The Influence of Ion Bombardment on the Surface Composition of 70 wt% Cu-30 wt% Zn Alpha-Brass

1991 ◽  
Vol 223 ◽  
Author(s):  
Vjekoslav Franetovic
Keyword(s):  
Surface Composition ◽  
Ion Beam ◽  
Ion Bombardment ◽  
Characteristic Surface ◽  
Foil Surface ◽  
Ion Milling ◽  
Long Time ◽  
Sputtering Yield ◽  
Short Time ◽  
Alpha Brass

ABSTRACTThe short time ion bombardment during ion milling resulted in a dramatic change in the surface composition of alpha-brass, selectively removing up to 2/3 of the Zn atoms during the first 5 to 10 minutes of ion milling. This differential sputtering occurred at various ion beam energies and at target temperatures as low as −196°C (LN2 temperature). The effect of differential sputtering completely disappeared after ion milling times in excess of three hours. Such a dramatic change in composition could not be attributed either to a difference in sputtering yield or to different ion milling conditions. It was shown that under constant ion milling conditions this differential sputtering depends strongly and only on the condition of the foil surface. The unexpected disappearance of the effect of differential sputtering with time was attributed to stabilization of a characteristic surface topography produced by long time ion bombardment.

Formation of dense and aligned planar arrangements of Pb nanoparticles at silica/silicon interfaces

2011 ◽  
Vol 1308 ◽  
Author(s):  
Flavia P. Luce ◽  
Felipe Kremer ◽  
Dario F. Sanchez ◽  
Zacarias E. Fabrim ◽  
Shay Reboh ◽  
...  
Keyword(s):  
High Temperature ◽  
Rutherford Backscattering Spectrometry ◽  
Ion Beam ◽  
Aging Treatment ◽  
High Temperature Short Time ◽  
Transmission Electron ◽  
Long Time ◽  
Size Dispersion ◽  
Short Time ◽  
Silicon Interface

ABSTRACTThe ion beam synthesis of Pb nanoparticles (NPs) in silica/silicon films is studied in terms of the combination of a two-step annealing process consisting of a low temperature long time aging treatment followed by a high temperature short time furnace annealing. The samples are analyzed through Rutherford Backscattering Spectrometry and Transmission Electron Microscopy. The aging process leads to the suppression of the classical homogeneous nucleation of metallic Pb NPs in the silica, thus promoting Pb redistribution during the high temperature annealing. This causes the formation of dense bi-dimensional NP arrays located at the silica-silicon interface, presenting small size dispersion.

Phénomènes de pulvérisation et de distribution en profondeur. Partie IV. Pulvérisation cathodique des oxydes Nb2O5, Ta2O5 et WO3

1970 ◽  
Vol 48 (2) ◽  
pp. 137-145 ◽  
Author(s):  
L. Q. Nghi ◽  
Roger Kelly
Keyword(s):  
Binding Energy ◽  
Ion Beam ◽  
Ion Bombardment ◽  
Surface Binding ◽  
Surface Binding Energy ◽  
Loss Of Weight ◽  
Sputtering Yield

Three different methods have been used to determine the sputtering yield (S) for 2–30 keV Kr ions on the amorphous anodic oxides Nb2O5, Ta2O5, and WO3. The methods were based on (a) the change of interference colors due to ion bombardment, (b) the perforation of a film of free oxide by an intense ion beam, and (c) the loss of weight of the target. Although S for Kr–WO3 was larger than expected, S for Kr–Nb2O5 and Kr–Ta2O5 was similar to what has been found for other oxides. For example, at 4 keV, S lies between 1.1 and 2.4 atoms/ion for Ar or Kr bombardment of Al2O3, Nb2O5, SiO2, Ta2O5, TiO2, and UO2, whereas it is 6.2 atoms/ion for WO3. The results were interpreted first with a modified form of the theory of Rol et al., in which S is equated to K′E/Rm, where K′ is a constant in Å/keV and Rm is the experimental median range. A good fit between experiment and theory was obtained for K′ equal to 25 for Nb2O5, 13 for Ta2O5, and 51 for WO3. The recently formulated theory of Sigmund, which is in principle completely analytical, was also considered. The observed values of S could be made compatible with the predictions of the theory by taking the following values for Eb, the surface binding energy (units of kcal/gram atom): 100–150 for Nb2O5, 200–250 for Ta2O5, and 45–60 for WO3, We would point out that these latter values are similar to the heats of atomization.

Effects of Ion Beam Milling on Surface Topography

1973 ◽  
Vol 31 ◽  
pp. 84-85
Author(s):  
P.G. Pawar ◽  
P. Duhamel ◽  
G.W. Monk
Keyword(s):  
Surface Topography ◽  
Ion Beam ◽  
Solid Material ◽  
Beam Current ◽  
Atomic Mass ◽  
Micro Milling ◽  
Ion Milling ◽  
Controlled Atmospheres ◽  
Milling Operations ◽  
Sufficient Energy

A beam of ions of mass greater than a few atomic mass units and with sufficient energy can remove atoms from the surface of a solid material at a useful rate. A system used to achieve this purpose under controlled atmospheres is called an ion miliing machine. An ion milling apparatus presently available as IMMI-III with a IMMIAC was used in this investigation. Unless otherwise stated, all the micro milling operations were done with Ar+ at 6kv using a beam current of 100 μA for each of the two guns, with a specimen tilt of 15° from the horizontal plane.It is fairly well established that ion bombardment of the surface of homogeneous materials can produce surface topography which resembles geological erosional features.

Ion Beam Mixing of Ni-Ti Bilayered Thin Films

1985 ◽  
Vol 43 ◽  
pp. 290-291
Author(s):  
A. K. Rai ◽  
R. S. Bhattacharya ◽  
M. H. Rashid
Keyword(s):  
Crystal Structure ◽  
Thin Films ◽  
Amorphous Alloys ◽  
Ion Beam ◽  
Ion Bombardment ◽  
High Energy ◽  
Mixing Efficiency ◽  
Ion Beam Mixing ◽  
Enhanced Diffusion ◽  
Binary Metal

Ion beam mixing has recently been found to be an effective method of producing amorphous alloys in the binary metal systems where the two original constituent metals are of different crystal structure. The mechanism of ion beam mixing are not well understood yet. Several mechanisms have been proposed to account for the observed mixing phenomena. The first mechanism is enhanced diffusion due to defects created by the incoming ions. Second is the cascade mixing mechanism for which the kinematicel collisional models exist in the literature. Third mechanism is thermal spikes. In the present work we have studied the mixing efficiency and ion beam induced amorphisation of Ni-Ti system under high energy ion bombardment and the results are compared with collisional models. We have employed plan and x-sectional veiw TEM and RBS techniques in the present work.

Short-Time Tests for Long-Time Endurance

1923 ◽  
Vol 128 (4) ◽  
pp. 264-264
Author(s):  
J. W. Harsch
Keyword(s):  
Long Time ◽  
Short Time

Effect of Vial shaking on Loading Time of Epirubicin into Drug-Eluting Bead

2015 ◽  
Vol 5 (3) ◽  
Author(s):  
Kenji Ikeda ◽  
Yusuke Kawamura ◽  
Masahiro Kobayashi ◽  
Taito Fukushima ◽  
Yushi Sorin ◽  
...  
Keyword(s):  
Antitumor Agent ◽  
Loading Rates ◽  
Vortex Mixer ◽  
Long Time ◽  
Group A ◽  
Drug Eluting ◽  
Large Hepatocellular Carcinoma ◽  
Group B ◽  
Time Required ◽  
Short Time

Background: Although DC Bead has been useful in treatment of multiple and large hepatocellular carcinoma, loading time of doxorubicin into the DC Bead takes a long time of 30-120 minutes. Epirubicin is also used as an antitumor agent together with DC Bead, but its loading efficiency was not sufficiently elucidated. Methods: To shorten loading time of epirubicin into DC Bead (100-300µm, 300-500µm, 500-700µm), we examined the following three methods after mixing the drug: (a) let stand in room temperature, (b) agitated for 30 seconds with Vortex mixer, and (c) sonicated for 30 seconds with ultrasonic cleaner. After loading of epirubicin by each method, supernatant concentration for epirubicin was assayed at 5, 10, 30, 60, and 120 minutes. Results: Epirubicin loading rates for small bead (100-300µm) at 5 minutes were 82.9 % in group a, 93.8% in group b, and 79.9 % in group c. Similarly, medium bead (300-500µm), 40.1% in group a, 65.7% in group b and 45.5% in group c, respectively. In large-sized bead (500-700µm), loaded rates of epirubicin were 38.8% in group a, 59.0% in group b and 48.0% in group c. Agitation of mixture of epirubicin and DC Bead with Vortex mixer significantly shortened the loading time, but sonication did not affect the time required. Microscopic examination did not lead to any morphological change of microspheres in all the methods. Conclusions: Short time of agitation with Vortex mixer reduced the necessary time for loading of epirubicin in every standard of DC Bead.

Low Energy Ar Ion Milling of FIB TEM Specimens from 14 nm and Future FinFET Technologies

2018 ◽  
Author(s):  
C.S. Bonifacio ◽  
P. Nowakowski ◽  
M.J. Campin ◽  
M.L. Ray ◽  
P.E. Fischione
Keyword(s):  
Field Effect Transistor ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Transmission Electron ◽  
High Resolution Tem ◽  
Effect Transistor ◽  
20 Nm ◽  
Argon Ion

Abstract Transmission electron microscopy (TEM) specimens are typically prepared using the focused ion beam (FIB) due to its site specificity, and fast and accurate thinning capabilities. However, TEM and high-resolution TEM (HRTEM) analysis may be limited due to the resulting FIB-induced artifacts. This work identifies FIB artifacts and presents the use of argon ion milling for the removal of FIB-induced damage for reproducible TEM specimen preparation of current and future fin field effect transistor (FinFET) technologies. Subsequently, high-quality and electron-transparent TEM specimens of less than 20 nm are obtained.

Robust Test Method of TSOP PEMs for Space Application

2019 ◽  
Author(s):  
Yasunobu Iwai ◽  
Koichi Shinozaki ◽  
Daiki Tanaka
Keyword(s):  
Evaluation Method ◽  
Low Cost ◽  
Reliability Evaluation ◽  
Test Method ◽  
Thermal Shock Test ◽  
Space Application ◽  
Space Applications ◽  
Limit Test ◽  
Long Time ◽  
Short Time

Abstract Compared with space parts, consumer parts are highly functional, low cost, compact and lightweight. Therefore, their increased usage in space applications is expected. Prior testing and evaluation on space applicability are necessary because consumer parts do not have quality guarantees for space application [1]. However, in the conventional reliability evaluation method, the test takes a long time, and the problem is that the robustness of the target sample can’t be evaluated in a short time. In this report, we apply to the latest TSOP PEM (Thin Small Outline Package Plastic Encapsulated Microcircuit) an evaluation method that combines preconditioning and HALT (Highly Accelerated Limit Test), which is a test method that causes failures in a short time under very severe environmental conditions. We show that this method can evaluate the robustness of TSOP PEMs including solder connections in a short time. In addition, the validity of this evaluation method for TSOP PEM is shown by comparing with the evaluation results of thermal shock test and life test, which are conventional reliability evaluation methods.

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