Internal Stresses and Adhesion Properties of Film/Substrate Interfaces

1990 ◽  
Vol 188 ◽  
Author(s):  
M. Ignat ◽  
A. Chouaf ◽  
Ph. Normandon
Keyword(s):  
Stress Relaxation ◽  
Internal Stress ◽  
Experimental Methods ◽  
Internal Stresses ◽  
Silicon Substrates ◽  
Stress Evolution ◽  
Adhesion Properties ◽  
External Stresses ◽  
Film Substrate

ABSTRACTThe evolution of internal stresses in Tungsten films deposited on Silicon substrates submitted to external stresses is discussed here. The stresses are estimated and measured by theoretical and experimental methods. The discussion of the internal stress evolution is shown to be dependent of the film/substrate interfaces, and of the loss of adhesion inducing stress relaxation.

Internal Stresses in Nanocrystalline Nickel and Nickel-Iron Alloys

2012 ◽  
Vol 706-709 ◽  
pp. 1607-1611 ◽  
Author(s):  
J.D. Giallonardo ◽  
Uwe Erb ◽  
G. Palumbo ◽  
G.A. Botton ◽  
C. Andrei
Keyword(s):  
Grain Size ◽  
Internal Stress ◽  
Structural Difference ◽  
Intrinsic Stress ◽  
Internal Stresses ◽  
Second Phase ◽  
Nickel Iron ◽  
Second Phase Particles ◽  
Second Phases ◽  
Rule Out

Nanocrystalline metals are often produced in a state of stress which can adversely affect certain properties, e.g. corrosion resistance, wear, fatigue strength, etc. This stress is referred to as internal or “intrinsic” stress since it is not directly caused by applied loads. The structural causes of these stresses in nanocrystalline materials are not fully understood and are therefore an area of particular interest. The internal stresses of nanocrystalline Ni and Ni-16wt%Fe were measured and found to increase with the addition of iron. Characterization using HR-TEM revealed no signs of porosity, second phase particles, or a high density of dislocations. Both materials possessed well defined high-angle grain boundaries. The main structural difference between the two materials was found to be grain size and correspondingly, a decrease in grain size resulted in an increase in internal stress which supports the applicability of the coalescence theory. The current study also provides evidence to rule out the effect of voids (or porosity), dislocations, and second phases as possible causes of internal stress.

scholarly journals Application of the Mathar Method to Identify Internal Stress Variation in Steel as a Welding Process Result

2017 ◽  
Vol 25 (2) ◽  
pp. 125-136
Author(s):  
Dariusz Kowalski
Keyword(s):  
Internal Stress ◽  
Welding Process ◽  
Internal Stresses ◽  
Induced Voltage ◽  
Stress Variation ◽  
Steel Members ◽  
Electric Arc Welding ◽  
Destructive Measurement ◽  
Non Destructive ◽  
Excessive Stress

Abstract The paper deals with the method to identify internal stresses in two-dimensional steel members. Steel members were investigated in the delivery stage and after assembly, by means of electric-arc welding. In order to perform the member assessment two methods to identify the stress variation were applied. The first is a non-destructive measurement method employing local external magnetic field and to detecting the induced voltage, including Barkhausen noise The analysis of the latter allows to assess internal stresses in a surface layer of the material. The second method, essential in the paper, is a semi-trepanation Mathar method of tensometric strain variation measurement in the course of a controlled void-making in the material. Variation of internal stress distribution in the material led to the choice of welding technology to join. The assembly process altered the actual stresses and made up new stresses, triggering post-welding stresses as a response for the excessive stress variation.

Research on Internal Stress in Electroplated Cu Films and Ni Films on Ag Substrates

2011 ◽  
Vol 287-290 ◽  
pp. 3085-3088
Author(s):  
Yao Min Zhu ◽  
Shan Shan Wang ◽  
Feng Zhang Ren
Keyword(s):  
Film Thickness ◽  
Internal Stress ◽  
Calculation Model ◽  
Internal Stresses ◽  
Film Material ◽  
Beam Test ◽  
Cu Films ◽  
Cu Film ◽  
Reduced Gradient

Electroplating was employed to prepare Cu films and Ni films on Ag substrates. The average internal stresses in Cu film and Ni film were measured in situ by cantilever beam test. The values of experimental internal stresses were compared with theoretical internal stresses. The results showed that the internal stresses of Cu film and Ni film decreased with the increase of the film thickness. The reduced gradient was faster. The values of experimental and theoretical internal stresses had the same variation trend with film thickness and the same characteristics (tensile stress). Theoretical calculation model of internal stress was of accuracy. The internal stress for the same substrate was in relation to the film material.

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