Molecular Dynamics Simulations of the Impact of Energetic Cu Clusters on Cu and Ni Substrates
Keyword(s):
ABSTRACTThe interaction between energetic clusters of atoms and solid surfaces has been investigated by molecular-dynamics computer simulation. In this model, the impact of Cu clusters containing 4, 13 or 92 atoms and energies of 326 eV with Cu or Ni substrates is investigated. Either embedded-atom-method (EAM) potentials or a combination of Moliere and EAM potentials were employed for the calculations. The simulations reveal that different physical processes occur depending on cluster size and energy, and the cohesive properties of the substrate.
Rapid solidification of Cu25at.% Ni alloy: molecular dynamics simulations using embedded atom method
1996 ◽
Vol 214
(1-2)
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pp. 139-145
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2018 ◽
Vol 32
(11)
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pp. 1850133
2017 ◽
Vol 2
(2)
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pp. 183
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2011 ◽
Vol 675-677
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pp. 1011-1014