Limitation of Selective Epitaxial Growth Conditions in Gas Source MBE Using Si2H6

1990 ◽  
Vol 204 ◽  
Author(s):  
Junro Sakai ◽  
Ken-Ichi Aketagawa ◽  
Toru Tatsumi
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
High Growth ◽  
Growth Conditions ◽  
High Growth Rate ◽  
Native Oxide ◽  
Initial Growth ◽  
Selective Epitaxial Growth ◽  
Gas Source ◽  
Gas Source Mbe

ABSTRACTLow temperature and high growth rate selective epitaxial growth (SEG) on Si02 patterned Si (001) substrate in gas-source molecular-beam epitaxy (GS-MBE) using pure Si2H6 has been investigated by RHEED observation. In the temperature range of 550 to 850°C, SEG was completely obtained at an initial growth stage. Limiting conditions of SEG were closely related with critical volume of supply gas that was equal to the total amount molecules supplied on SiO2 surface during the incubation period of initial growth. The surface SiO2 was induced to evaporate with Si2H6 supplied above 800°C, so that thermal cleaning temperature for removing native oxide came down to 800°C. As a result, the maximum process temperature of Si SEG now became 800°C, and its growth rate reached as high as 645A/min at growth temperature of 700°C.

scholarly journals Concentrated Chloride-Based Epitaxial Growth of 4H-SiC

2010 ◽  
Vol 645-648 ◽  
pp. 95-98 ◽  
Author(s):  
Anne Henry ◽  
Stefano Leone ◽  
Sven Andersson ◽  
Olof Kordina ◽  
Erik Janzén
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
Systematic Study ◽  
High Growth ◽  
Growth Conditions ◽  
High Growth Rate ◽  
Gas Mixture ◽  
Process Pressure ◽  
Order Of Magnitude ◽  
Standard Gas

A chloride-based CVD process has been studied in concentrated growth conditions. A systematic study of different carrier flows and pressures has been done in order to get good quality epilayers on 8° off and on-axis substrates while using very low carrier flows. Hydrogen chloride (HCl) was added to the standard gas mixture to keep a high growth rate and to get homo-polytypic growth on on-axis substrates. The carrier flow was reduced down to one order of magnitude less than under typical growth condition. By lowering the process pressure it was possible to reduce precursor depletion along the susceptor which improved the thickness uniformity to below 2% variation (σ/mean) over a 2” diameter wafer.

Emission characteristics of GaInN/GaN multiple quantum shell nanowire-based LEDs with different p-GaN growth conditions

Nanophotonics ◽  
2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Sae Katsuro ◽  
Weifang Lu ◽  
Kazuma Ito ◽  
Nanami Nakayama ◽  
Naoki Sone ◽  
...  
Keyword(s):  
Growth Rate ◽  
Shell Growth ◽  
Light Output ◽  
High Growth ◽  
Growth Conditions ◽  
High Growth Rate ◽  
Current Injection ◽  
Emission Characteristics ◽  
Multiple Quantum ◽  
Plane Region

Abstract Improving current injection into r- and m-planes of nanowires (NWs) is essential to realizing efficient GaInN/GaN multiple quantum shell (MQS) NW-based light-emitting diodes (LEDs). Here, we present the effects of different p-GaN shell growth conditions on the emission characteristics of MQS NW-LEDs. Firstly, a comparison between cathodoluminescence (CL) and electroluminescence (EL) spectra indicates that the emission in NW-LEDs originates from the top region of the NWs. By growing thick p-GaN shells, the variable emission peak at around 600 nm and degradation of the light output of the NW-LEDs are elaborated, which is attributable to the localization of current in the c-plane region with various In-rich clusters and deep-level defects. Utilizing a high growth rate of p-GaN shell, an increased r-plane and a reduced c-plane region promote the deposition of indium tin oxide layer over the entire NW. Therefore, the current is effectively injected into both the r- and m-planes of the NW structures. Consequently, the light output and EL peak intensity of the NW-LEDs are enhanced by factors of 4.3 and 13.8, respectively, under an injection current of 100 mA. Furthermore, scanning transmission electron microscope images demonstrate the suppression of dislocations, triangular defects, and stacking faults at the apex of the p-GaN shell with a high growth rate. Therefore, localization of current injection in nonradiative recombination centers near the c-plane was also inhibited. Our results emphasize the possibility of realizing high efficacy in NW-LEDs via optimal p-GaN shell growth conditions, which is quite promising for application in the long-wavelength region.

Development of a High Rate 4H-SiC Epitaxial Growth Technique Achieving Large-Area Uniformity

2008 ◽  
Vol 600-603 ◽  
pp. 111-114 ◽  
Author(s):  
Masahiko Ito ◽  
L. Storasta ◽  
Hidekazu Tsuchida
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
Free Exciton ◽  
High Growth ◽  
Maximum Growth ◽  
High Growth Rate ◽  
Maximum Growth Rate ◽  
High Rate ◽  
Intrinsic Defect ◽  
Large Area

A vertical hot-wall type epi-reactor that makes it possible to simultaneously achieve both a high rate of epitaxial growth and large-area uniformity at the same time has been developed. A maximum growth rate of 250 µm/h is achieved at 1650 °C. Thickness uniformity of 1.1 % and doping uniformity of 6.7 % for a 65 mm radius area are achieved while maintaining a high growth rate of 79 µm/h. We also succeeded in growing a 280 µm-thick epilayer with excellent surface morphology and long carrier lifetime of ~1 µs on average. The LTPL spectrum shows free exciton peaks as dominant, and few impurity-related or intrinsic defect related peaks are observed. The DLTS measurement for an epilayer grown at 80 µm/h shows low trap concentrations of 1.2×1012 cm-3 for Z1/2 center and 6.3×1011 cm-3 for EH6/7 center, respectively.

Analysis and Reduction of Stacking Faults in Fast Epitaxial Growth

2016 ◽  
Vol 858 ◽  
pp. 173-176 ◽  
Author(s):  
Hideyuki Uehigashi ◽  
Keisuke Fukada ◽  
Masahiko Ito ◽  
Isaho Kamata ◽  
Hiroaki Fujibayashi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Growth Rate ◽  
Epitaxial Growth ◽  
Stacking Faults ◽  
High Growth ◽  
High Growth Rate ◽  
X Ray ◽  
Crystalline Defects ◽  
Transmission Electron

We have developed a single-wafer vertical epitaxial reactor which realizes high-throughput production of 4H-SiC epitaxial layer (epilayer) with a high growth rate [1,2]. In this paper, in order to evaluate the crystalline defects which can affect the characteristics of devices, we investigated the formation of variety of in-grown stacking faults (SFs) in detail. Synchrotron X-ray topography, photoluminescence (PL) and transmission electron microscopy are employed to analyze the SFs and the origins of the SF formation are discussed. The result in reducing in-grown SFs in fast epitaxial growth is also shown.

Very High Growth Rate Epitaxy Processes with Chlorine Addition

2007 ◽  
Vol 556-557 ◽  
pp. 157-160 ◽  
Author(s):  
Francesco La Via ◽  
Stefano Leone ◽  
Marco Mauceri ◽  
Giuseppe Pistone ◽  
Giuseppe Condorelli ◽  
...  
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
Schottky Diodes ◽  
High Growth ◽  
High Growth Rate ◽  
Electrical Characteristics ◽  
Standard Process ◽  
Characterization Methods ◽  
Deposition Chamber ◽  
Very High

The growth rate of 4H-SiC epi layers has been increased by a factor 19 (up to 112 μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. An optimized process without the addition of HCl is reported for comparison. The Schottky diodes, manufactured on the epitaxial layer grown with the addition of HCl at 1600 °C, have electrical characteristics comparable with the standard epitaxial process with the advantage of an epitaxial growth rate three times higher.

The Effect of Substrate Orientation on the Properties of (Ga, Al)As Grown by Gas Source Molecular Beam Epitaxy

1988 ◽  
Vol 144 ◽  
Author(s):  
A. Sandhu ◽  
T. FUJII ◽  
H. Ando ◽  
H. Ishikawa ◽  
E. Miyauchi
Keyword(s):  
Growth Rate ◽  
Growth Conditions ◽  
Group V ◽  
Group Iii ◽  
Al Content ◽  
Gas Source ◽  
Compensation Ratio ◽  
Potential Applications ◽  
Si Doped ◽  
Gas Source Mbe

ABSTRACTWe have carried out the first systemmatic investigation on the effect of substrate temperature and arsenic partial pressure on the morphology, growth rate, and compensation ratio of Si-doped GaAs, and the Al content of AlxGa1−xAs grown on just-cut (100), (110), (111)A&B, (311)A&B orientated GaAs substrates by gas source MBE (GSMBE). Triethylgallium ( TEG, Ga(C2H5)3 ) and triethylaluminium ( TEA, Al(C2H5)3 ) were used as group III sources, and solid arsenic ( As4 ) and silicon as a group V and IV sources, respectively. The best GaAs mophology was obtained at relatively high temperatures and arsenic pressures. The A orientations were identified as ‘fast surfaces,’ with the GaAs growth rate being comparable to the (100) orientation. The B orientations were identified as ‘slow surfaces,’ with the GaAs growth rate being much less (approximately 50% for the (111)B orientation ) than on the (100) orientation. The least compensated Si-doped GaAs was grown on the (311)A orientated substrate. The Al content, x, (nominally x=0.27 for (100)) of AlxGas1−xAs grown on (110), (111)A&B, was less than 0.05 and not affected by the growth conditions. The Al content of epilayers grown on (311)A&B ranged between x=0.1 to 0.27, strongly depending on the growth temperature.These results show that using GSMBE we can selectively modifying a large range of (Ga,Al)As crystal properties. Potential applications include the selective growth and realisation of ultra-fine and planar structures and devices.

scholarly journals High growth rate 4H-SiC epitaxial growth using dichlorosilane in a hot-wall CVD reactor

2011 ◽  
Vol 316 (1) ◽  
pp. 60-66 ◽  
Author(s):  
Iftekhar Chowdhury ◽  
M.V.S. Chandrasekhar ◽  
Paul B. Klein ◽  
Joshua D. Caldwell ◽  
Tangali Sudarshan
Keyword(s):  
Growth Rate ◽  
Epitaxial Growth ◽  
High Growth ◽  
High Growth Rate

Developing Technologies of SiC Gas Source Growth Method

2016 ◽  
Vol 858 ◽  
pp. 23-28 ◽  
Author(s):  
Jun Kojima ◽  
Yuichiro Tokuda ◽  
Emi Makino ◽  
Naohiro Sugiyama ◽  
Norihiro Hoshino ◽  
...  
Keyword(s):  
Growth Rate ◽  
Mass Production ◽  
High Speed ◽  
High Growth ◽  
Maximum Growth ◽  
High Growth Rate ◽  
Average Growth ◽  
Gas Source ◽  
Growth Method ◽  
Production Technologies

In order to diffuse the use of SiC, mass-production technologies of SiC wafers are needed. It is easy to be understood that high-speed and long-sized growth technologies are connected directly with mass-production technologies. The gas source growth method such as HT-CVD has the possibilities and the potential of the high-speed and long-sized growth. In this article, it was clarified that the high growth rate were achieved by the control of the source gas partial pressures and by the gas boundary layers. The average growth rate was 1mm/h on the f4 inch-diameter crystal, and the maximum growth rate reached 3.6 mm/h on the 12.5x25 mm tetragon by the above gas control. The crystal qualities of the gas source methods were also evaluated the equivalent level in comparison with the sublimation method. Concerning the 1mm/h-growth f3 inch crystal, the densities of TSDs were kept in the 102 cm-2 levels from the seed to the upper-side of the ingot. Moreover, the ingot size increased year by year and a f4 inch x 43 mm sized ingot has been developed.

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