Refractoriness of High-Current and Low Acceleration Voltage Arsenic-Ion Implanted Polycrystalline Silicon Against Fluorine Chemistry

1992 ◽  
Vol 279 ◽  
Author(s):  
Yasuyuki Saito
Keyword(s):  
Chemical Bonding ◽  
Polycrystalline Silicon ◽  
Vibration Suppression ◽  
Ion Beam ◽  
Silicon Film ◽  
Amorphous State ◽  
High Dose ◽  
High Current ◽  
Simple Assumption ◽  
Acceleration Voltage

ABSTRACTThe author observed that both high-current-ion-beam and low-accelerationvoltage arsenic-implanted polycrystalline silicon-film surfaces are resistant to radical-fluorine-gas-etching. If we accept the simple assumption that a depth profile of concentration distribution of the implanted high-dose As atoms in polycrystalline Si film can be expressed with a standardized distribution function in the previous report of S. Furukawa, H. matsumura, and H. Ishiwara [Jpn. J. Appl. Phys. 11, 134 (1972)], we can take the premise that the chemical bonding reaction itself between radical-fluorine atoms and silicon atoms is prevented rather than that the covering of an arsenic- metal thin layer like amorphous state prevents the chemical bonding- reaction. We present a model of the prevention Si-F bond formation by high-dose arsenic implantation at low acceleration voltage. The model seems to be related to potential barrier increase and lattice vibration suppression for electromagnetic force-phonon interaction.

High-Current and Low Acceleration Voltage Arsenic Ion Implanted Polysilicon-Gate and Source-Drain Electrode Si MOS Transistor

1992 ◽  
Vol 279 ◽  
Author(s):  
Yasuyuki Saito ◽  
Yoshiro Sugimura ◽  
Michiyuki Sugihara
Keyword(s):  
Ion Implantation ◽  
Oxide Semiconductor ◽  
Implantation Technique ◽  
High Dose ◽  
High Current ◽  
Single Chip ◽  
Mos Transistor ◽  
Polysilicon Gate ◽  
Acceleration Voltage ◽  
Ion Implanted

ABSTRACTThe fabrication process of high current arsenic (As) ion implanted poly-silicon (Si) gate and source-drain (SD) electrode Si n-channel metal-oxide-semiconductor field-effect-transistor (MOSFET) was examined. Poly-Si film n-type doping was performed by using high current (typical current: 2mA) and relatively low acceleration voltage (40keV) As ion implantation technique (Lintott series 3). It was observed that high dose-As implanted poly-Si films as is show refractoriness against radical fluorine excited by microwave. Using GCA MANN4800 (m/c ID No.2, resist: OFPR) mask pattern printing technique, the high current As ion implantation technique and radical fluorine gas phase etching (Chemical dry etching: CDE) technique. the n-channel poly-Si gate (ps=∼L00ft/o) enhancement MOSFETs(ps-source-drain = =50n/o, SiO2 gate=380A) with off-leak-less were obtained on 3”Czochralski-grown 2Ωcm boron-doped p-type wafers (Osaka titanium). By the same process, a 8-bit single chip μ-processor with 26MHz full operation was performed.

A Thin-Film Transistor Using a Reactive-Ion-Beam-Deposited Polycrystalline Silicon Film

1988 ◽  
Vol 27 (Part 1, No. 6) ◽  
pp. 1002-1004 ◽  
Author(s):  
Kenji Nakazawa ◽  
Hiroshi Yamada ◽  
Shigeto Kohda ◽  
Yasuhiro Torii
Keyword(s):  
Thin Film ◽  
Polycrystalline Silicon ◽  
Ion Beam ◽  
Thin Film Transistor ◽  
Silicon Film ◽  
Polycrystalline Silicon Film

scholarly journals Ion Beam Modification of the Y-Ba-Cu-O System with the Mevva High Current Metal Ion Source

1989 ◽  
Vol 147 ◽  
Author(s):  
I. G. Brown ◽  
M. D. Rubin ◽  
K. M. Yu ◽  
R. Mutikainen ◽  
N. W. Cheung
Keyword(s):  
Ion Implantation ◽  
Metal Ion ◽  
Rutherford Backscattering Spectrometry ◽  
Ion Beam ◽  
Rf Sputtering ◽  
Ion Source ◽  
Vacuum Arc ◽  
High Dose ◽  
High Current ◽  
Ion Beam Modification

AbstractWe have used high-dose metal ion implantation to ‘fine tune’ the composition of Y-Ba- Cu-O thin films. The films were prepared by either of two rf sputtering systems. One system uses three modified Varian S-guns capable of sputtering various metal powder targets; the other uses reactive rf magnetron sputtering from a single mixed-oxide stoichiometric solid target. Film thickness was typically in the range 2000–5000 A. Substrates of magnesium oxide, zirconia-buffered silicon, and strontium titanate have been used. Ion implantation was carried out using a metal vapor vacuum arc (MEVVA) high current metal ion source. Beam energy was 100–200 keV, average beam current about 1 mA, and dose up to about 1017 ions/cm2. Samples were annealed at 800 – 900°C in wet oxygen. Film composition was determined using Rutherford Backscattering Spectrometry (RBS), and the resistivity versus temperature curves were obtained using a four-point probe method. We find that the zero-resistance temperature can be greatly increased after implantation and reannealing, and that the ion beam modification technique described here provides a powerful means for optimizing the thin film superconducting properties.

The Effect of Substrate Temperature on the Crystallinity and Stress of Ion Beam Sputtered Silicon on Various Substrates

1994 ◽  
Vol 338 ◽  
Author(s):  
Cynthia G. Madras ◽  
L. Goldman ◽  
P.Y. Wong ◽  
I.N. Miaoulis
Keyword(s):  
Vapor Deposition ◽  
Polycrystalline Silicon ◽  
Physical Vapor Deposition ◽  
Ion Beam ◽  
Silicon Film ◽  
Silicon Films ◽  
Thermally Stable ◽  
Ion Beam Sputtering ◽  
Wide Range ◽  
Polycrystalline Silicon Films

ABSTRACTAmorphous and polycrystalline silicon films are commonly used in a wide range of microelectronic and optical devices. Polycrystalline silicon is conventionally deposited by chemical vapor deposition (CVD) at temperatures in excess of 600°C. At these high deposition temperatures, thermal diffusion of dopants and thermally induced chemical reactions may occur within the substrate or device. Also, substrates with low melting temperatures such as germanium, may undergo irreversible deformation. In the present study, ion beam sputtering has been shown to enable the deposition of a stable polycrystalline silicon film on germanium as well as on silicon and glass substrates at temperatures as low as 350-400°C. The crystallization properties of silicon on the different substrate surfaces is reported. Crystallinity of the ion beam sputtered silicon films as a function of deposition temperature and substrate type is measured by X-Ray diffraction. These polysilicon films are shown to be thermally stable, have randomly oriented crystals, and have good adhesion to the substrates despite high compressive deposition stresses ranging from 700MPa to 1000MPa. Magnetron sputtered silicon films deposited on substrates in the same temperature range produced only completely amorphous films, with lower stresses and which are also thermally stable. This study demonstrated the feasibility of depositing extremely hard polycrystalline silicon films on germanium and other substrates by means of physical vapor deposition at temperatures as low as 350°C.

Preparation of TEM samples by focused ion beams

1995 ◽  
Vol 53 ◽  
pp. 518-519
Author(s):  
John F. Walker ◽  
J C Reiner ◽  
C Solenthaler
Keyword(s):  
Integrated Circuit ◽  
Polycrystalline Silicon ◽  
Field Effect Transistor ◽  
High Spatial Resolution ◽  
Ion Beam ◽  
Ion Beams ◽  
Focused Ion Beams ◽  
Precise Location ◽  
Effect Transistor ◽  
Circuit Technology

The high spatial resolution available from TEM can be used with great advantage in the field of microelectronics to identify problems associated with the continually shrinking geometries of integrated circuit technology. In many cases the location of the problem can be the most problematic element of sample preparation. Focused ion beams (FIB) have previously been used to prepare TEM specimens, but not including using the ion beam imaging capabilities to locate a buried feature of interest. Here we describe how a defect has been located using the ability of a FIB to both mill a section and to search for a defect whose precise location is unknown. The defect is known from electrical leakage measurements to be a break in the gate oxide of a field effect transistor. The gate is a square of polycrystalline silicon, approximately 1μm×1μm, on a silicon dioxide barrier which is about 17nm thick. The break in the oxide can occur anywhere within that square and is expected to be less than 100nm in diameter.

Defect reduction in oxygen implanted silicon-on-insulator material during high-temperature annealing

1989 ◽  
Vol 47 ◽  
pp. 604-605
Author(s):  
P. Roitman ◽  
B. Cordts ◽  
S. Visitserngtrakul ◽  
S.J. Krause
Keyword(s):  
High Temperature ◽  
Annealing Temperature ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Temperature Annealing ◽  
High Current ◽  
Defect Reduction ◽  
Annealing Step ◽  
Multiple Cycle ◽  
Defect Densities

Synthesis of a thin, buried dielectric layer to form a silicon-on-insulator (SOI) material by high dose oxygen implantation (SIMOX – Separation by IMplanted Oxygen) is becoming an important technology due to the advent of high current (200 mA) oxygen implanters. Recently, reductions in defect densities from 109 cm−2 down to 107 cm−2 or less have been reported. They were achieved with a final high temperature annealing step (1300°C – 1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. However, the processes and conditions for reduction and elimination of precipitates and defects during high temperature annealing are not well understood. In this work we have studied the effect of annealing temperature on defect and precipitate reduction for SIMOX samples which were processed first with high temperature, high current implantation followed by high temperature annealing.

Analysis of Voltage Contrast in Secondary Electron Images Using a High-Energy Electron Spectrometer

2019 ◽  
Author(s):  
Natsuko Asano ◽  
Shunsuke Asahina ◽  
Natasha Erdman
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Sample Surface ◽  
High Energy ◽  
Secondary Electrons ◽  
Analysis Technique ◽  
Quantitative Understanding ◽  
Voltage Contrast ◽  
Acceleration Voltage ◽  
Failure Localization

Abstract Voltage contrast (VC) observation using a scanning electron microscope (SEM) or a focused ion beam (FIB) is a common failure analysis technique for semiconductor devices.[1] The VC information allows understanding of failure localization issues. In general, VC images are acquired using secondary electrons (SEs) from a sample surface at an acceleration voltage of 0.8–2.0 kV in SEM. In this study, we aimed to find an optimized electron energy range for VC acquisition using Auger electron spectroscopy (AES) for quantitative understanding.

scholarly journals Synthesis of Boron-Doped Silicon Film Using Hot Wire Chemical Vapor Deposition Technique

Crystals ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 237
Author(s):  
M. Abul Hossion ◽  
B. M. Arora
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Polycrystalline Silicon ◽  
Silicon Film ◽  
Chemical Vapor ◽  
Hot Wire ◽  
Deposition Technique ◽  
Boron Doped ◽  
Vapor Deposition Technique ◽  
Polycrystalline Silicon Film

Boron-doped polycrystalline silicon film was synthesized using hot wire chemical vapor deposition technique for possible application in photonics devices. To investigate the effect of substrate, we considered Si/SiO2, glass/ITO/TiO2, Al2O3, and nickel tungsten alloy strip for the growth of polycrystalline silicon films. Scanning electron microscopy, optical reflectance, optical transmittance, X-ray diffraction, and I-V measurements were used to characterize the silicon films. The resistivity of the film was 1.3 × 10−2 Ω-cm for the polycrystalline silicon film, which was suitable for using as a window layer in a solar cell. These films have potential uses in making photodiode and photosensing devices.

Pulsed Laser-Induced Amorphization of Polycrystalline Silicon Film

1990 ◽  
Vol 29 (Part 2, No. 4) ◽  
pp. L548-L551 ◽  
Author(s):  
Toshiyuki Sameshima ◽  
Masaki Hara ◽  
Setsuo Usui
Keyword(s):  
Polycrystalline Silicon ◽  
Silicon Film ◽  
Pulsed Laser ◽  
Polycrystalline Silicon Film
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