Some Observations on the Electrical Characterization of the Heteroepitaxially Grown Cubic SiC

1989 ◽  
Vol 162 ◽  
Author(s):  
B. Molnar ◽  
G. Kelner
Keyword(s):  
Activation Energy ◽  
Secondary Ion Mass Spectrometry ◽  
Nitrogen Concentration ◽  
Electrical Characterization ◽  
Impurity Band ◽  
Thin Layers ◽  
Si Substrates ◽  
Nitrogen Concentrations ◽  
Band Conduction

ABSTRACTThis paper re-examines the electrical characterization of thin layers of cubic SiC, grown on (100) Si substrates. The resistivity and Hall coefficient for undoped SiC layers were measured between 10 K and 500 K. Electron spin resonance (ESR) and secondary ion mass spectrometry (SIMS) were used to identify and determine the nitrogen concentrations, which were higher than 1017/cm3. In all the samples examined the Hall measurements indicated impurity band conduction. Therefore, the temperature dependence of the resistivity has been used to derive an activation energy el. The value of el found to be in the range of 0.032–0.025 eV. The observed decrease in activation energy has been correlated with an increase in nitrogen concentration. The presence of substantial nitrogen leads to impurity band conduction and it is the most likely reason for the conflicting values reported for the dominant donor ionization energy by Hall and PL measurements.

Observations on the electrical characterization of the heteroepitaxially grown cubic SiC

1992 ◽  
Vol 7 (9) ◽  
pp. 2465-2477 ◽  
Author(s):  
B. Molnar
Keyword(s):  
Activation Energy ◽  
Nitrogen Concentration ◽  
Electrical Characterization ◽  
Impurity Band ◽  
Thin Layers ◽  
Si Substrates ◽  
Clear Sign ◽  
Intermediate Concentration ◽  
Band Conduction

This paper deals with the electrical characterization of thin layers of cubic SiC, grown on (100) Si substrates. The resistivity and Hall coefficient for undoped SiC layers were measured between 10 K and 500 K. The influence of inhomogeneities on the electrical properties of the as-grown films has been established. The Hall data show a clear sign of a transition to impurity band conduction. The donor concentrations studied are in the “intermediate” range. The donor activation energy has been shown to decrease with increasing nitrogen concentration. The nitrogen concentration was measured by SIMS. The variation in nitrogen concentration is also seen in changes in the shape of the ESR spectrum. The presence of nitrogen in the intermediate concentration range is the most likely reason for the conflicting values reported for the donor ionization energy as measured by Hall and PL measurements.

Process and Simulation of TiSi2/n+/p Silicon Shallow Junctions

1991 ◽  
Vol 235 ◽  
Author(s):  
Ying Wu ◽  
W. Savin ◽  
T. Fink ◽  
N. M. Ravindra ◽  
R. T. Lareau ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Furnace Annealing ◽  
Si Substrates ◽  
Conventional Furnace ◽  
Mass Spec ◽  
Current Voltage ◽  
Shallow Junctions ◽  
Current Voltage Characteristics ◽  
Secondary Ion

ABSTRACTExperimental analysis and simulation of the formation and electrical characterization of TiSi2/+/p-Si shallow junctions are presented here. The formation of shallow n+-p junction, by ion implantation of As through Ti films evaporated on p-Si substrates followed by Rapid Thermal Annealing (RTA) and conventional furnace annealing has been performed in these experiments. Structural techniques such as Secondary Ion Mass Spec-troscopy (SIMS) and Rutherford Backscattering (RBS) experiments have been employed to characterize these devices. RUMP simulations were used to analyze and interpret the RBS data. Current-voltage characteristics have been simulated using PISCES simulator.

scholarly journals Synthesis and electrical characterization of Ca2Nd4Ti6O20 ceramics

2016 ◽  
Vol 34 (1) ◽  
pp. 164-168
Author(s):  
Raz Muhammad ◽  
Muhammad Uzair ◽  
M. Javid Iqbal ◽  
M. Jawad Khan ◽  
Yaseen Iqbal ◽  
...  
Keyword(s):  
Activation Energy ◽  
Dielectric Constant ◽  
Room Temperature ◽  
Sol Gel ◽  
Electrical Characterization ◽  
Sintered Sample ◽  
First Time ◽  
Alkoxide Precursors ◽  
Room Temperature Dielectric Constant

AbstractCa2Nd4Ti6O20, a layered perov skite structured material was synthesized via a chemical (citrate sol-gel) route for the first time using nitrates and alkoxide precursors. Phase analysis of a sample sintered at 1625 °C revealed the formation of an orthorhombic (Pbn21) symmetry. The microstructure of the sample after sintering comprised rod-shaped grains of a size of 1.5 to 6.5µm. The room temperature dielectric constant of the sintered sample was 38 at 100 kHz. The remnant polarization (Pr) and the coercive field (Ec) were about 400 μC/cm2 and 8.4 kV/cm, respectively. Impedance spectroscopy revealed that the capacitance (13.7 pF) and activation energy (1.39 eV) of the grain boundary was greater than the capacitance (5.7 pF) and activation energy (1.13 eV) of the grain.

Fabrication and Electrical Characterization of Heterojunction Mn-Doped GaN Nanowire Diodes on n-Si Substrates (GaN:Mn NW/n-Si)

2009 ◽  
Vol 38 (4) ◽  
pp. 505-510 ◽  
Author(s):  
Tae-Hong Kim ◽  
Chan-Oh Jang ◽  
Han-Kyu Seong ◽  
Heon-Jin Choi ◽  
Sang-Kwon Lee
Keyword(s):  
Electrical Characterization ◽  
Si Substrates ◽  
Gan Nanowire ◽  
Mn Doped

The Influence of Nitrogen on Dislocation Locking in Float-Zone Silicon

2005 ◽  
Vol 108-109 ◽  
pp. 139-144 ◽  
Author(s):  
John D. Murphy ◽  
A. Giannattasio ◽  
Charles R. Alpass ◽  
Semih Senkader ◽  
Robert J. Falster ◽  
...  
Keyword(s):  
Activation Energy ◽  
Annealing Time ◽  
Nitrogen Concentration ◽  
Dislocation Core ◽  
Float Zone ◽  
A Value ◽  
Rate Of Increase ◽  
Activation Energy For Diffusion ◽  
Nitrogen Concentrations ◽  
Locking Effect

Dislocation locking by nitrogen impurities has been investigated in float-zone silicon with nitrogen concentrations of 2.2 x 1015cm-3 and 3 x 1014cm-3. The stress required to unlock dislocations pinned by nitrogen impurities was measured as a function of annealing time (0 to 2500 hours) and temperature (550 to 830°C). For all conditions investigated the locking effect was found to increase linearly with annealing time before saturating. It is assumed that the rate of increase of unlocking stress with annealing time is a measure of transport of nitrogen to the dislocation core. This rate of increase was found to depend linearly on nitrogen concentration, which is consistent with transport by a dimeric species, whose activation energy for diffusion is approximately 1.4eV. The saturation unlocking stress has been found to be dependent on the nitrogen concentration. Additionally, the temperature dependence of the stress required to move dislocations immobilised by nitrogen impurities has been studied. By assuming a value for the binding energy of the nitrogen to the dislocation, the density of the locking species at the dislocation core has been calculated.

scholarly journals Structural Characterization of Movpe Grown Algan/Gan for Hemt Formation

2018 ◽  
Vol 57 (1) ◽  
pp. 72-81 ◽  
Author(s):  
V.N. Popok ◽  
T.S. Aunsborg ◽  
R.H. Godiksen ◽  
P.K. Kristensen ◽  
R.R. Juluri ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Charge Carrier Concentration ◽  
Electrical Performance ◽  
Clear Understanding ◽  
Si Substrates ◽  
Transfer Of Technology ◽  
Dislocation Densities ◽  
Unusual Phenomenon ◽  
Aln Buffer

Abstract Results on structural, compositional, optical and electrical characterization of MOVPE grown AlGaN/GaN heterostructures with focus on understanding how the AlN buffer synthesis affects the top films are reported. The study demonstrates very good correlation between different methods providing a platform for reliable estimation of crystalline quality of the AlGaN/GaN structures and related to that electrical performance which is found to be significantly affected by threading dislocations (TD): higher TD density reduces the electron mobility while the charge carrier concentration is found to be largely unchanged. The attempt to vary the ammonia flow during the AlN synthesis is found not to affect the film composition and dislocation densities in the following heterostructures. An unusual phenomenon of considerable diffusion of Ga from the GaN film into the AlN buffer is found in all samples under the study. The obtained results are an important step in optimization of AlGaN/GaN growth towards the formation of good quality HEMT structures on sapphire and transfer of technology to Si substrates by providing clear understanding of the role of synthesis parameter on structure and composition of the films.

The dc Electrical Characterization of Hg/δ-GaN/n-GaAs Devices, with Different Thicknesses of the GaN Thin Layers

2011 ◽  
Vol 9 (6) ◽  
pp. 2211-2214 ◽  
Author(s):  
N. Zougagh ◽  
Z. Benamara ◽  
H. Mazari ◽  
N. Benseddik ◽  
K. Ameur ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Thin Layers ◽  
Gaas Devices

Electrically Active Deep Levels in ScN

2001 ◽  
Vol 699 ◽  
Author(s):  
Florentina Perjeru ◽  
Xuewen Bai ◽  
Martin E. Kordesch
Keyword(s):  
Activation Energy ◽  
Vapor Deposition ◽  
Deep Level Transient Spectroscopy ◽  
Physical Vapor Deposition ◽  
Deep Level ◽  
Reactive Sputtering ◽  
Deep Levels ◽  
Si Substrates ◽  
Transient Spectroscopy

AbstractWe report the electronic characterization of n-ScN in ScN-Si heterojunctions using Deep Level Transient Spectroscopy of electrically active deep levels. ScN material was grown by plasma assisted physical vapor deposition and by reactive sputtering on commercial p+ Si substrates. Deep level transient spectroscopy of the junction grown by plasma assisted physical vapor deposition shows the presence of an electronic trap with activation energy EC-ET= 0.51 eV. The trap has a higher concentration (1.2–1.6 1013cm−3) closer to the ScN/Si interface. Junctions grown by sputtering also have an electronic trap, situated at about EC-ET= 0.90 eV.

Electrical characterization of low thermal budget gate oxides on Si/Si0.8Ge0.2/Si substrates

2002 ◽  
Vol 46 (7) ◽  
pp. 991-995 ◽  
Author(s):  
Alok Sareen ◽  
Ann-Chatrin Lindgren ◽  
Per Lundgren ◽  
Stefan Bengtsson
Keyword(s):  
Electrical Characterization ◽  
Gate Oxides ◽  
Thermal Budget ◽  
Si Substrates ◽  
Low Thermal Budget
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