An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints
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AbstractThermal cyclic shear stress/strain hysteresis response of 97Sn-2Cu-0.8Sb-0.2Ag, 95.5Sn-4Cu-0.5Ag, 63Sn-37Pb, and 62Sn-36Pb-2Ag solder joints have been determined using a double beam specimen. The temperature cycle had a period of 40 minutes and extreme temperatures of 40°C and 140°C.The steady state creep properties of these solders were determined, and the associated Norton's law was implemented in a finite element program to simulate the experiment. The fatigue life of these solders joints and failure mechanism are also discussed.
1993 ◽
Vol 115
(2)
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pp. 147-152
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2011 ◽
Vol 374-377
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pp. 2009-2012
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2013 ◽
Vol 631-632
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pp. 518-523
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