Optical Interconnects and Interfaces for Electronic Subsystems

1992 ◽  
Vol 264 ◽  
Author(s):  
K. Rajasekharan ◽  
J.P. Krusius ◽  
J. Sutherland ◽  
G. George
Keyword(s):  
Research And Development ◽  
Time Scale ◽  
Optical Waveguides ◽  
Optical Interconnects ◽  
Electronic Computer ◽  
Computer Applications ◽  
Optical Interconnect ◽  
Optical Coupling ◽  
Optical Source ◽  
Recent Developments

AbstractThe potential, feasibility, and time scale of optical interconnect and interfaces are examined for electronic computer applications. Link, bus and random interconnect topologies are included. Recent developments in optical source and detector devices, optical waveguides and optical fiber characteristics are reviewed. Then optical coupling, alignment, interfacing and overall compatibility issues are explored. From this understanding the requirements for the packaging of optical interconnect are derived. Finally key research and development needs are defined.

scholarly journals Recent Developments in the Modelling of Transformer Windings

Energies ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2798
Author(s):  
Konstanty M. Gawrylczyk ◽  
Szymon Banaszak
Keyword(s):  
Literature Review ◽  
Research And Development ◽  
Frequency Response ◽  
Input Data ◽  
Recent Developments ◽  
Modelling Techniques ◽  
Lumped Parameters ◽  
Wave Phenomena ◽  
Modelling Methods ◽  
Direct Calculations

The paper provides a review of the modelling techniques used to simulate the frequency response of transformer windings. The aim of the research and development of modelling methods was to analyze the influence of deformations and faults in the windings on the changes in the frequency response. All described methods are given with examples of the modelling results performed by the authors of this paper and from literature sources. The research is prefaced with a thorough literature review. There are described models based on lumped parameters with input data coming from direct calculations based on the winding geometry and obtained from FEM modelling software and models considering the wave phenomena in the windings. The analysis was also performed for practical problems in winding modelling: the influence of windings other than the modelled one and the influence of parallel wires in a winding.

Patent highlights October–November 2020

2021 ◽  
Vol 10 (2) ◽  
pp. 51-58
Author(s):  
Hermann AM Mucke
Keyword(s):  
Research And Development ◽  
Medical Research ◽  
Recent Developments ◽  
Patent Literature

A snapshot of noteworthy recent developments in the patent literature of relevance to pharmaceutical and medical research and development.

scholarly journals Patent highlights August–September 2020

2021 ◽  
Vol 10 (1) ◽  
pp. 1-7
Author(s):  
Hermann AM Mucke
Keyword(s):  
Research And Development ◽  
Medical Research ◽  
Recent Developments ◽  
Patent Literature

A snapshot of noteworthy recent developments in the patent literature of relevance to pharmaceutical and medical research and development.

Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration

2004 ◽  
Vol 812 ◽  
Author(s):  
P. D. Persans ◽  
M. Ojha ◽  
R. J. Gutmann ◽  
J.-Q. Lu ◽  
A. Filin ◽  
...  
Keyword(s):  
Design Optimization ◽  
Optical Waveguides ◽  
Optical Interconnect ◽  
Device Performance ◽  
Wafer Level ◽  
Chip Fabrication ◽  
Cmos Compatible ◽  
Waveguide Fabrication ◽  
Optical Connection

AbstractOptical waveguides for three-dimensionally stacked chip fabrication technologies, in which optical connection between layers plays a central role, are described. CMOS-compatible approaches to optical via and waveguide fabrication are addressed. Detailed modeling is used for design optimization and also addresses how manufacturing variations from ideal design may affect device performance.

Recent Developments in High Temperature Shape Memory Alloys

1994 ◽  
Vol 360 ◽  
Author(s):  
Jeno Beyer ◽  
Jan.H. Mulder
Keyword(s):  
High Temperature ◽  
Research And Development ◽  
Shape Memory Alloys ◽  
Time Dependence ◽  
Shape Memory ◽  
Medical Applications ◽  
Space Technology ◽  
Shape Memory Properties ◽  
Recent Developments ◽  
Number Of Cycles

AbstractThe functional properties of Shape Memory Alloys (SMA's) are used succesfully at present in a variety of industrial and medical applications. The use of these materials in smart structures is now emerging in the field of aeronautic/space technology. Many applications require higher operating temperatures than available to date, or higher cooling rates and/or a higher number of cycles. For this purpose the properties and fabricability of commercial alloys as Ni-Ti-(X), Cu-Al-Ni or Cu-Zn-Al are being adjusted and improved. Other feasible alloys are being developed. The research and development is directed towards the control of the stress, strain, temperature and time dependence of shape memory properties for a stable in-service behaviour. In this paper the various approaches taken up in recent years by academic and industrial laboratories for developing high temperature SMA's are reviewed.

High optical coupling efficiency using 45°-ended fibre for low-height and low-cost optical interconnect modules

2008 ◽  
Vol 44 (12) ◽  
pp. 724 ◽  
Author(s):  
A. Suzuki ◽  
Y. Wakazono ◽  
S. Suzuki ◽  
M. Tamura ◽  
H. Masuda ◽  
...  
Keyword(s):  
Low Cost ◽  
Coupling Efficiency ◽  
Optical Interconnect ◽  
Optical Coupling ◽  
Optical Coupling Efficiency
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