Significance of a Nucleation Layer in Inhibiting Interfacial Pitting in InAs Films Grown by Two-Step MOVCD on (100) Inp Substrates

1993 ◽  
Vol 312 ◽  
Author(s):  
A. K. Ballal ◽  
L. Salamanca-Riba ◽  
D. L. Partin
Keyword(s):  
Electron Microscopy ◽  
Low Temperature ◽  
Substrate Surface ◽  
Threading Dislocation ◽  
High Electron ◽  
Nucleation Layer ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Temperature Deposition ◽  
Higher Temperature

AbstractIn this paper, we study the significance of a low temperature nucleation layer and its role in inhibiting interfacial pitting vapor deposition. Transmission electron microscopy and scanning electron microscopy studies show that severe interfacial pitting occurs for thin nucleation layers of average thicknesses of 200Å and 400Å. For these average nucleation layer thicknesses we have found that the InAs islands do not cover the entire substrate surface during the low temperature deposition. Hence, when the film is heated to a higher temperature for the growth of the remainder of the film severe pitting at the heterointerface is produced. The thermal etchpits are sources of threading dislocations, which propagate to the surface of the film. For thicker nucleation layers we observe no interfacial pitting. Our studies show that there is an optimum nucleation layer thickness for which high quality InAs films with reduced threading dislocation densities and relatively high electron mobilities are obtained. Both electrical and structural studies suggest that ∼ 800Å is an optimum thickness of the low temperature nucleation layer.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

High electron mobility in AlGaN/GaN HEMT grown on sapphire: strain modification by means of AlN interlayers.

2003 ◽  
Vol 798 ◽  
Author(s):  
Marianne Germain ◽  
Maarten Leys ◽  
Steven Boeykens ◽  
Stefan Degroote ◽  
Wenfei Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Sheet Resistance ◽  
Electron Mobility ◽  
Record Values ◽  
Strain Engineering ◽  
Threading Dislocation ◽  
High Electron ◽  
Nucleation Layer ◽  
High Electron Mobility ◽  
Al Content

ABSTRACTThe performance of AlGaN/GaN High Electron Mobility (HEMT) transistors is directly related to the electrical characteristics of the two-dimensional electron gas formed at the interface thanks to the piezoelectric field. Modification of the Al content or thickness of the AlGaN layer can within a certain limit modify the carrier density and mobility in the 2DEG. However, further reduction of the sheet resistance requires strain engineering of the heterostructure. An effective way to reduce the sheet resistance, as well as to lower the threading dislocation (TD) density, is to perform strain engineering through the use of low temperature AlN interlayers inserted in the GaN buffer layer. From correlation of AFM, TEM and HRXRD mapping of the HEMT layers, the strain modification, as well as the mechanism reducing the TD density, can be explained by the highly defected nature of the AlN interlayer grown at low temperature, as well as its very small thickness. The LT AlN acts as a second nucleation layer for the GaN grown on top. Contrarily, when the AlN interlayer is grown at 1050°C, its high crystalline quality and the possibility to grow pseudomorphic and abrupt interfaces, allows its use at the AlGaN/GaN interface. Optimal combination of the AlGaN and AlN layer thickness leads to record values of the mobility at room temperature of 2050 cm2/Vs, for heterostructures grown on sapphire, which is approaching state-of-the-art for HEMT grown on SiC.

Growth of Metamorphic InGaP for Wide-Bandgap Photovoltaic Junction by MBE

2010 ◽  
Vol 1268 ◽  
Author(s):  
John Simon ◽  
Stephanie Tomasulo ◽  
Paul Simmonds ◽  
Manuel J Romero ◽  
Minjoo Larry Lee
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Molecular Beam ◽  
Strain Relaxation ◽  
Wide Bandgap ◽  
Threading Dislocation ◽  
Step Size ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Substrate Temperatures

AbstractMetamorphic triple-junction solar cells can currently attain efficiencies as high as 41.1%. Using additional junctions could lead to efficiencies above 50%, but require the development of a wide bandgap (2.0-2.2eV) material to act as the top layer. In this work we demonstrate wide bandgap InyGa1-yP grown on GaAsxP1-x via solid source molecular beam epitaxy. Unoptimized tensile GaAsxP1-x buffers grown on GaAs exhibit asymmetric strain relaxation, along with formation of faceted trenches 100-300 nm deep in the [01-1] direction. Smaller grading step size and higher substrate temperatures minimizes the facet trench density and results in symmetric strain relaxation. In comparison, compressively-strained graded GaAsxP1-x buffers on GaP show nearly-complete strain relaxation of the top layers and no evidence of trenches. We subsequently grew InyGa1-yP layers on the GaAsxP1-x buffers. Photoluminescence and transmission electron microscopy measurements show no indication of phase separation or CuPt ordering. Taken in combination with the low threading dislocation densities obtained, MBE-grown InyGa1-yP layers are promising candidates for future use as the top junction of a multi-junction solar cell.

Electron Microscopy Investigation of the Role of Surface Steps in the Generation of Dislocations during MOCVD Growth of GaN on 4H-SiC

2006 ◽  
Vol 527-529 ◽  
pp. 1509-1512 ◽  
Author(s):  
N.D. Bassim ◽  
Mark E. Twigg ◽  
Michael A. Mastro ◽  
Philip G. Neudeck ◽  
Charles R. Eddy ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Substrate Surface ◽  
Atomic Scale ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Nucleation Layer ◽  
Plan View ◽  
Surface Steps

Through the use of specially-prepared on-axis SiC substrates with patterned mesa tops completely free of atomic-scale surface steps, we have previously reported the growth of highquality GaN heteroepitaxial films with greatly reduced threading dislocation densities on the order of 107/cm2. In these films, we reported a defect substructure in which lateral a-type dislocations are present in the nucleation layer but do not bow into threading dislocations during the subsequent GaN growth. This study focuses further on the role of SiC substrate surface steps in the generation of misfit, a-type, and threading dislocations at the heteroepitaxial interface. By using weak-beam imaging (both to eliminate Moiré effects and to observe narrow dislocation images) from plan-view transmission electron microscopy (TEM), we identify dislocations generated on stepped and unstepped mesas and compare their geometries. We observe that misfit dislocations nucleated on an unstepped SiC mesa are confined to one set of a-type Burgers vectors of the form g=1/3 [2110] _ _ , straight and well-ordered so that they are less likely to interact with each other. On the other hand, misfit dislocation structures on a stepped SiC mesa surface are not nearly as well-ordered, having bowed structure with threading dislocations that appear to nucleate at SiC surface steps.

Nucleation of Disorder in Fe3Al Alloys

1967 ◽  
Vol 25 ◽  
pp. 312-313
Author(s):  
P. R. Swann ◽  
W. R. Duff ◽  
R. M. Fisher
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Annealing Temperature ◽  
Antiphase Domain ◽  
Effect Of Temperature ◽  
Domain Structures ◽  
Transmission Electron ◽  
Domain Boundaries ◽  
Higher Temperature ◽  
The One

Recently we have investigated the phase equilibria and antiphase domain structures of Fe-Al alloys containing from 18 to 50 at.% Al by transmission electron microscopy and Mössbauer techniques. This study has revealed that none of the published phase diagrams are correct, although the one proposed by Rimlinger agrees most closely with our results to be published separately. In this paper observations by transmission electron microscopy relating to the nucleation of disorder in Fe-24% Al will be described. Figure 1 shows the structure after heating this alloy to 776.6°C and quenching. The white areas are B2 micro-domains corresponding to regions of disorder which form at the annealing temperature and re-order during the quench. By examining specimens heated in a temperature gradient of 2°C/cm it is possible to determine the effect of temperature on the disordering reaction very precisely. It was found that disorder begins at existing antiphase domain boundaries but that at a slightly higher temperature (1°C) it also occurs by homogeneous nucleation within the domains. A small (∼ .01°C) further increase in temperature caused these micro-domains to completely fill the specimen.

Role of boundaries in the crystallization of amorphous films

1988 ◽  
Vol 46 ◽  
pp. 626-627
Author(s):  
D. A. Smith
Keyword(s):  
Low Temperature ◽  
Amorphous State ◽  
Nucleation And Growth ◽  
Amorphous Films ◽  
Island Nucleation ◽  
Surface Steps ◽  
Transmission Electron ◽  
Component Systems ◽  
Temperature Deposition

The nucleation and growth processes which lead to the formation of a thin film are particularly amenable to investigation by transmission electron microscopy either in situ or subsequent to deposition. In situ studies have enabled the observation of island nucleation and growth, together with addition of atoms to surface steps. This paper is concerned with post-deposition crystallization of amorphous alloys. It will be argued that the processes occurring during low temperature deposition of one component systems are related but the evidence is mainly indirect. Amorphous films result when the deposition conditions such as low temperature or the presence of impurities (intentional or unintentional) preclude the atomic mobility necessary for crystallization. Representative examples of this behavior are CVD silicon grown below about 670°C, metalloids, such as antimony deposited at room temperature, binary alloys or compounds such as Cu-Ag or Cr O2, respectively. Elemental metals are not stable in the amorphous state.

Low-temperature annealing of YBa2Cu3O7-x

1992 ◽  
Vol 50 (1) ◽  
pp. 88-89
Author(s):  
R.L. Sabatini ◽  
Yimei Zhu ◽  
Masaki Suenaga ◽  
A.R. Moodenbaugh
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Low Temperature ◽  
Oxygen Diffusion ◽  
Diffusion Rate ◽  
Oxygen Depletion ◽  
Low Temperature Annealing ◽  
Transmission Electron ◽  
Microstructural Effects ◽  
Oxygen Diffusion Rate

Low temperature annealing (<400°C) of YBa2Cu3O7x in a ozone containing oxygen atmosphere is sometimes carried out to oxygenate oxygen deficient thin films. Also, this technique can be used to fully oxygenate thinned TEM specimens when oxygen depletion in thin regions is suspected. However, the effects on the microstructure nor the extent of oxygenation of specimens has not been documented for specimens exposed to an ozone atmosphere. A particular concern is the fact that the ozone gas is so reactive and the oxygen diffusion rate at these temperatures is so slow that it may damage the specimen by an over-reaction. Thus we report here the results of an investigation on the microstructural effects of exposing a thinned YBa2Cu3O7-x specimen in an ozone atmosphere using transmission electron microscopy and energy loss spectroscopy techniques.

Ion thinning of integrated circuit transverse specimens for transmission electron microscopy

1992 ◽  
Vol 50 (2) ◽  
pp. 1426-1427
Author(s):  
F. Shaapur
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Integrated Circuit ◽  
Substrate Surface ◽  
Homogeneous Material ◽  
Material System ◽  
Ion Milling ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Motion Profile

Non-uniform ion-thinning of heterogenous material structures has constituted a fundamental difficulty in preparation of specimens for transmission electron microscopy (TEM). A variety of corrective procedures have been developed and reported for reducing or eliminating the effect. Some of these techniques are applicable to any non-homogeneous material system and others only to unidirectionalfy heterogeneous samples. Recently, a procedure of the latter type has been developed which is mainly based on a new motion profile for the specimen rotation during ion-milling. This motion profile consists of reversing partial revolutions (RPR) within a fixed sector which is centered around a direction perpendicular to the specimen heterogeneity axis. The ion-milling results obtained through this technique, as studied on a number of thin film cross-sectional TEM (XTEM) specimens, have proved to be superior to those produced via other procedures.XTEM specimens from integrated circuit (IC) devices essentially form a complex unidirectional nonhomogeneous structure. The presence of a variety of mostly lateral features at different levels along the substrate surface (consisting of conductors, semiconductors, and insulators) generally cause non-uniform results if ion-thinned conventionally.

Low Temperature Large Scale CVD Synthesis of Nano Onion-Like Fullerenes

2012 ◽  
Vol 490-495 ◽  
pp. 3211-3214 ◽  
Author(s):  
Lei Shan Chen ◽  
Cun Jing Wang
Keyword(s):  
Electron Microscopy ◽  
Low Temperature ◽  
Aluminum Hydroxide ◽  
Large Scale ◽  
Iron Catalyst ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Naoh Solution ◽  
Synthesis Reactions

Synthesis reactions were carried out by chemical vapor deposition using iron catalyst supported on aluminum hydroxide at 400 °C and 420 °C, in the presence of argon as carrier gas and acetylene as carbon source. The aluminum hydroxide support was separated by refluxing the samples in 40% NaOH solution for 2 h and 36% HCl solution for 24 h, respectively. The samples were characterized by field-emission scanning electron microscopy, energy dispersive spectroscopy, high-resolution transmission electron microscopy and X-ray diffraction. The results show that carbon nanotubes were the main products at 420 °C, while large scale high purity nano onion-like fullerenes encapsulating Fe3C, with almost uniform sizes ranging from 10-50 nm, were obtained at the low temperature of 400 °C.

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