Thermal Stress in Doped Silicate Glasses (B,P) Deposited by PECVD and LPCVD
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ABSTRACTUsing an in situ stress measurement technique which measures stress as a function of annealing temperature, we have investigated the effect of phosphorous and boron doping of silicon dioxide glass films deposited by low-pressure chemical vapor deposition (LPCVD) and plasma-enhanced chemical vapor deposition (PECVD). The stress at room temperature is σi. Upon heating, it increases to a maximum, σm, corresponding to a temperature Tm, above which the stress is reduced to zero at a temperature T0. All these parameters plus the expansion coefficient are dependent on dopant concentrations and deposition technique.
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2016 ◽
Vol 63
(10)
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pp. 3887-3892
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2014 ◽
Vol 53
(4S)
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pp. 04EH02
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2012 ◽
Vol 121
(1)
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pp. 175-177
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2014 ◽
Vol 04
(04)
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pp. 389-395
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1997 ◽
Vol 144
(11)
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pp. 3952-3958
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