Characterization of Thin Films using Micromechanical Structures

1992 ◽  
Vol 276 ◽  
Author(s):  
R. I. Pratt ◽  
G. C. Johnson ◽  
R. T. Howe ◽  
D. J. Nikkel
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Nonlinear Dynamic ◽  
Material Characterization ◽  
Intrinsic Stress ◽  
Nonlinear Dynamic Response ◽  
Wafer Substrate ◽  
Micromechanical Structures ◽  
Geometrically Constrained

ABSTRACTMicromechanical structures designed for material characterization through analysis of their nonlinear dynamic response are presented. The structures consist of a rigid movable mass supported by beams which are attached to the wafer substrate. The structures are designed so that they are geometrically constrained, which is the source of their nonlinearity. The nonlinearity is shown to be well modeled by Duffing's equation for a stiffening spring and it is this model which is used to fit the test data to the desired mechanical properties, namely Young's modulus, intrinsic stress and damping.

Photoacoustic characterization of the mechanical properties of thin films

2002 ◽  
Vol 80 (4) ◽  
pp. 691-693 ◽  
Author(s):  
Carmen M. Hernandez ◽  
Todd W. Murray ◽  
Sridhar Krishnaswamy
Keyword(s):  
Thin Films ◽  
Mechanical Properties

Mechanical, Electrical and Thermal Characterization of Commercially Available LTCC Dielectric Tapes

2013 ◽  
Vol 543 ◽  
pp. 212-215
Author(s):  
Goran Radosavljević ◽  
Nelu Blaž ◽  
Andrea Marić ◽  
W. Smetana ◽  
Ljiljana Živanov
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Electrical Properties ◽  
Material Characterization ◽  
Mechanical Characterization ◽  
Thermal Characterization ◽  
Material Parameters ◽  
Mechanical And Electrical Properties

Presented paper deals with mechanical and electrical properties of several commercially available LTCC (Low Temperature Co-fired Technology) tapes, as well as their thermal characterization. Three commercially available dielectric tape materials provided by Heraeus (CT700, CT707 and CT800) are investigated. The samples for determination of significant material parameters are prepared using the standard LTCC fabrication process. Results of the material characterization (chemical analysis, surface roughness electrical and mechanical properties) are presented. In addition thermo-electrical and-mechanical characterization of investigated tapes analysis is performed.

Growth and Characterization of Chalcopyrite Nanocrystals: Beyond Conventional Thin Films

2007 ◽  
Vol 1012 ◽  
Author(s):  
David Fuertes Marrón ◽  
Sebastian Lehmann ◽  
Justyna Kosk ◽  
Sascha Sadewasser ◽  
Martha Ch. Lux-Steiner
Keyword(s):  
Thin Films ◽  
Material Characterization ◽  
Processing Parameters ◽  
Scanning Probe ◽  
Vapor Liquid Solid ◽  
Embedded Structures ◽  
Solid Substrates ◽  
Growth Method ◽  
Chalcogenide Compound

AbstractA dry method for the growth of highly-structured Cu-containing chalcopyrite material on solid substrates, based on the use of metallic precursors, is described. Nanocrystals, sub-micrometer polycrystalline dots, and macroscopic clusters have be grown, either as isolated units or alternatively as embedded structures in a matrix of a binary chalcogenide compound, by adjusting processing parameters. Vapor-liquid-solid (VLS) induced growth has been used for the growth of chalcopyrite nanowires. Examples of material characterization by scanning probe techniques are shown, demonstrating the suitability of the proposed growth method.

Characterization of Nanoporous Low Dielectric Polysilsesquioxane Thin Films

2005 ◽  
Vol 277-279 ◽  
pp. 907-911
Author(s):  
Jingyu Hyeon Lee ◽  
Yi Yeol Lyu ◽  
Mong Sup Lee ◽  
Jin Heong Yim ◽  
Sang Youl Kim
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Refractive Index ◽  
Elastic Modulus ◽  
Polymer Matrix ◽  
Low Dielectric

Poly(methyl-co-cyclosiloxane bearing silsesquioxane)s (P(M-co-CSSQs)) were prepared. Using poly(e-caprolactone) (PCL) as a template, PCL / P(M-co-CSSQ) nanohybrid films were fabricated. The electrical, morphological, and mechanical properties of the PCL / P(M-co-CSSQ) films were investigated. The dielectric constant of a cured PCL / P(M-co-CSSQ) film at 420°C scaled down from 2.55 to 2.05 and refractive index from 1.41 to 1.33 when 20 vol. % of the PCL was admixed with the polymer matrix. The elastic modulus and hardness of the cured PCL / P(Mco- CSSQ) (2:8, vol./vol.) film were 2.50 and 0.32 GPa, respectively, showing dependency on the PCL content.

scholarly journals The Effect of Film Thickness on the Structural Properties of Vacuum Evaporated Poly(3-methylthiophene) Thin Films

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Sandip V. Kamat ◽  
Vijaya Puri ◽  
R. K. Puri
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Surface Morphology ◽  
Film Thickness ◽  
Structural Properties ◽  
Vacuum Evaporation ◽  
Intrinsic Stress ◽  
Glass Substrates ◽  
Structure Surface

This paper reports on the structural properties of poly(3-methylthiophene) P3MeT thin films prepared by vacuum evaporation on the glass substrates. The structural and surface morphology, wettability, adhesion, and intrinsic stress of these thin films were studied for three different thicknesses. The variation of the film thickness affects the structure, surface, and mechanical properties of P3MeT thin films. Vapor chopping also strongly influences the surface morphology, surface roughness, and wettability of the thin films. It was found that there is a decrease in the intrinsic stress and (RMS) roughness, while the adhesion increases with increase in film thickness.

Characterization of mechanical properties of thin films using nanoindentation test

2006 ◽  
Vol 38 (12) ◽  
pp. 1182-1198 ◽  
Author(s):  
Hervé Pelletier ◽  
Joël Krier ◽  
Pierre Mille
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Nanoindentation Test
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