New Photosensitive Polyimide (SIM2000XL-RTS) for Packaging Applications

1989 ◽  
Vol 167 ◽  
Author(s):  
S. Jeng ◽  
M. Xu ◽  
P. L. Liu ◽  
H. S. Kwok ◽  
C. J. Lee
Keyword(s):  
Thermal Stability ◽  
Dielectric Breakdown ◽  
Dielectric Materials ◽  
Breakdown Field ◽  
Process Conditions ◽  
Laser Exposure ◽  
Multi Level ◽  
Uv Lamp ◽  
Breakdown Field Strength ◽  
High Density Packaging

AbstractPolyimides are finding increased use as dielectric materials in multi-level metallization technology, which is the key to high-density packaging applications for microelectronics.Newly developed photosensitive polyimidesiloxane (SIM2000XL-RTS) has been evaluated in terms of thermal stability, photosensitivity and lithography as well as dielectric breakdown properties. The sensitivity to N2 laser exposure has been measured under optimized process conditions. We also find that SIM2000XL-RTS can be processed up to 350°C without significant decomposition. Micron-scale contact images can be successfully patterned by both N2 laser and conventional UV lamp exposure. The dielectrical breakdown field strength of SIM2000XL-RTS is about 4 MV/cm by sandwich measurements.

scholarly journals Characteristics and Properties of TiO2/EP-PU Composite

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Chen Yufei ◽  
Li Zhichao ◽  
Tan Junyan ◽  
Zhang Qingyu ◽  
Han Yang
Keyword(s):  
Mechanical Properties ◽  
Coupling Agent ◽  
Breakdown Strength ◽  
Dielectric Materials ◽  
Decomposition Temperature ◽  
Dielectric Spectrum ◽  
Breakdown Field ◽  
Improve Performance ◽  
Maximum Value ◽  
Breakdown Field Strength

Polymer matrix of EP-PU was prepared by epoxy resin which was polyurethane toughened, and TCA201 coupling agent was used to modify nano-TiO2, and TiO2/EP-PU composite was synthesized using EP, PU, and TCA201-TiO2. The results of SEM and TEM showed that the surface of TiO2was coated with TCA201 coupling agent through the bonding between the hydroxyl of nano-TiO2particle and coupling agent molecules, the interaction would be beneficial to improve compatibility of inorganic and organic phases, and TCA201-TiO2would disperse evenly in composite and improve performance of composite materials. The mechanical properties, thermal stability, dielectric properties, and breakdown strength of composites were investigated by electronic tensile machine, TGA, dielectric spectrum, and CS2674C type voltage tester. The results indicated that appropriate amount of TCA201-TiO2could improve mechanical properties, the shear strength of 3 wt%-TiO2/EP-PU reached the maximum value at 27.14 MPa, its thermal decomposition temperature was 397.82°C, enhanced 17.48°C more than that of EP-PU matrix, and its dielectric constant(ε)and dielectric loss (tan⁡δ) showed 4.27 and 0.02, respectively. Its breakdown field strength was 14 kV/mm. Its performance met the requirement of dielectric materials.

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

scholarly journals Effect of Acetylated SEBS/PP for Potential HVDC Cable Insulation

Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1596
Author(s):  
Peng Zhang ◽  
Yongqi Zhang ◽  
Xuan Wang ◽  
Jiaming Yang ◽  
Wenbin Han
Keyword(s):  
Mechanical Properties ◽  
Field Strength ◽  
Thermoplastic Elastomer ◽  
High Energy ◽  
Thermoplastic Elastomers ◽  
Electrical Strength ◽  
Voltage Stabilizer ◽  
Breakdown Field ◽  
Cable Insulation ◽  
Breakdown Field Strength

Blending thermoplastic elastomers into polypropylene (PP) can make it have great potential for high-voltage direct current (HVDC) cable insulation by improving its toughness. However, when a large amount of thermoplastic elastomer is blended, the electrical strength of PP will be decreased consequently, which cannot meet the electrical requirements of HVDC cables. To solve this problem, in this paper, the inherent structure of thermoplastic elastomer SEBS was used to construct acetophenone structural units on its benzene ring through Friedel–Crafts acylation, making it a voltage stabilizer that can enhance the electrical strength of the polymer. The DC electrical insulation properties and mechanical properties of acetylated SEBS (Ac-SEBS)/PP were investigated in this paper. The results showed that by doping 30% Ac-SEBS into PP, the acetophenone structural unit on Ac-SEBS remarkably increased the DC breakdown field strength of SEBS/PP by absorbing high-energy electrons. When the degree of acetylation reached 4.6%, the DC breakdown field strength of Ac-SEBS/ PP increased by 22.4% and was a little higher than that of PP. Ac-SEBS, with high electron affinity, is also able to reduce carrier mobility through electron capture, resulting in lower conductivity currents in SEBS/PP and suppressing space charge accumulation to a certain extent, which enhances the insulation properties. Besides, the highly flexible Ac-SEBS can maintain the toughening effect of SEBS, resulting in a remarkable increase in the tensile strength and elongation at the break of PP. Therefore, Ac-SEBS/PP blends possess excellent insulation properties and mechanical properties simultaneously, which are promising as insulation materials for HVDC cables.

Experimental observations of the thermal stability of high-k gate dielectric materials on silicon

2002 ◽  
Vol 303 (1) ◽  
pp. 54-63 ◽  
Author(s):  
P.S. Lysaght ◽  
P.J. Chen ◽  
R. Bergmann ◽  
T. Messina ◽  
R.W. Murto ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Gate Dielectric ◽  
Dielectric Materials ◽  
High K ◽  
Thermal Stability Of ◽  
High K Gate Dielectric

scholarly journals Enhanced Electrical Properties of Atomic Layer Deposited LaxAlyO Thin Films with Stress Relieved Preoxide Pretreatment

Materials ◽  
2018 ◽  
Vol 11 (9) ◽  
pp. 1601
Author(s):  
Xing Wang ◽  
Hongxia Liu ◽  
Lu Zhao ◽  
Yongte Wang
Keyword(s):  
Electrical Properties ◽  
Atomic Layer ◽  
Breakdown Field ◽  
Gate Leakage Current ◽  
Interface Engineering ◽  
Order Of Magnitude ◽  
Mis Capacitor ◽  
The Impact ◽  
Breakdown Field Strength ◽  
Gate Leakage Current Density

The impact of stress relieved preoxide (SRPO) interface engineering on the physical and electrical properties of LaxAlyO films was investigated. It was proved that the SRPO pretreatment has little influence on the surface morphology of LaxAlyO films and the chemical bond composition of LaxAlyO/Si interface. However, the SRPO pretreated MIS capacitor displayed obvious improvement in decreasing the amount of trapped oxide charges and interfacial traps. As a result, a reduction of more than one order of magnitude in the gate leakage current density was obtained. The breakdown field strength and TDDB reliability of the LaxAlyO film treated with SRPO were also enhanced.

scholarly journals Preparation, Characterization and Performance Properties of Polydodecylmethylsilsesquioxane Nanoparticles

Coatings ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1045
Author(s):  
Fuquan Deng ◽  
Hua Jin ◽  
Wei Xu
Keyword(s):  
Thermal Stability ◽  
Particle Size ◽  
Electron Microscope ◽  
Contact Angles ◽  
Process Conditions ◽  
Average Particle ◽  
Gravimetric Analysis ◽  
Laser Scattering ◽  
Excellent Thermal Stability ◽  
X Ray

A series of polydodecylmethylsilsesquioxane (PDMSQ) nanocomposite latexes were prepared via emulsion polymerization of methyltriethoxysilane (MTES) and dodecyltrimethoxysilane (DTMS) and sodium hydroxide as the catalyst, and sodium dodecyl benzene sulfonate/Tween 80 as the mixed emulsifiers. Effects of the emulsifier doses, the reaction temperature, the catalyst concentration and the oil/water ratio on the particle size and distribution of the PDMSQ nanoparticles were discussed. Particle size and micromorphology, structure, thermal stability, crystallinity and hydrophobicity of PDMSQ nanoparticles (PDMSQ NPs) were investigated by dynamic laser scattering (DLS), Fourier transform infrared spectroscopy (FTIR), silicon-nuclear magnetic resonance (28Si-NMR), X-ray photoelectron spectroscope (XPS), scanning electron microscope (SEM), transmission electron microscope (TEM), atomic force microscope (AFM), thermo gravimetric analysis (TGA), X-ray diffraction (XRD) and contact angle tester. Results showed that a series of PDMSQ NPs could be obtained with an average particle size of less than 80 nm and narrow distribution as well as spherical structure under the optimal process conditions. PDMSQ NPs exhibited excellent thermal stability and were mainly amorphous but also contained some crystal structures. Importantly, the static water contact angles (WCAs) on its latex films were larger than 150° and the WCAs hysteresis were less than 10°, thus those PDMSQ nanocomposite latexes show potential in the field of superhydrophobic coatings.

Sign in / Sign up

Export Citation Format

Share Document