A Channeling Study of Defect-Boron Complexes in Si

1980 ◽  
Vol 2 ◽  
Author(s):  
M.L. Swanson ◽  
L.M. Howe ◽  
F.W. Saris ◽  
A.F. Quenneville
Keyword(s):  
Ion Implantation ◽  
Nuclear Reaction ◽  
Incident Energy ◽  
Ruby Laser ◽  
Laser Annealing ◽  
Surface Region ◽  
Alpha Particles ◽  
Near Surface ◽  
Annealing Temperatures ◽  
Boron Complexes

ABSTRACTSi crystals were doped with 0.1–0.2 at% 11B in the near surface region by ion implantation followed by thermal diffusion at 1373 K or by ruby laser annealing. The position of the B atoms in the Si lattice was determined by channeling measurements, utilizing both the yield of H+ ions (of incident energy 0.7 MeV) backscattered from Si atoms and the yield of alpha particles from the 11B(p,α)8Be nuclear reaction. Initially, 95–99% of the B atoms were substitutional. Irradiation at 35 K or 293 K with 0.7 MeV H+ displaced B atoms from lattice sites. The displacement rate was greater at 293 K than at 35 K, and was greater for diffused samples than for laser annealed samples. Following 35 K irradiations, a large increase in the fraction fdB of displaced B atoms occurred during annealing near 240 K. At higher annealing temperatures, fdB decreased over a broad temperature range from 425–825 K. Angular scans through <110> channels for the laser annealed samples after 293 K irradiation or after 35 K irradiation plus 293 K annealing showed a pronounced narrowing of the dip in 11B(p,α)8Be yields compared with the dip in yields from Si, whereas no narrowing was observed for <100> channels. These results indicate that B atoms were displaced into specific lattice sites by the migration of an interstitial B defect (the EPR G28 defect) near 240 K.

Pulsed Ruby Laser Annealing of Zn, Mg, Se and Si Ion Implants in Semiconducting Gaas

1980 ◽  
Vol 1 ◽  
Author(s):  
Douglas H. Lowndes ◽  
J. W. Cleland ◽  
W. H. Christie ◽  
R. E. Eby
Keyword(s):  
Ruby Laser ◽  
Laser Annealing ◽  
Laser Energy ◽  
Impurity Scattering ◽  
Surface Region ◽  
High Dose ◽  
Near Surface ◽  
Scattering Centers ◽  
High Concentrations ◽  
P Type

ABSTRACTThe properties of p+ and n+ layers formed by pulsed ruby laser annealing (PRLA) of shallow (Rp ~ 320–680 Å) implantations of Mg, Zn, Si and Se ions in both n- and p-type semiconducting GaAs have been evaluated using a combination of SIMS and electrical properties measurements. High activation (> 80%) was obtained for high dose (5 × 1015 ions/cm2 ) implants of both Mg and Zn, within a pulsed laser energy density “window” 0.5 ≤ Eλ ≤ 0.8 J/cm2 (FWHM pulse duration = 20–25 ns). SIMS measurements following PRLA show a wellbehaved increasing penetration of dopant ions into the GaAs substrate, with dopant ion concentrations well in excess of 1020 ions/cm3 in the near-surface region. Measured hole mobilities are consistent with the values anticipated for these high concentrations of ionized impurity scattering centers.

The Effects of Ion Implantation on the Surface Features of Inconel 600

1985 ◽  
Vol 43 ◽  
pp. 288-289
Author(s):  
John D. Rubio
Keyword(s):  
Grain Boundary ◽  
Ion Implantation ◽  
Nuclear Power ◽  
Power Plants ◽  
Surface Region ◽  
Selective Dissolution ◽  
Boundary Region ◽  
Near Surface ◽  
Inconel 600 ◽  
Steam Generator Tubing

The degradation of steam generator tubing at nuclear power plants has become an important problem for the electric utilities generating nuclear power. The material used for the tubing, Inconel 600, has been found to be succeptible to intergranular attack (IGA). IGA is the selective dissolution of material along its grain boundaries. The author believes that the sensitivity of Inconel 600 to IGA can be minimized by homogenizing the near-surface region using ion implantation. The collisions between the implanted ions and the atoms in the grain boundary region would displace the atoms and thus effectively smear the grain boundary.To determine the validity of this hypothesis, an Inconel 600 sample was implanted with 100kV N2+ ions to a dose of 1x1016 ions/cm2 and electrolytically etched in a 5% Nital solution at 5V for 20 seconds. The etched sample was then examined using a JEOL JSM25S scanning electron microscope.

PN junction formation in CdTe by ion implantation and pulsed ruby laser annealing

1981 ◽  
Vol 58 (3-4) ◽  
pp. 115-117 ◽  
Author(s):  
C. B. Norris ◽  
C. I. Westmark ◽  
G. Entine ◽  
S. A. Lis ◽  
H. B. Serreze
Keyword(s):  
Ion Implantation ◽  
Ruby Laser ◽  
Laser Annealing ◽  
Pn Junction ◽  
Junction Formation

scholarly journals Microstructure and Mechanical Properties of Ti + N Ion Implanted Cronidur30 Steel

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 427 ◽  
Author(s):  
Jie Jin ◽  
Wei Wang ◽  
Xinchun Chen
Keyword(s):  
Mechanical Properties ◽  
Ion Implantation ◽  
Photoelectron Spectroscopy ◽  
Structural Modification ◽  
Surface Region ◽  
Grazing Incidence ◽  
Bearing Steel ◽  
Near Surface ◽  
X Ray ◽  
Ion Implanted

In this study, Ti + N ion implantation was used as a surface modification method for surface hardening and friction-reducing properties of Cronidur30 bearing steel. The structural modification and newly-formed ceramic phases induced by the ion implantation processes were investigated by transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS), and grazing incidence X-ray diffraction (GIXRD). The mechanical properties of the samples were tested by nanoindentation and friction experiments. The surface nanohardness was also improved significantly, changing from ~10.5 GPa (pristine substrate) to ~14.2 GPa (Ti + N implanted sample). The friction coefficient of Ti + N ion implanted samples was greatly reduced before failure, which is less than one third of pristine samples. Furthermore, the TEM analyses confirmed a trilamellar structure at the near-surface region, in which amorphous/ceramic nanocrystalline phases were embedded into the implanted layers. The combined structural modification and hardening ceramic phases played a crucial role in improving surface properties, and the variations in these two factors determined the differences in the mechanical properties of the samples.

Electrical and Structural Characterization of Boron Implanted Silicon Following Laser Thermal Processing

2002 ◽  
Vol 717 ◽  
Author(s):  
K. A. Gable ◽  
K. S. Jones ◽  
M. E. Law ◽  
L. S. Robertson ◽  
S. Talwar
Keyword(s):  
Melting Temperature ◽  
Thermal Processing ◽  
Laser Annealing ◽  
Substrate Surface ◽  
Surface Region ◽  
Process Window ◽  
Near Surface ◽  
Dopant Activation ◽  
Transmission Electron ◽  
Laser Thermal Processing

AbstractOne alternative to conventional rapid thermal annealing (RTA) of implants for ultra-shallow junction formation is that of laser annealing. Laser thermal processing (LTP) incorporates an excimer pulsed laser capable of melting the near surface region of the silicon (Si) substrate. The melt depth is dependent upon the energy density supplied by the irradiation source and the melting temperature of the substrate surface. A process window associated with this technique is able to produce similar junction depths over a range of energy densities due to the melting temperature depression established with pre-amorphization of the substrate surface prior to dopant incorporation. The process window of germanium (Ge) preamorphized, boron (B) doped Si was investigated. 200 mm (100) n-type Si wafers were preamorphized via 18 keV Ge+ implantation to 1x1015/cm2 and subsequently implanted with 1 keV B+ to doses of 1x1015/cm2, 3x1015/cm2, 6x1015/cm2, and 9x1015/cm2. The wafers were laser annealed from 0.50 J/cm2 to 0.88 J/cm2 using a 308 nm XeCl excimer irradiation source. Transmission electron microscopy (TEM) was used to determine the process window for each implant condition, and correlations between process window translation and impurity concentration were made. Four-point probe quantified dopant activation and subsequent deactivation upon post-LTP furnace annealing.

Modification of The Near-Surface Region Of Al2O3 By Ion Implantation

1983 ◽  
Vol 24 ◽  
Author(s):  
C. W. White ◽  
G. C. Farlow ◽  
H. Naramoto ◽  
C. J. Mchargue ◽  
B. R. Appleton
Keyword(s):  
Mechanical Properties ◽  
Ion Implantation ◽  
Thermal Annealing ◽  
Structural Property ◽  
Surface Region ◽  
Impurity Incorporation ◽  
Near Surface ◽  
Implantation Damage ◽  
Property Changes

ABSTRACTPhysical and structural property changes resulting from ion implantation and thermal annealing of α-A12O3 are reviewed. Emphasis is placed on damage production during implantation, damage recovery during thermal annealing, and impurity incorporation during thermal annealing. Physical and structural property changes caused by ion implantation and annealing are correlated with changes in the mechanical properties.

Effects of Silicon Ion Implantation upon Thin Gate Oxide Integrity

1992 ◽  
Vol 262 ◽  
Author(s):  
G. -S. Lee ◽  
J. -G. Park ◽  
S. -P. Choi ◽  
C. -H. Shin ◽  
Y. -B. Sun ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Dielectric Breakdown ◽  
Defect Density ◽  
Surface Region ◽  
Gate Oxide ◽  
Near Surface ◽  
Time Dependent Dielectric Breakdown ◽  
Thin Gate Oxide ◽  
Si Ion Implantation ◽  
Gate Oxide Integrity

ABSTRACTIn this study, using oxide breakdown voltage and time-dependent-dielectric breakdown measurements, thermal wave modulated reflectance and chemical etching/optical microscopy, we investigated effects of Si ion implantation upon formation of D-defects and thin gate oxide integrity. Our data show that addition of Si ion implantation with a dose of up to 1013 ions/cm2 improves oxide integrity if the implantation is done at a certain step just before sacrificial oxidation in the Mb DRAM process. However, no improvement in oxide integrity is observed when the same implantation is done on the virgin wafer surfaces at the start of the same Mb DRAM process. We discuss our hypothesis that the improvement in oxide integrity is due to a reduction in the D-defect density in the near-surface region of the wafer.

scholarly journals Optimum technological modes of ion implantation and subsequent annealing for formation of thin nanosized silicide films

2021 ◽  
Vol 264 ◽  
pp. 05037
Author(s):  
Ilkhom Bekpulatov ◽  
Ilkhom Turapov ◽  
Sevara Abraeva ◽  
Jakhongir Normuminov
Keyword(s):  
Electron Diffraction ◽  
Ion Implantation ◽  
Electron Spectroscopy ◽  
Surface Region ◽  
Low Energy ◽  
Subsequent Annealing ◽  
Metal Silicide ◽  
Slow Electron ◽  
Near Surface ◽  
Nanoscale Films

Using the methods of electron spectroscopy and slow electron diffraction, we studied the processes of the formation of nanosized metal silicide films in the near-surface region of Si (111) and Si (100) during low-energy implantation of Ba ions and alkaline elements. The optimal technological modes of ion implantation and subsequent annealing for the formation of thin nanoscale films of silicides were determined. The type of surface superstructures of thin silicide films has been established.

scholarly journals Nanophase Composites Produced by Ion Implantation: Properties, Problems, and Potential

2000 ◽  
Vol 650 ◽  
Author(s):  
A. Meldrum ◽  
L. A. Boatner ◽  
C. W. White ◽  
R. F. Haglund
Keyword(s):  
Ion Implantation ◽  
Surface Region ◽  
Nanocomposite Materials ◽  
Future Research ◽  
Materials Synthesis ◽  
Research Directions ◽  
Near Surface ◽  
Nanophase Materials ◽  
Future Research Directions ◽  
The Many

ABSTRACTIon implantation has become a versatile and powerful technique for synthesizing nanometer-scale clusters and crystals embedded in the near-surface region of a variety of hosts. The resulting nanocomposite materials often show unique optical, magnetic, and electronic properties. Here we review some of the principal features of this nanophase materials synthesis technique and discuss the outstanding experimental difficulties that currently hamper the development of devices based on the many unique properties of these nanocomposite materials. Possible solutions to these problems and future research directions are discussed.

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