◽  
Learning Techniques ◽  
Through Hole

Purpose This paper aims to present a robust prediction method for estimating the quality of electronic products assembled with pin-in-paste soldering technology. A specific board quality factor was also defined which describes the expected yield of the board assembly. Design/methodology/approach Experiments were performed to obtain the required input data for developing a prediction method based on decision tree learning techniques. A Type 4 lead-free solder paste (particle size 20–38 µm) was deposited by stencil printing with different printing speeds (from 20 mm/s to 70 mm/s) into the through-holes (0.8 mm, 1 mm, 1.1 mm, 1.4 mm) of an FR4 board. Hole-filling was investigated with X-ray analyses. Three test cases were evaluated. Findings The optimal parameters of the algorithm were determined as: subsample is 0.5, learning rate is 0.001, maximum tree depth is 6 and boosting iteration is 10,000. The mean absolute error, root mean square error and mean absolute percentage error resulted in 0.024, 0.03 and 3.5, respectively, on average for the prediction of the hole-filling value, based on the printing speed and hole-diameter after optimisation. Our method is able to predict the hole-filling in pin-in-paste technology for different through-hole diameters. Originality/value No research works are available in current literature regarding machine learning techniques for pin-in-paste technology. Therefore, we decided to develop a method using decision tree learning techniques for supporting the design of the stencil printing process for through-hole components and pin-in-paste technology. The first pass yield of the assembly can be enhanced, and the reflow soldering failures of pin-in-paste technology can be significantly reduced.

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