Twinning Structure of {113} Defects in High-Dose Oxygen Implanted Silicon-on-Insulator Material.

1989 ◽  
Vol 163 ◽  
Author(s):  
S. Visitserngtrakul ◽  
J. Barry ◽  
S. Krause
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Oxide Layer ◽  
High Resolution Electron Microscopy ◽  
Silicon On Insulator ◽  
High Dose ◽  
Diamond Structure ◽  
Bulk Silicon ◽  
Coherent Interface ◽  
Resolution Electron

AbstractConventional and high resolution electron microscopy (HREM) were used to study the structure of the {113} defects in high-dose oxygen implanted silicon. The defects are created with a density of 1011 cm-2 below the buried oxide layer in the substrate region. The {113} defects are similar to the ribbon-like defects in bulk silicon. Our HREM observations show that two crystalline phases are present in the defect. Portions of the defects exhibit the original cubic diamond structure which is twinned across {115} planes. The atomic model shows that the {115} interface is a coherent interface with alternating five- and seven-membered rings and no dangling bonds.

Structure of twinned {113} defects in high-dose oxygen implanted silicon-on-insulator material

1991 ◽  
Vol 6 (4) ◽  
pp. 792-795 ◽  
Author(s):  
Supapan Visitserngtrakul ◽  
Stephen J. Krause ◽  
John C. Barry
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Oxide Layer ◽  
High Resolution Electron Microscopy ◽  
Silicon On Insulator ◽  
High Dose ◽  
Diamond Structure ◽  
Bulk Silicon ◽  
Coherent Interface ◽  
Resolution Electron

Conventional and high resolution electron microscopy (HREM) were used to study the structure of {113} defects in high-dose oxygen implanted silicon. The defects are created with a density of 1011 cm−2 below the buried oxide layer in the substrate region. The HREM images of the {113} defects are similar to the ribbon-like defects in bulk silicon. It is proposed that there is a third possible structure of the defects, in addition to coesite and/or hexagonal structures. Portions of some defects exhibit the original cubic diamond structure which is twinned across {115} planes. The atomic model shows that the {115} interface is a coherent interface with alternating five- and seven-membered rings and no dangling bonds.

High Resolution Electron Microscopy of Defects in High-Dose Oxygen Implanted Silicon-On-Insulator Material

1990 ◽  
Vol 183 ◽  
Author(s):  
S. Visitserngtrakul ◽  
C. O. Jung ◽  
B. F. Cordts ◽  
P. Roitman ◽  
S. J. Krause
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Oxide Layer ◽  
Stacking Faults ◽  
High Resolution Electron Microscopy ◽  
Silicon On Insulator ◽  
High Dose ◽  
Wafer Temperature ◽  
Buried Oxide ◽  
Resolution Electron

AbstractHigh resolution electron microscopy (HREM) has been used to study the atomic arrangement of defects formed during high-dose oxygen implantation of silicon-on-insulator material. The effect of implantation parameters of wafer temperature, dose, and current density were investigated. Wafer temperature had the largest effect on the type and character of the defects. Above the buried oxide layer in the top silicon layer, HREM revealed that microtwins and stacking faults were created during implantation from 350–450°C. From 450–550°C, stacking faults were longer and microtwinning was reduced. From 550–700°C, a new type of defect was observed which had lengths of 40 to 140 nm and consisted of several discontinuous stacking faults which were randomly spaced and separated by two to eight atomic layers. We have referred to them as “multiply faulted defects” (MFDs). Beneath the buried oxide layer in the substrate region, the defects observed included stacking faults and ( 113 ) defects. The results indicated that some parts of the ( 1131 defects can assume a cubic diamond structure created through a twin operation across (115) planes. Details of the structure and formation mechanisms of MFDs and other defects will be discussed.

Ultra-high resolution electron microscopy of defects in the CVD diamond structure

1998 ◽  
Vol 7 (2-5) ◽  
pp. 222-227 ◽  
Author(s):  
S. Delclos ◽  
D. Dorignac ◽  
F. Phillipp ◽  
F. Silva ◽  
A. Gicquel
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
High Resolution Electron Microscopy ◽  
Cvd Diamond ◽  
Diamond Structure ◽  
Resolution Electron

Comparative Oxidation Studies of Polycrystalline HP and CVD Silicon Carbides by TEM

1991 ◽  
Vol 49 ◽  
pp. 938-939
Author(s):  
J.S. Bow ◽  
M.J. Kim ◽  
R.W. Carpenter
Keyword(s):  
Electron Microscopy ◽  
High Temperature ◽  
Reaction Time ◽  
High Resolution ◽  
Oxide Layer ◽  
Crystalline Phase ◽  
High Resolution Electron Microscopy ◽  
Substrate Type ◽  
Resolution Electron ◽  
Silicon Carbides

The excellent oxidation resistance of SiC at high temperature results from formation of a protective SiO2 layer in a strongly oxidizing environment. The oxide layer is often initially amorphous, may transform to a crystalline phase for extended reaction time, especially crystobalite above 1200°C. Our objective is use of high resolution electron microscopy methods to determine the oxide layer microstructure dependence on SiC substrate type, and especially to investigate existence of an intermediate Si-O-C phase between the oxide layer and substrate.

Defect formation in oxygen-multiply implanted silicon-on-insulator material

1995 ◽  
Vol 53 ◽  
pp. 448-449
Author(s):  
J.C. Park ◽  
J.D. Lee ◽  
S.J. Krause
Keyword(s):  
Electron Microscopy ◽  
Defect Formation ◽  
High Resolution Electron Microscopy ◽  
Dark Field ◽  
Silicon On Insulator ◽  
High Dose ◽  
Plan View ◽  
Weak Beam ◽  
Resolution Electron ◽  
Reduced Power Consumption

High dose oxygen implantation (SIMOX) has been a successful fabrication technology of silicon-on-insulator (SOI) material for CMOS circuits with reduced power consumption and higher operating speed. However, high density (~108 cm-2) of the through-thickness defects (TTD) in the top Si layer of SIMOX is one of the most serious problems. Hill et al. reported multiple implant/anneal method to remarkably reduce defect densities to <104 cm-2. In the multiple implant/anneal material, however, ~106 cm2 of the final dominant defects, including stacking fault pyramids (SFP) and the precipitate-dislocation complexes (PDC), still remained after high temperature annealing. In this work, the microstructures and formation mechanism of the final defects were studied by various TEM techniques.Silicon (100) wafers were sequentially triple implanted to doses of 6/6/6×l017 at 200kev and 620°C. After each implantation the wafers were held at 1000°C for 2 hours and annealed at 1325°C for 4 hours in argon ambient plus 5% oxygen. Cross-section (XTEM) and plan-view (PTEM) transmission electron microscopy specimens were examined by using a weak beam dark field (WBDF) and high resolution electron microscopy (HREM) techniques in JEM 2000FX and Topcon 002B operating at 200kev.

Multiply faulted defects in high-current oxygen-implanted silicon-on-insulator

1989 ◽  
Vol 47 ◽  
pp. 606-607
Author(s):  
S. Visitserngtrakul
Keyword(s):  
Electron Microscopy ◽  
High Resolution Electron Microscopy ◽  
Beam Current ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Current ◽  
Implantation Time ◽  
Resolution Electron ◽  
Beam Currents ◽  
Very High

High-dose oxygen implantation into silicon, SIMOX (separation by implantation of oxygen), is a leading technique for producing silicon-on-insulator (SOI) material. Most studies have examined SIMOX prepared with a traditional implanter, which has beam currents of 100 to 400 μA. Since the formation of SIMOX requires a very high dose of oxygen, typically one hundred times larger than the standard dopant implant doses, the process takes many hours. Recently, a high-current implanter has been developed for SIMOX fabrication, which produces a 40 mA beam current. However, the higher current density has not only shortened the implantation time, but also produced features not routinely observed in samples implanted at much lower currents. The study reported here used conventional transmission and high resolution electron microscopy (CTEM,HREM) to characterize microstructure and defects in SIMOX implanted at high currents.

Crystallization of InSb Phase Near the Bonding Interface of Silicon-on-Insulator Structure

2007 ◽  
Vol 131-133 ◽  
pp. 137-142
Author(s):  
Ida E. Tyschenko ◽  
A.G. Cherkov ◽  
M. Voelskow ◽  
V.P. Popov
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Annealing Temperature ◽  
Rutherford Backscattering Spectrometry ◽  
High Resolution Electron Microscopy ◽  
Sio2 Layer ◽  
Silicon On Insulator ◽  
Bonding Interface ◽  
Experimental Results ◽  
Resolution Electron

The behavior of Sb and In atoms embedded into silicon-on-insulator structure (SOI) near the bonding interface was investigated as a function of annealing temperature. Two kinds of the ionimplanted SOI structures were prepared. First kind of the structures contained the buried SiO2 layer implanted with In+ and Sb+ ions near the top Si/SiO2 interface. In second kind, the ion-implanted regions were placed on each side of the bonding interface: Sb+ ions were implanted into Si film; In+ ions were implanted into SiO2 layer. Rutherford backscattering spectrometry (RBS) and crosssectional high-resolution electron microscopy (XTEM) were employed to study the properties of the prepared structures. The formation of InSb nanocrystals was observed within the SiO2 bulk from first kind of the SOI structures as annealing temperature increased to 1100o C. In the case of the double side implanted SOI structures, an increase in annealing temperature to 1100o C was accompanied by the up-hill diffusion of In atoms from the SiO2 bulk toward the bonding interface and by the endotaxial growth of InSb nanocrystals on the top Si/SiO2 interface. It was concluded from the experimental results that Sb atoms were the nucleation centers of InSb phase.

Structural analysis of the surface-layer protein of spirillum serpens by high-resolution electron microscopy

1983 ◽  
Vol 41 ◽  
pp. 738-739
Author(s):  
W. H. Wu ◽  
R. M. Glaeser
Keyword(s):  
Electron Microscopy ◽  
Surface Layer ◽  
Structural Analysis ◽  
High Resolution ◽  
Low Dose ◽  
High Resolution Electron Microscopy ◽  
Optical Diffraction ◽  
Surface Layer Protein ◽  
Morphological Unit ◽  
Resolution Electron

Spirillum serpens possesses a surface layer protein which exhibits a regular hexagonal packing of the morphological subunits. A morphological model of the structure of the protein has been proposed at a resolution of about 25 Å, in which the morphological unit might be described as having the appearance of a flared-out, hollow cylinder with six ÅspokesÅ at the flared end. In order to understand the detailed association of the macromolecules, it is necessary to do a high resolution structural analysis. Large, single layered arrays of the surface layer protein have been obtained for this purpose by means of extensive heating in high CaCl2, a procedure derived from that of Buckmire and Murray. Low dose, low temperature electron microscopy has been applied to the large arrays.As a first step, the samples were negatively stained with neutralized phosphotungstic acid, and the specimens were imaged at 40,000 magnification by use of a high resolution cold stage on a JE0L 100B. Low dose images were recorded with exposures of 7-9 electrons/Å2. The micrographs obtained (Fig. 1) were examined by use of optical diffraction (Fig. 2) to tell what areas were especially well ordered.

Electron microscopy of rabbit FC crystals

1983 ◽  
Vol 41 ◽  
pp. 730-731
Author(s):  
Robert A. Grant ◽  
Laura L. Degn ◽  
Wah Chiu ◽  
John Robinson
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
High Resolution Electron Microscopy ◽  
Molecular Replacement ◽  
X Ray ◽  
X Ray Crystallography ◽  
Resolution Electron ◽  
Replacement Technique ◽  
Hydrated Crystal ◽  
Molecular Structure Analysis

Proteolytic digestion of the immunoglobulin IgG with papain cleaves the molecule into an antigen binding fragment, Fab, and a compliment binding fragment, Fc. Structures of intact immunoglobulin, Fab and Fc from various sources have been solved by X-ray crystallography. Rabbit Fc can be crystallized as thin platelets suitable for high resolution electron microscopy. The structure of rabbit Fc can be expected to be similar to the known structure of human Fc, making it an ideal specimen for comparing the X-ray and electron crystallographic techniques and for the application of the molecular replacement technique to electron crystallography. Thin protein crystals embedded in ice diffract to high resolution. A low resolution image of a frozen, hydrated crystal can be expected to have a better contrast than a glucose embedded crystal due to the larger density difference between protein and ice compared to protein and glucose. For these reasons we are using an ice embedding technique to prepare the rabbit Fc crystals for molecular structure analysis by electron microscopy.

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