Material Development Challenges in High Density Pakaging of Advanced VLSI Memory Devices

1989 ◽  
Vol 167 ◽  
Author(s):  
Steven D. Prough ◽  
D. Elaine Pope
Keyword(s):  
High Density ◽  
Memory Storage ◽  
Semiconductor Memory ◽  
Surface Protection ◽  
Package Design ◽  
Material Development ◽  
Trade Offs ◽  
Die Surface ◽  
New Generation ◽  
High Density Packaging

AbstractAdvances in semiconductor memory storage technology are making possible the development of high density memory cards for hand held and portable product applications. This in turn is driving development of ever denser, ultra-thin component packages. Both materials and package design must be more robust in order for next generation packages to withstand surface mount reflow soldering stresses. Trade-offs among ercapsulant properties may be possible in view of new interconnect, die surface protection and leadframe design technologies which are being adopted for high density packaging. Materials and packaging engineers are challenged to capitalize on opportunities offered by these changes in order to optimize strength and moisture resistarnce in developing encapsulating materials for the new generation of packages.

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

2005 ◽  
Vol 297-300 ◽  
pp. 837-843
Author(s):  
Takashi Hasegawa ◽  
Masumi Saka
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
High Density ◽  
Solder Bumps ◽  
Multi Phase ◽  
High Density Packaging

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

Development of New Single and High-Density Heat-Flux Gauges for Unsteady Heat Transfer Measurements for a Rotating Transonic Turbine

2020 ◽  
Author(s):  
Richard Celestina ◽  
Spencer Sperling ◽  
Louis Christensen ◽  
Randall Mathison ◽  
Hakan Aksoy ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Pressure ◽  
Pressure Ratio ◽  
High Density ◽  
Secondary Flows ◽  
Single Stage ◽  
High Pressure Turbine ◽  
Transonic Turbine ◽  
New Generation

Abstract This paper presents the development and implementation of a new generation of double-sided heat-flux gauges at The Ohio State University Gas Turbine Laboratory (GTL) along with heat transfer measurements for film-cooled airfoils in a single-stage high-pressure transonic turbine operating at design corrected conditions. Double-sided heat flux gauges are a critical part of turbine cooling studies, and the new generation improves upon the durability and stability of previous designs while also introducing high-density layouts that provide better spatial resolution. These new customizable high-density double-sided heat flux gauges allow for multiple heat transfer measurements in a small geometric area such as immediately downstream of a row of cooling holes on an airfoil. Two high-density designs are utilized: Type A consists of 9 gauges laid out within a 5 mm by 2.6 mm (0.20 inch by 0.10 inch) area on the pressure surface of an airfoil, and Type B consists of 7 gauges located at points of predicted interest on the suction surface. Both individual and high-density heat flux gauges are installed on the blades of a transonic turbine experiment for the second build of the High-Pressure Turbine Innovative Cooling program (HPTIC2). Run in a short duration facility, the single-stage high-pressure turbine operated at design-corrected conditions (matching corrected speed, flow function, and pressure ratio) with forward and aft purge flow and film-cooled blades. Gauges are placed at repeated locations across different cooling schemes in a rainbow rotor configuration. Airfoil film-cooling schemes include round, fan, and advanced shaped cooling holes in addition to uncooled airfoils. Both the pressure and suction surfaces of the airfoils are instrumented at multiple wetted distance locations and percent spans from roughly 10% to 90%. Results from these tests are presented as both time-average values and time-accurate ensemble averages in order to capture unsteady motion and heat transfer distribution created by strong secondary flows and cooling flows.

Flex-DIMM – A New High Density Module Form Factor

2015 ◽  
Vol 2015 (1) ◽  
pp. 000806-000809
Author(s):  
James E. Clayton
Keyword(s):  
Form Factor ◽  
Cross Section ◽  
Lower Layer ◽  
Signal Integrity ◽  
High Density ◽  
Thermal Dissipation ◽  
Ideal Solution ◽  
Memory Module ◽  
The Past ◽  
New Generation

The Dual In-Line Memory Module (DIMM) has remained relatively unchanged for the past two decades, with exception of an increase in PCB size, I/O pads and layer count. A new generation called Flex-DIMM is introduced by replacing the rigid-PCB substrate with a thin, bifurcated, flexible circuit that enables several improvements; including a thinner cross-section, better signal integrity with lower layer count, better thermal dissipation and ability to be directly mated to the surface of a motherboard. Originally intended for RDIMM applications, the new module may be an ideal solution for clustered microservers.

Photosensitive Dielectric Film Developed Using a Polymer Blend

1992 ◽  
Vol 264 ◽  
Author(s):  
M. Tani ◽  
S. Miyahara ◽  
E. Horikoshi ◽  
K. Natori ◽  
T. Sato
Keyword(s):  
Polymer Blend ◽  
Dielectric Film ◽  
High Density ◽  
Passivation Layer ◽  
New Materials ◽  
Photosensitive Film ◽  
High Density Packaging

AbstractWe developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

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